The spin-on carbon market is projected to grow from USD 0.22 billion in 2026 to USD 0.81 billion by 2032 at a compound annual growth rate (CAGR) of 24.1% during this period. This growth is driven by the increasing adoption of extreme ultraviolet (EUV) lithography and complex deep ultraviolet (DUV) multi-patterning techniques. Spin-on carbon (SOC) enhances pattern transfer performance, minimizes line collapse, and improves yield in high-volume semiconductor manufacturing. SOC is essential for maintaining process reliability in increasingly scaled-down nodes, as it provides uniform film thickness and superior mechanical properties.
Additionally, foundries are at the forefront of implementing EUV lithography and complex DUV multi-patterning, where spin-on carbon is essential for improving pattern transfer fidelity, reducing line collapse, and enhancing yield at advanced nodes. The ongoing migration to smaller nodes, such as 5 nm and 3 nm, further increases spin-on carbon usage per wafer due to tighter critical dimensions and additional processing steps.
Moreover, foundries are enhancing their advanced packaging capabilities, including Chip-on-Wafer-on-Substrate (CoWoS), Integrated Fan-Out (InFO), and 3D integration. These processes require spin-on carbon for planarization and interlayer applications. The ongoing capacity expansions across Asia Pacific, North America, and Europe are expected to boost long-term demand. As a result, foundries are projected to become the largest consumers of spin-on carbon by 2030.
Furthermore, the rising demand for high-performance computing, AI accelerators, and data center processors drives the adoption of advanced packaging solutions to overcome scaling limitations at the transistor level. Spin-on carbon materials are crucial for managing fine-pitch interconnects and reducing defects during multilayer processing. The growing trend of outsourcing packaging to outsourced semiconductor assembly and test (OSAT) companies also supports market expansion, as these vendors increasingly utilize spin-on carbon to enhance yield and throughput. Additionally, advancements in packaging technologies for automotive and 5G applications, which require high reliability and thermal stability, further promote the adoption of spin-on carbon materials.
Furthermore, North America serves as a key center for innovation in extreme ultraviolet (EUV) lithography, artificial intelligence (AI)-focused processors, and high-performance computing - all of which require high-performance spin-on carbon formulations to achieve optimal yield and pattern fidelity at scaled nodes. Additionally, the rapid advancement of packaging technologies, including 2.5D/3D integration and chiplet-based architectures, is leading to an increased consumption of spin-on carbon per wafer and package. Strong collaboration among material suppliers, equipment manufacturers, and semiconductor producers is facilitating a quick qualification and adoption of next-generation spin-on carbon materials. To summarize, the expansion of fabrication capacity, technological leadership, and the rising demand for advanced semiconductor devices position North America as the fastest-growing regional market for spin-on carbon during the forecast period.
Extensive primary interviews were conducted with key industry experts in the spin-on carbon sector to determine and verify the market size for various segments and subsegments, which were gathered through secondary research.
Additionally, SK ecoplant CO., LTD. (South Korea), Pibond Oy (Finland), Qnity Electronics, Inc. (US), Applied Materials, Inc. (US), MicroCHEM (India), Tokyo Electron Limited (Japan), Entegris (US), EV Group (EVG) (Austria), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), GlobalFoundries (US), Intel Corporation (US), among others, are among the few other companies in the spin-on carbon market.
By end user, the foundries segment is projected to account for the largest market share in 2032.
The foundries segment is projected to account for the largest market share in the spin-on carbon market by 2032, primarily due to the crucial role of foundries in high-volume semiconductor manufacturing and the rapid adoption of advanced process technologies. Leading foundries like TSMC, Samsung Foundry, and GlobalFoundries cater to a diverse customer base that includes logic, memory interfaces, AI accelerators, and automotive semiconductors. This broad reach results in significantly higher wafer starts than other end users, which directly translates into consistent and recurring consumption of spin-on carbon materials across various lithography and etch layers.Additionally, foundries are at the forefront of implementing EUV lithography and complex DUV multi-patterning, where spin-on carbon is essential for improving pattern transfer fidelity, reducing line collapse, and enhancing yield at advanced nodes. The ongoing migration to smaller nodes, such as 5 nm and 3 nm, further increases spin-on carbon usage per wafer due to tighter critical dimensions and additional processing steps.
Moreover, foundries are enhancing their advanced packaging capabilities, including Chip-on-Wafer-on-Substrate (CoWoS), Integrated Fan-Out (InFO), and 3D integration. These processes require spin-on carbon for planarization and interlayer applications. The ongoing capacity expansions across Asia Pacific, North America, and Europe are expected to boost long-term demand. As a result, foundries are projected to become the largest consumers of spin-on carbon by 2030.
By application, the advanced packaging segment is projected to record the highest CAGR during the forecast period.
The advanced packaging segment is projected to experience the highest compound annual growth rate (CAGR) in the spin-on carbon market during the forecast period due to the rapid transition toward high-density, heterogeneous integration in semiconductor manufacturing. Technologies such as fan-out wafer-level packaging (FOWLP), 2.5D/3D integrated circuits (ICs), chiplets, and through-silicon vias (TSVs) necessitate superior planarization, strong interlayer adhesion, and precise pattern transfer - capabilities made possible by spin-on carbon materials. As device architectures become more complex, the usage of spin-on carbon per package increases, leading to faster volume growth compared to conventional front-end applications.Furthermore, the rising demand for high-performance computing, AI accelerators, and data center processors drives the adoption of advanced packaging solutions to overcome scaling limitations at the transistor level. Spin-on carbon materials are crucial for managing fine-pitch interconnects and reducing defects during multilayer processing. The growing trend of outsourcing packaging to outsourced semiconductor assembly and test (OSAT) companies also supports market expansion, as these vendors increasingly utilize spin-on carbon to enhance yield and throughput. Additionally, advancements in packaging technologies for automotive and 5G applications, which require high reliability and thermal stability, further promote the adoption of spin-on carbon materials.
