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Semiconductor Assembly and Packaging Equipment Global Market Report 2024

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    Report

  • 175 Pages
  • February 2024
  • Region: Global
  • The Business Research Company
  • ID: 5939085

Quick Summary:

The semiconductor assembly and packaging equipment market stands at the epicenter of technological advancement, addressing the critical needs of sectors ranging from consumer electronics to healthcare and automotive. As business executives, your strategic decisions must leverage cutting-edge market intelligence that encapsulates the pulse of innovation and operational excellence. Our market research report provides an exhaustive analysis of the industry's progress, spotlighting transformative trends that dictate market dynamics.

Decision-making is nuanced at the highest echelons of business; this report is tailored to aid leaders in identifying opportunities, mitigating risks, and outpacing competition with actionable insights. With comprehensive coverage on emerging technologies, evolving end-user requirements, and strategic developments of key players, our report equips you with the foresight to drive growth in a rapidly evolving marketplace. This valuable compilation of data, analytics, and expert perspectives is indispensable for cementing leadership in the semiconductor assembly and packaging equipment landscape.

The semiconductor assembly and packaging equipment market size has grown rapidly in recent years. It will grow from $11.23 billion in 2023 to $12.45 billion in 2024 at a compound annual growth rate (CAGR) of 10.9%. Semiconductor assembly and packaging equipment played a crucial role in the historic period, driven by the growth in emerging markets, a rising demand for semiconductor equipment, an increased need for consumer electronics, and the upswing in disposable income.

The semiconductor assembly and packaging equipment market size is expected to see strong growth in the next few years. It will grow to $17.95 billion in 2028 at a compound annual growth rate (CAGR) of 9.6%. The forecasted growth in the semiconductor assembly and packaging equipment sector is attributed to government initiatives aimed at propelling the semiconductor industry, an increased demand for electric vehicles, heightened requirements from the medical industry, the impact of rising urbanization, and a growing need for portable electronic devices. Key trends anticipated in the forecast period include a concerted focus on launching advanced semiconductor inspection machines incorporating big data and artificial intelligence (AI), innovation in new product offerings such as the introduction of an automatic flip-chip bonder, efforts to introduce compound semiconductor equipment to enhance the wet process product line, and a strategic emphasis on increased investments and partnerships for product development.

The increasing demand for consumer electronics is poised to contribute significantly to the expansion of the semiconductor assembly and packaging equipment market. Consumer electronics, a pivotal sector reliant on the semiconductor industry, has witnessed substantial growth. According to the India Brand Equity Foundation, the Indian appliance and consumer electronics market reached $10.93 billion in 2019 and is projected to grow at a CAGR of 9%, reaching $48.37 billion by 2022. The continuous integration of semiconductor Integrated Circuits (ICs) in various electronic devices to perform diverse functions is driving the demand for semiconductor assembly and packaging equipment, propelled by the expanding consumer electronics market.

The rising popularity of electric vehicles is expected to further drive the growth of the semiconductor assembly and packaging equipment market. Electric vehicles (EVs), powered by electricity stored in rechargeable battery packs or energy storage systems, rely on modern power electronics for their electric propulsion systems. These power electronics require specialized semiconductor components that necessitate precise assembly and packaging. According to a report from the US Department of Energy in March 2022, electric vehicle sales witnessed an 85% increase between 2020 and 2021. The number of new light-duty plug-in electric vehicle sales nearly doubled from 308,000 in 2020 to 608,000 in 2021, reflecting the growing popularity of electric vehicles and driving the demand for semiconductor assembly and packaging equipment.


Technological advancements emerge as a prominent trend driving innovation in the semiconductor assembly and packaging equipment market. Key players in the market are actively introducing new technologies to enhance packaging applications, with a focus on compound equipment. Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions, exemplifies this trend. In January 2022, the company launched an integrated equipment series supporting compound semiconductor manufacturing. The compound semiconductor wet process product line includes various equipment such as gluing, development, photoresist de-gluing, wet etching, cleaning, and metal plating equipment. It is designed to be automatically compatible with flat-edged or notched wafers, showcasing advancements in semiconductor assembly and packaging technology.

