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Glob Top Encapsulant Market - Global Forecast 2025-2032

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    Report

  • 185 Pages
  • October 2025
  • Region: Global
  • 360iResearch™
  • ID: 5925270
UP TO OFF until Jan 01st 2026
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Glob top encapsulant solutions are increasingly vital in modern electronics manufacturing, ensuring device protection amid advancing miniaturization and evolving regulatory standards. Senior executives require a comprehensive grasp of market evolutions, technology shifts, and supply chain strategies to maintain a robust competitive edge.

Market Snapshot: Glob Top Encapsulant Market Overview

The Glob Top Encapsulant Market grew from USD 383.44 million in 2024 to USD 408.10 million in 2025. It is expected to continue growing at a CAGR of 6.47%, reaching USD 633.61 million by 2032. Core growth is driven by the rising sophistication and reliability demands in electronic assemblies, expansion of automotive electronics, and increased emphasis on sustainable chemistry and regional supply chain resilience. Technological progress and regulatory shifts are driving investment, mergers, and supply chain adaptation in this sector.

Scope & Segmentation of the Glob Top Encapsulant Market

This report delivers deep market coverage by dissecting crucial dimensions across applications, materials, packaging, processes, geographies, and competitive landscapes. The segmentation reflects the dynamic needs and innovation occurring across the value chain.

  • Application Segments: Automotive electronics, consumer electronics, industrial electronics, medical devices, smartphone technologies
  • Material Types: Epoxy, polyimide, silicone
  • Packaging Types: Ball grid arrays, flip chip, quad-flat no-lead (QFN), wire bond
  • Curing Processes: Thermal cure, UV cure
  • Die Sizes: Large, medium, small
  • Geographic Coverage: Americas (North America, Latin America), Europe, Middle East & Africa, Asia-Pacific
  • Key Company Profiles: Henkel AG & Co. KGaA, 3M Company, Dow Inc., H.B. Fuller Company, Shin-Etsu Chemical Co., Ltd., Sumitomo Chemical Co., Ltd., Sika AG, Arkema S.A., Evonik Industries AG, Huntsman Corporation

Key Takeaways for Senior Decision-Makers

  • Miniaturization and device complexity prioritize encapsulant performance and reliability in high-value applications across automotive, medical, and consumer markets.
  • Material innovation is accelerating, with newer formulations focusing on regulatory compliance, bio-derived chemistries, and improved thermal endurance for demanding usage environments.
  • Regulatory pressures, such as low-VOC and halogen-free mandates, reshape supply chain practices and spur development of safer and more sustainable encapsulant solutions.
  • Regional supply chain adjustments influence strategies for sourcing, production footprint, and risk mitigation, particularly as governments adjust tariffs and environmental regulations.
  • Collaborative R&D and strategic partnerships between chemical companies and equipment manufacturers drive rapid prototyping and seamless integration with automated dispensing and quality inspection systems.
  • Digitization and Industry 4.0 technologies foster predictable quality control and operational agility, supporting streamlined logistics and process optimization throughout the product lifecycle.

Impact of Tariff Adjustments on Supply Chains

Recent tariff measures in the United States are materially impacting encapsulant supply chains. Tariffs on specialty polymers and fillers prompt suppliers to reassess sourcing and invest in alternate supply agreements. These changes are increasing landed costs and shifting contract negotiations, while favoring vertically integrated suppliers and regional partnerships. Forward-thinking organizations are deploying collaborative procurement, near-shoring, and logistics streamlining to buffer cost volatility and uphold technological continuity in their encapsulant offerings.

Methodology & Data Sources

This research utilizes a hybrid methodology, combining structured interviews with executives and engineers, supplier engagements, and a thorough review of technical journals, patents, and regulatory documents. Proprietary data models, editorial peer review, and logical validation ensure robust, actionable market insights.

Why This Report Matters

  • Enables decision-makers to evaluate emerging material trends and anticipate regulatory changes impacting encapsulant selection and procurement strategies.
  • Provides detailed, up-to-date analysis of technology shifts, competitor moves, and regional market dynamics to inform proactive growth strategies.
  • Highlights adaptable supply chain tactics to strengthen operational resilience and drive long-term competitive positioning.

Conclusion

The glob top encapsulant market’s evolution demands evidence-based strategies and agile adaptation to technological and regulatory change. This report equips executives with the clarity needed to guide strategic planning and capitalize on future market opportunities.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Rising adoption of high thermal conductivity glob top encapsulants for power semiconductor reliability
5.2. Increasing demand for low-viscosity and UV-curable glob top resins in high-volume assembly lines
5.3. Shift towards lead-free and halogen-free glob top materials to meet stringent environmental regulations
5.4. Growth in 5G RF module encapsulation needs driving development of high-frequency loss minimization resins
5.5. Surge in automotive electronics applications requiring robust glob top encapsulants for harsh environments
5.6. Emergence of flexible and stretchable glob top encapsulants for next-generation wearable IoT devices
5.7. Focus on low outgassing and high adhesion glob top formulations for aerospace and military electronics
6. Cumulative Impact of United States Tariffs 2025
7. Cumulative Impact of Artificial Intelligence 2025
8. Glob Top Encapsulant Market, by Application
8.1. Automotive Electronics
8.2. Consumer Electronics
8.3. Industrial Electronics
8.4. Medical Devices
8.5. Smartphone
9. Glob Top Encapsulant Market, by Material Type
9.1. Epoxy
9.2. Polyimide
9.3. Silicone
10. Glob Top Encapsulant Market, by Packaging Type
10.1. Bga
10.2. Flip Chip
10.3. Qfn
10.4. Wire Bond
11. Glob Top Encapsulant Market, by Curing Process
11.1. Thermal Cure
11.2. Uv Cure
12. Glob Top Encapsulant Market, by Die Size
12.1. Large
12.2. Medium
12.3. Small
13. Glob Top Encapsulant Market, by Region
13.1. Americas
13.1.1. North America
13.1.2. Latin America
13.2. Europe, Middle East & Africa
13.2.1. Europe
13.2.2. Middle East
13.2.3. Africa
13.3. Asia-Pacific
14. Glob Top Encapsulant Market, by Group
14.1. ASEAN
14.2. GCC
14.3. European Union
14.4. BRICS
14.5. G7
14.6. NATO
15. Glob Top Encapsulant Market, by Country
15.1. United States
15.2. Canada
15.3. Mexico
15.4. Brazil
15.5. United Kingdom
15.6. Germany
15.7. France
15.8. Russia
15.9. Italy
15.10. Spain
15.11. China
15.12. India
15.13. Japan
15.14. Australia
15.15. South Korea
16. Competitive Landscape
16.1. Market Share Analysis, 2024
16.2. FPNV Positioning Matrix, 2024
16.3. Competitive Analysis
16.3.1. Henkel AG & Co. KGaA
16.3.2. 3M Company
16.3.3. Dow Inc.
16.3.4. H.B. Fuller Company
16.3.5. Shin-Etsu Chemical Co., Ltd.
16.3.6. Sumitomo Chemical Co., Ltd.
16.3.7. Sika AG
16.3.8. Arkema S.A.
16.3.9. Evonik Industries AG
16.3.10. Huntsman Corporation

Companies Mentioned

The companies profiled in this Glob Top Encapsulant market report include:
  • Henkel AG & Co. KGaA
  • 3M Company
  • Dow Inc.
  • H.B. Fuller Company
  • Shin-Etsu Chemical Co., Ltd.
  • Sumitomo Chemical Co., Ltd.
  • Sika AG
  • Arkema S.A.
  • Evonik Industries AG
  • Huntsman Corporation

Table Information