North America is projected to grow at the highest CAGR during the forecast period.
North America is projected to experience the highest compound annual growth rate (CAGR) in the spin-on carbon market, driven by increasing investments in domestic semiconductor manufacturing and advanced packaging infrastructure. The region is seeing substantial construction and expansion of semiconductor fabs, motivated by government incentives, reshoring initiatives, and efforts to localize supply chains. Major foundries and integrated device manufacturers (IDMs) are expanding their capacities for advanced-node and specialty processes, which is directly boosting the demand for spin-on carbon materials in various steps, including lithography, etching, and planarization.Furthermore, North America serves as a key center for innovation in extreme ultraviolet (EUV) lithography, artificial intelligence (AI)-focused processors, and high-performance computing - all of which require high-performance spin-on carbon formulations to achieve optimal yield and pattern fidelity at scaled nodes. Additionally, the rapid advancement of packaging technologies, including 2.5D/3D integration and chiplet-based architectures, is leading to an increased consumption of spin-on carbon per wafer and package. Strong collaboration among material suppliers, equipment manufacturers, and semiconductor producers is facilitating a quick qualification and adoption of next-generation spin-on carbon materials. To summarize, the expansion of fabrication capacity, technological leadership, and the rising demand for advanced semiconductor devices position North America as the fastest-growing regional market for spin-on carbon during the forecast period.
Extensive primary interviews were conducted with key industry experts in the spin-on carbon sector to determine and verify the market size for various segments and subsegments, which were gathered through secondary research.
The breakdown of primary participants is provided below.
- By Company Type: Tier 1 - 40%, Tier 2 - 35%, and Tier 3 - 25%
- By Designation: Directors - 20%, Managers - 35%, and Others - 45%
- By Region: Asia Pacific - 40%, Europe - 20%, North America - 30%, and RoW - 10%
Additionally, SK ecoplant CO., LTD. (South Korea), Pibond Oy (Finland), Qnity Electronics, Inc. (US), Applied Materials, Inc. (US), MicroCHEM (India), Tokyo Electron Limited (Japan), Entegris (US), EV Group (EVG) (Austria), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), GlobalFoundries (US), Intel Corporation (US), among others, are among the few other companies in the spin-on carbon market.
Research Coverage:
This research report categorizes the spin-on carbon market based on type, application, end user, and region. It describes the major drivers, restraints, challenges, and opportunities pertaining to the spin-on carbon market and forecasts the same till 2032. Additionally, the report includes leadership mapping and analysis of all the companies included in the spin-on carbon market ecosystem.Key Benefits of Buying the Report:
The report will help the market leaders/new entrants in this market with information on the closest approximations of the numbers for the overall spin-on carbon market and the subsegments. It will also help stakeholders understand the competitive landscape and gain more insights to position their businesses better and plan suitable go-to-market strategies. The report will also help stakeholders understand the pulse of the market and provide them with information on key market drivers, restraints, challenges, and opportunities.The report provides insights into the following pointers:
- Analysis of key drivers (Rapid advancements in semiconductor manufacturing technologies), restraints (Availability of substitute materials), opportunities (Heightened focus on miniaturization of electronic devices), and challenges (Issues selecting suitable SoC materials for integrated circuit manufacturing) of the spin-on carbon market
- Product Development/Innovation: Detailed insights into upcoming technologies, research & development activities, and product & service launches in the spin-on carbon market
- Market Development: Comprehensive information about lucrative markets across varied regions
- Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the spin-on carbon market
- Competitive Assessment: In-depth assessment of market share, growth strategies, and service offerings of leading players, such as SAMSUNG SDI (South Korea), Shin-Etsu Chemical Co., Ltd. (Japan), DONGJIN SEMICHEM CO LTD. (South Korea), Merck KGaA (Germany), YCCHEM Co., Ltd. (South Korea), in the spin-on carbon market
Table of Contents
1 Introduction
2 Executive Summary
3 Premium Insights
4 Market Overview
5 Industry Trends
6 Technological Advancements, AI-Driven Impacts, Patents, and Innovations
7 Regulatory Landscape
8 Customer Landscape and Buyer Behavior
9 Spin-On Carbon Market, by Type
10 Spin-On Carbon Market, by Application
11 Spin-On Carbon Market, by End-user
12 Spin-On Carbon Market, by Region
13 Competitive Landscape
14 Company Profiles
15 Research Methodology
16 Appendix
List of Tables
List of Figures
Companies Mentioned
- Samsung Sdi
- Shin-Etsu Chemical Co., Ltd.
- Dongjin Semichem Co Ltd
- Merck KGaA
- Ycchem Co., Ltd.
- Brewer Science, Inc.
- Jsr Micro, Inc.
- Irresistible Materials Ltd
- Koyj Co., Ltd
- Nano-C
- Sk Ecoplant Co.,Ltd.
- Pibond Oy
- Qnity Electronics, Inc.
- Applied Materials, Inc.
- Microchem
- Tokyo Electron Limited
- Entegris
- Ev Group (Evg)
- Taiwan Semiconductor Manufacturing Company Limited
- Globalfoundries
- Intel Corporation
- Dow
- Basf
- Mitsubishi Chemical Group Corporation
- Fujifilm Wako Pure Chemical Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 227 |
| Published | February 2026 |
| Forecast Period | 2026 - 2032 |
| Estimated Market Value ( USD | $ 0.22 billion |
| Forecasted Market Value ( USD | $ 0.81 billion |
| Compound Annual Growth Rate | 24.1% |
| Regions Covered | Global |
| No. of Companies Mentioned | 25 |