Major companies in the semiconductor assembly and packaging equipment market are also investing in the development of new technologies such as semiconductor package substrates to expand their customer bases, increase sales, and boost revenue. A semiconductor package substrate is a critical component in assembling semiconductor devices, including integrated circuits (ICs) and microprocessors. LG Innotek Co. Ltd., a South Korea-based electronic components manufacturer, introduced the 2Metal Chip on Film (COF) in February 2023. COF is an advanced semiconductor package substrate designed for establishing connections between displays and flexible Printed Circuit Boards (PCBs). The product minimizes bezels in devices such as TVs, notebook PCs, monitors, and smartphones while contributing to a reduction in module size. The innovative design features micro-via holes on a thin film and integrates ultra-miniaturized circuits on both sides, facilitating faster signal transmission and enabling ultra-high-definition screens.

In December 2021, YES (Yield Engineering Systems, Inc), a US-based manufacturing company providing process equipment for semiconductor advanced packaging, acquired SPEC (Semiconductor Process Equipment Corporation). The acquisition aimed to enhance YES's technological expertise in markets including High-Performance Computing (HPC), artificial intelligence/machine learning, 5G, autonomous driving, augmented reality, and other computationally intensive applications. SPEC, a US-based company specializing in surface conditioning wet process equipment, offered a portfolio including cleaning, etching, stripping, and plating equipment. The acquisition was anticipated to benefit both current and future customers of YES.

Major companies operating in the semiconductor assembly and packaging equipment market report are Tokyo Electron Ltd., Applied Materials, Inc., Kulicke and Soffa Industries, Inc., ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd., KLA-Tencor, Toshiba Corp, Cypress Semiconductor Corp, ARM Ltd., Renesas Electronics Corporation, Fujitsu Limited, Panasonic Corporation, Continental Device India Ltd (CDIL), MosChip Semiconductor Technologies, Advanced Semiconductor Engineering Inc., Zhixin Semiconductor, UNISOC, Yangtze Memory Technologies Co., Ltd (YTMC), GigaDevice, CR Micro, Silan, Infineon Technologies AG, UnitySC, Dialog Semiconductor PLC, Lam Research Corporation, Hitachi High Technologies Corporation, Advantest, Teradyne Inc., Smart Modular Technologies, Tecsys, Multilaser, Flextronics, Digitron, STMicroelectronics, ROHM Semiconductor, Semiconductors and Technologies Limited Company, Fei – Randburg, Electronic components CSE, Kh Distributors, Avnet Kopp, Renewable Energy Semiconductor Manufacturing company, SGS Ghana Limited.

Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2023. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor assembly and packaging equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Italy, Canada, Spain.

The primary types of semiconductor assembly and packaging equipment include plating equipment, inspection and dicing equipment, wire bonding equipment, and die-bonding equipment. Wire bonding equipment specifically pertains to the process of connecting two pieces of equipment using a wire, a crucial step for hazard prevention. These equipment find diverse applications in consumer electronics, healthcare devices, automotive, enterprise storage, and various other sectors. The key end-users encompass OSATs (Outsourced Semiconductor Assembly and Test) and IDMs (Integrated Device Manufacturers).

The semiconductor assembly and packaging equipment market research report is one of a series of new reports that provides semiconductor assembly and packaging equipment market statistics, including semiconductor assembly and packaging equipment industry global market size, regional shares, competitors with a semiconductor assembly and packaging equipment market share, detailed semiconductor assembly and packaging equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor assembly and packaging equipment industry. This semiconductor assembly and packaging equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor assembly and packaging equipment market consists of sales of precision ACCRETECH dicing blades, probing machines, polish grinders, high rigid grinder, CMP, edge shaping products, sliced wafer demounting and cleaning machine. Values in this market are factory gate values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
Frequently Asked Questions about the Global Semiconductor Assembly and Packaging Equipment Market

What is the estimated value of the Global Semiconductor Assembly and Packaging Equipment Market?

