Interconnect and Passive Components Global Market Report 2024

The global interconnect and passive components market has grown strongly in recent years. It will grow from $188.94 billion in 2023 to $202.24 billion in 2024 at a compound annual growth rate (CAGR) of 7.0%. The growth in the historic period can be attributed to booming consumer electronics, telecommunications expansion, industrial automation, growing automotive electronics.

The global interconnect and passive components market is expected to see strong growth in the next few years. It will grow to $257.57 billion in 2028 at a compound annual growth rate (CAGR) of 6.2%. The growth in the forecast period can be attributed to 5g network rollout, electric vehicle (ev) revolution, internet of things (iot) expansion, growing aerospace and defense. Major trends in the forecast period include miniaturization and technology advancements, high-frequency and rf components, sustainable and eco-friendly components, customization and modular designs developments.

The growing manufacturing of consumer electronics is set to be a key driver of the interconnect and passive components market's expansion in the foreseeable future. Consumer electronics encompass a wide range of electronic devices and gadgets designed for individual use, serving purposes such as entertainment, communication, and productivity. With the surge in consumer electronics production, there is an increasing demand for interconnect and passive components that enable seamless connectivity, support miniaturization, and enhance the functionality of these devices. This is especially crucial in meeting the requirements of modern products, characterized by complexity and integration. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported that total electronic equipment production in Japan reached $6,722 million (¥771,457 million). Furthermore, the production of consumer electronics soared to $280 million (¥32,099 million) in May 2023, a notable increase from $230.9 million (¥25,268 million) in May 2022. As a result, the upsurge in consumer electronics manufacturing will be a driving force behind the expansion of the interconnect and passive components market.

The substantial adoption of Internet of Things (IoT) devices is poised to be a major catalyst for the growth of the interconnect and passive components market. IoT encompasses a network of physical objects integrated with sensors, software, and connectivity features that empower them to gather and share data across the Internet. IoT devices play a pivotal role in the interconnect and passive components (IPC) sector, both generating a need for specialized IPC components and reaping the benefits of these components to operate efficiently. For example, in January 2022, data provided by the GSM Association projected that global IoT connections would witness a substantial increase to 23.3 billion by 2025, marking a significant rise from the 15.1 billion connections reported in 2021. As a result, the significant adoption of IoT devices is the driving force behind the expansion of the interconnect and passive components market.

The growth of the interconnect and passive components market is being impeded by disruptions in the supply chain during the forecast period. Such interruptions in the supply chain, which may include delays in the delivery of critical materials or components, have the potential to cause production delays. Consequently, this can lead to order backlogs, missed deadlines, and diminished product availability, thereby constraining market expansion. For instance, as of February 2022, Forbes reported a rising count of supply chain disruptions, reaching a total of 11,642 worldwide. Thus, the escalating disruptions in the supply chain are acting as a hindrance to the growth of the interconnect and passive components market.

Major players in the interconnect and passive components market are dedicated to innovating components, particularly high-frequency passive components, to bolster dependable and high-performance satellite communication, thereby securing their positions in the market. For example, in August 2023, Smiths Interconnect Inc., a US-based manufacturer of electronic components, unveiled its line of E-Band passive components, including WR12 couplers, loads, and isolators. These broadband WR12 waveguide components are meticulously engineered to meet the requirements of next-generation E-Band terrestrial uplinks to Low Earth Orbit (LEO) constellations and payloads, efficiently handling the high RF power essential for robust communication links. This product series is ideally suited for critical applications, including prestigious space missions, and is developed, manufactured, and tested in-house. The WR12 waveguide hybrids are designed for global applicability, offering extensive tuning, high-power termination, and consistent performance across the 71-76 and 81-86 GHz frequency bands.

In December 2021, Amphenol Corporation, a leading US-based manufacturer of electronic connectors, completed its acquisition of Halo Technology Limited for an approximate sum of $715 million. This strategic move by Amphenol Corporation is geared towards expanding its portfolio of high-speed and fiber-optic interconnect solutions, thus creating significant growth opportunities for its clientele in the IT, data communications, mobile networks, and broadband sectors. Halo Technology Limited, based in the United States, specializes in providing both active and passive fiber optic interconnect components to the communications infrastructure market.

Major players in the interconnect and passive components market are Foxconn Electronics Inc., Nichicon Corporation, Koch Industries Inc., Panasonic Corporation, Cisco Systems Inc., KYOCERA AVX Components Corporation, TE Connectivity Corporation, TDK Corporation, Molex Incorporated, YAZAKI Corporation, Amphenol Corporation, Murata Manufacturing Co. Ltd., Samsung Electro-Mechanics Co. Ltd., AMETEK Inc., Hubbell Inc., Delphi Technologies PLC, Yageo Corporation, Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co. Ltd., Japan Aviation Electronics Industry Ltd., KEMET Electronics Corporation, HIROSE ELECTRIC CO., Sumida Corporation, TT Electronics PLC, Rubycon Corporation, Pulse Electronics Corporation, J.S.T. Mfg. Co., Chogori Technology Co. Ltd., Zeeteq Electronics Co. Ltd.

Asia-Pacific was the largest region in the interconnect and passive components market in 2023. The regions covered in interconnect and passive components report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The countries covered in the interconnect and passive components market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The primary categories of interconnects and passive components include passive components and interconnects. Passive components are electronic elements that do not actively amplify or control electrical signals but play a vital role in manipulating and shaping electronic signals within circuits for various purposes, including filtering, signal conditioning, and energy storage. Interconnects and passive components find applications in a wide range of fields, including consumer electronics, data processing, telecommunications, military and aerospace, automotive, industrial, and healthcare.

This report provides interconnect and passive components market statistics, including interconnect and passive components industry global market size, regional shares, competitors with a interconnect and passive components market share, detailed interconnect and passive components market segments, market trends and opportunities and any further data you may need to thrive in the interconnect and passive components industry. This interconnect and passive components market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future- scenario of the industry.

The interconnect and passive components market consists of revenues earned by entities by providing signal transmission and routing, voltage regulation and power distribution, passive sensing and measurement and protection and ESD (electrostatic discharge) handling. The market value includes the value of related goods sold by the service provider or included within the service offering. The interconnect and passive components market also includes sales of resistors, inductors, printed circuit boards, switches and diodes. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.


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