Chiplets Market Report 2026

The chiplets market size has grown exponentially in recent years. It will grow from $13.55 billion in 2025 to $22.58 billion in 2026 at a compound annual growth rate (CAGR) of 66.7%. The growth in the historic period can be attributed to growing complexity of monolithic ics, rising cost of advanced node lithography, early development of 2.5d and 3d packaging, increased demand for high performance computing, emergence of modular semiconductor design approaches.

The chiplets market size is expected to see exponential growth in the next few years. It will grow to $168.57 billion in 2030 at a compound annual growth rate (CAGR) of 65.3%. The growth in the forecast period can be attributed to expansion of AI and edge computing workloads, growing deployment of chiplet based datacenter processors, increasing adoption of open chiplet standards like ucie, rising demand for cost efficient multi die integration, growth of semiconductor outsourcing and packaging ecosystems. Major trends in the forecast period include growing demand for heterogeneous chiplet architectures, rising adoption of standardized chiplet interconnect protocols, expansion of advanced packaging for chiplet integration, increasing outsourcing of chiplet manufacturing, growing need for modular design to reduce time to market.

The increasing demand for electronic devices is poised to drive the growth of the chiplets market in the future. Electronic gadgets encompass various devices that utilize electronic components and technology to perform specific functions. Chiplets offer a more adaptable, cost-effective, and scalable approach to creating and producing electronic gadgets, catering to the evolving complexity and requirements of modern technologies. For example, as reported by the Japan Electronics and Information Technology Industries Association in May 2023, consumer electronics production reached $2.17 trillion (¥32,099 million), compared to $1.71 trillion (¥25,268 million) in May 2022. Moreover, according to Uswitch Limited in February 2023, the UK witnessed a 3.8% increase in mobile connections, totaling 71.8 million in 2022. With the UK population expected to reach 68.3 million by 2025, approximately 95% of individuals (around 65 million) are projected to own a smartphone. Consequently, the rising demand for electronic gadgets is a driving force behind the chiplets market.

Key players in the chiplets market are concentrating on developing innovative technological solutions such as 5G technology to enhance their market position. For instance, in 2023, Intel Corporation introduced the 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost and announced the Intel infrastructure power manager for 5G core reference software. This solution aims to deliver a 30% average run-time CPU power savings, enabling 5G core networks to achieve a balance between power efficiency, performance, and latency while meeting critical business and customer requirements. This technology facilitates the operation of 5G core networks on software, providing cloud-native agility.

In July 2025, Tenstorrent, a U.S.-based provider of AI hardware platforms and RISC-V chiplet solutions, acquired Blue Cheetah Analog Design for an undisclosed amount. Through this acquisition, Tenstorrent seeks to bring essential analog or mixed-signal interconnect IP and engineering expertise in-house to accelerate its open chiplet ecosystem and lessen dependence on third-party vendors. Blue Cheetah Analog Design is a U.S.-based start-up specializing in customizable, standards-based die-to-die interconnect and analog or mixed-signal IP solutions for chiplet architectures.

Major companies operating in the chiplets market are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, IBM, Qualcomm Technologies Inc., NVIDIA Corporation, Micron Technology Inc., Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., MediaTek Inc., NXP Semiconductors N.V., United Microelectronics Corporation, GlobalFoundries, Synopsys Inc., Marvell Technology Inc., Cadence Design Systems Inc., Xilinx Inc., ALPHAWAVE SEMI, Tenstorrent, Ayar Labs Inc., Kandou Bus SA, SiFive Inc., Achronix Semiconductor Corporation, Ranovus, Netronome, X-Celeprint, NHanced Semiconductors, Rain Neuromorphics, Eliyan, Chipuller.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs are increasing the cost of semiconductor materials, chiplet substrates, and advanced packaging tools, creating pricing pressure across processor categories such as GPUs, CPUs, and AI ASICs. Regions with strong import dependency, including Southeast Asia and Europe, face higher production costs and slower supply chain movement, especially for 2.5D and 3D packaging lines. While tariffs challenge global sourcing strategies, they also promote domestic semiconductor manufacturing, encourage local packaging investments, and accelerate innovation in cost optimized chiplet integration technologies.

The chiplets market research report is one of a series of new reports that provides chiplets market statistics, including the chiplets industry global market size, regional shares, competitors with a chiplets market share, detailed chiplets market segments, market trends and opportunities, and any further data you may need to thrive in the chiplets industry. This chiplets market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

Chiplets are individual semiconductor components or functional blocks that are manufactured separately and then assembled to create larger integrated circuits (ICs) or systems. They find applications across the semiconductor industry for designing and manufacturing integrated circuits.

The main processors in the chiplets market include Field Programmable Gate Arrays (FPGAs), Graphics Processing Units (GPUs), Central Processing Units (CPUs), Application Processing Units (APUs), and Artificial Intelligence Application-Specific Integrated Circuit (AI ASIC) coprocessors. Field Programmable Gate Arrays (FPGAs) are a specific type of integrated circuit that can be programmed or reprogrammed after manufacturing. Various packaging technologies are utilized in chiplet assembly, including System-in-Package (SiP), Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), 2.5D/3D integration, Wafer-Level Chip Scale Package (WLCSP), and Fan-Out (FO). These chiplets find applications across various end-user industries such as enterprise electronics, consumer electronics, industrial automation, healthcare, automotive, military and aerospace, among others.Asia-Pacific was the largest region in the chiplets market in 2025. North America is expected to be the fastest-growing region in the forecast period. The regions covered in the chiplets market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the chiplets market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The chiplets market includes revenues earned by entities by providing services such as chiplet integration services, chiplet design services, and testing and verification services. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included. The chiplets market consists of sales of security chiplets, sensor chiplets, quantum computing chiplets, and AI accelerator chiplets. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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