The Global Semiconductor Assembly and Packaging Equipment Market was estimated to be valued at $12.45 Billion in 2024.

What is the growth rate of the Global Semiconductor Assembly and Packaging Equipment Market?

The growth rate of the Global Semiconductor Assembly and Packaging Equipment Market is 9.6%, with an estimated value of $17.95 Billion by 2028.

What is the forecasted size of the Global Semiconductor Assembly and Packaging Equipment Market?

The Global Semiconductor Assembly and Packaging Equipment Market is estimated to be worth $17.95 Billion by 2028.

Who are the key companies in the Global Semiconductor Assembly and Packaging Equipment Market?

Key companies in the Global Semiconductor Assembly and Packaging Equipment Market include Tokyo Electron Ltd, Applied Materials, Inc, Kulicke and Soffa Industries, Inc, ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd and KLA.

Table of Contents

1. Executive Summary2. Semiconductor Assembly and Packaging Equipment Market Characteristics3. Semiconductor Assembly and Packaging Equipment Market Trends and Strategies
4. Semiconductor Assembly and Packaging Equipment Market - Macro Economic Scenario
4.1. Impact of High Inflation on the Market
4.2. Ukraine-Russia War Impact on the Market
4.3. COVID-19 Impact on the Market
5. Global Semiconductor Assembly and Packaging Equipment Market Size and Growth
5.1. Global Semiconductor Assembly and Packaging Equipment Market Drivers and Restraints
5.1.1. Drivers of the Market
5.1.2. Restraints of the Market
5.2. Global Semiconductor Assembly and Packaging Equipment Historic Market Size and Growth, 2018-2023, Value ($ Billion)
5.3. Global Semiconductor Assembly and Packaging Equipment Forecast Market Size and Growth, 2023-2028, 2033F, Value ($ Billion)
6. Semiconductor Assembly and Packaging Equipment Market Segmentation
6.1. Global Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Plating Equipment
  • Inspection and Dicing Equipment
  • Wire Bonding Equipment
  • Die-Bonding Equipment
6.2. Global Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Consumer Electronics
  • Healthcare Devices
  • Automotive
  • Enterprise Storage
  • Other Applications
6.3. Global Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • OSATs
  • IDMs
7. Semiconductor Assembly and Packaging Equipment Market Regional and Country Analysis
7.1. Global Semiconductor Assembly and Packaging Equipment Market, Split by Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
7.2. Global Semiconductor Assembly and Packaging Equipment Market, Split by Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market
8.1. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Overview
Region Information, Impact of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
8.2. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.3. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
8.4. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
9. China Semiconductor Assembly and Packaging Equipment Market
9.1. China Semiconductor Assembly and Packaging Equipment Market Overview
9.2. China Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.3. China Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
9.4. China Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
10. India Semiconductor Assembly and Packaging Equipment Market
10.1. India Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.2. India Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
10.3. India Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11. Japan Semiconductor Assembly and Packaging Equipment Market
11.1. Japan Semiconductor Assembly and Packaging Equipment Market Overview
11.2. Japan Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.3. Japan Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
11.4. Japan Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12. Australia Semiconductor Assembly and Packaging Equipment Market
12.1. Australia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.2. Australia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
12.3. Australia Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13. Indonesia Semiconductor Assembly and Packaging Equipment Market
13.1. Indonesia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.2. Indonesia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
13.3. Indonesia Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14. South Korea Semiconductor Assembly and Packaging Equipment Market
14.1. South Korea Semiconductor Assembly and Packaging Equipment Market Overview
14.2. South Korea Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.3. South Korea Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
14.4. South Korea Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15. Western Europe Semiconductor Assembly and Packaging Equipment Market
15.1. Western Europe Semiconductor Assembly and Packaging Equipment Market Overview
15.2. Western Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.3. Western Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
15.4. Western Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16. UK Semiconductor Assembly and Packaging Equipment Market
16.1. UK Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.2. UK Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
16.3. UK Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17. Germany Semiconductor Assembly and Packaging Equipment Market
17.1. Germany Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.2. Germany Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
17.3. Germany Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18. France Semiconductor Assembly and Packaging Equipment Market
18.1. France Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.2. France Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
18.3. France Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19. Italy Semiconductor Assembly and Packaging Equipment Market
19.1. Italy Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.2. Italy Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
19.3. Italy Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20. Spain Semiconductor Assembly and Packaging Equipment Market
20.1. Spain Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.2. Spain Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
20.3. Spain Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21. Eastern Europe Semiconductor Assembly and Packaging Equipment Market
21.1. Eastern Europe Semiconductor Assembly and Packaging Equipment Market Overview
21.2. Eastern Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.3. Eastern Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
21.4. Eastern Europe Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22. Russia Semiconductor Assembly and Packaging Equipment Market
22.1. Russia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.2. Russia Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
22.3. Russia Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23. North America Semiconductor Assembly and Packaging Equipment Market
23.1. North America Semiconductor Assembly and Packaging Equipment Market Overview
23.2. North America Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.3. North America Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
23.4. North America Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24. USA Semiconductor Assembly and Packaging Equipment Market
24.1. USA Semiconductor Assembly and Packaging Equipment Market Overview
24.2. USA Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.3. USA Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
24.4. USA Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25. Canada Semiconductor Assembly and Packaging Equipment Market
25.1. Canada Semiconductor Assembly and Packaging Equipment Market Overview
25.2. Canada Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.3. Canada Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
25.4. Canada Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26. South America Semiconductor Assembly and Packaging Equipment Market
26.1. South America Semiconductor Assembly and Packaging Equipment Market Overview
26.2. South America Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.3. South America Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
26.4. South America Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27. Brazil Semiconductor Assembly and Packaging Equipment Market
27.1. Brazil Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.2. Brazil Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
27.3. Brazil Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28. Middle East Semiconductor Assembly and Packaging Equipment Market
28.1. Middle East Semiconductor Assembly and Packaging Equipment Market Overview
28.2. Middle East Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.3. Middle East Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
28.4. Middle East Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29. Africa Semiconductor Assembly and Packaging Equipment Market
29.1. Africa Semiconductor Assembly and Packaging Equipment Market Overview
29.2. Africa Semiconductor Assembly and Packaging Equipment Market, Segmentation by Type, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.3. Africa Semiconductor Assembly and Packaging Equipment Market, Segmentation by Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
29.4. Africa Semiconductor Assembly and Packaging Equipment Market, Segmentation by End-User, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
30. Semiconductor Assembly and Packaging Equipment Market Competitive Landscape and Company Profiles
30.1. Semiconductor Assembly and Packaging Equipment Market Competitive Landscape
30.2. Semiconductor Assembly and Packaging Equipment Market Company Profiles
30.2.1. Tokyo Electron Ltd
30.2.1.1. Overview
30.2.1.2. Products and Services
30.2.1.3. Strategy
30.2.1.4. Financial Performance
30.2.2. Applied Materials, Inc
30.2.2.1. Overview
30.2.2.2. Products and Services
30.2.2.3. Strategy
30.2.2.4. Financial Performance
30.2.3. Kulicke and Soffa Industries, Inc
30.2.3.1. Overview
30.2.3.2. Products and Services
30.2.3.3. Strategy
30.2.3.4. Financial Performance
30.2.4. ASML Holding N.V
30.2.4.1. Overview
30.2.4.2. Products and Services
30.2.4.3. Strategy
30.2.4.4. Financial Performance
30.2.5. BE Semiconductor Industries N.V
30.2.5.1. Overview
30.2.5.2. Products and Services
30.2.5.3. Strategy
30.2.5.4. Financial Performance
31. Semiconductor Assembly and Packaging Equipment Market Other Major and Innovative Companies
31.1. Tokyo Seimitsu
31.2. Amkor Technology
31.3. ASM Pacific Technology
31.4. Screen Holdings Co. Ltd
31.5. KLA-Tencor
31.6. Toshiba Corp
31.7. Cypress Semiconductor Corp
31.8. ARM LTD
31.9. Renesas Electronics Corporation
31.10. Fujitsu Limited
31.11. Panasonic Corporation
31.12. Continental Device India Ltd (CDIL)
31.13. MosChip Semiconductor Technologies
31.14. Advanced Semiconductor Engineering Inc
31.15. Zhixin Semiconductor
32. Global Semiconductor Assembly and Packaging Equipment Market Competitive Benchmarking33. Global Semiconductor Assembly and Packaging Equipment Market Competitive Dashboard34. Key Mergers and Acquisitions in the Semiconductor Assembly and Packaging Equipment Market
35. Semiconductor Assembly and Packaging Equipment Market Future Outlook and Potential Analysis
35.1 Semiconductor Assembly and Packaging Equipment Market in 2028 - Countries Offering Most New Opportunities
35.2 Semiconductor Assembly and Packaging Equipment Market in 2028 - Segments Offering Most New Opportunities
35.3 Semiconductor Assembly and Packaging Equipment Market in 2028 - Growth Strategies
35.3.1 Market Trend-based Strategies
35.3.2 Competitor Strategies
36. Appendix
36.1. Abbreviations
36.2. Currencies
36.3. Historic and Forecast Inflation Rates
36.4. Research Inquiries
36.5. About the Analyst
36.6. Copyright and Disclaimer

Executive Summary

Semiconductor Assembly and Packaging Equipment Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on semiconductor assembly and packaging equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
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  • Assess the Russia-Ukraine war’s impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
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Description
Where is the largest and fastest growing market for semiconductor assembly and packaging equipment? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? This report answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:
  • The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.
  • The impact of higher inflation in many countries and the resulting spike in interest rates.
  • The continued but declining impact of COVID-19 on supply chains and consumption patterns.
  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Report Scope

Markets Covered:
1) By Type: Plating Equipment; Inspection and Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment; and Other Types
2) By Application: Companion Animals; Livestock
3) By End-user: OSATS (Outsourced Semiconductor Assembly and Test); IDMS (Integrated Device Manufacturers)

Key Companies Mentioned: Tokyo Electron Ltd; Applied Materials, Inc; Kulicke and Soffa Industries, Inc; ASML Holding N.V; BE Semiconductor Industries N.V

Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain

Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa

Time Series: Five years historic and ten years forecast

Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita

Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments

Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes

Delivery Format: PDF, Word and Excel Data Dashboard

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Tokyo Electron Ltd
  • Applied Materials, Inc
  • Kulicke and Soffa Industries, Inc
  • ASML Holding N.V
  • BE Semiconductor Industries N.V
  • Tokyo Seimitsu
  • Amkor Technology
  • ASM Pacific Technology
  • Screen Holdings Co. Ltd
  • KLA-Tencor
  • Toshiba Corp
  • Cypress Semiconductor Corp
  • ARM LTD
  • Renesas Electronics Corporation
  • Fujitsu Limited
  • Panasonic Corporation
  • Continental Device India Ltd (CDIL)
  • MosChip Semiconductor Technologies
  • Advanced Semiconductor Engineering Inc
  • Zhixin Semiconductor
  • UNISOC
  • Yangtze Memory Technologies Co., Ltd (YTMC)
  • GigaDevice
  • CR Micro
  • Silan
  • Infineon Technologies AG
  • UnitySC
  • Dialog Semiconductor Plc
  • Lam Research Corporation
  • Hitachi High Technologies Corporation
  • Advantest
  • Teradyne Inc
  • Smart Modular Technologies
  • Tecsys
  • Multilaser
  • Flextronics
  • Digitron
  • STMicroelectronics
  • ROHM Semiconductor
  • Semiconductors and Technologies Limited Company
  • Fei – Randburg
  • Electronic components CSE
  • Kh Distributors
  • Avnet Kopp
  • Renewable Energy Semiconductor Manufacturing company
  • SGS Ghana Limited.

Methodology

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