Thick Film Hybrid Integrated Circuits Market Report 2026

The thick film hybrid integrated circuits market size has grown strongly in recent years. It will grow from $3.86 billion in 2025 to $4.09 billion in 2026 at a compound annual growth rate (CAGR) of 6%. The growth in the historic period can be attributed to demand for rugged electronics in defense systems, early adoption in aerospace avionics, need for high thermal stability circuits, growth of industrial electronics, reliability requirements in telecom infrastructure.

The thick film hybrid integrated circuits market size is expected to see strong growth in the next few years. It will grow to $5.07 billion in 2030 at a compound annual growth rate (CAGR) of 5.5%. The growth in the forecast period can be attributed to growth in electric vehicle electronics, rising investments in defense modernization, increasing adoption in industrial automation, demand for compact power electronics, expansion of smart and connected devices. Major trends in the forecast period include increasing adoption of thick-film hybrid ics in harsh environment applications, growing demand for miniaturized and high-reliability electronic circuits, rising use of thick-film hics in automotive power and control systems, expansion of hybrid ic usage in aerospace and defense electronics, increased customization of thick-film circuits for specialized applications.

The increasing demand for consumer electronics is expected to drive the growth of the thick-film hybrid integrated circuits market. Consumer electronics include devices designed for personal and daily use, such as smartphones, tablets, laptops, and home entertainment systems. Advancements in technology, expanding connectivity, and the increasing desire for convenience and entertainment are fueling the rising demand for consumer electronics. Thick-film hybrid integrated circuits are utilized in these devices to combine the benefits of thick-film and integrated circuit technologies, providing compactness, reliability, and cost-effectiveness. For example, in February 2024, the Japan Electronics and Information Technology Industries Association, a Japan-based trade organization, reported that consumer electronic equipment production reached $201.91 million (¥31,685 million), an increase from $149.27 million (¥23,425 million) in January 2023. As a result, the growing demand for consumer electronics will drive the expansion of the thick-film hybrid integrated circuits market.

Leading companies in the thick-film hybrid integrated circuits market are concentrating on developing innovative hybrid bonding reference flows to improve performance, enhance thermal management, and minimize interconnect resistance. These efforts aim to create higher-density, high-reliability solutions for applications across industries such as automotive, aerospace, telecommunications, and medical devices. Hybrid bonding reference flow refers to a standardized or recommended process in semiconductor manufacturing, particularly in advanced packaging and 3D integration. For example, in February 2023, United Microelectronics Corporation (UMC), a Taiwan-based semiconductor company, partnered with Cadence Design Systems, an India-based software firm, to develop a 3D-IC Hybrid Bonding Reference Flow. This collaboration is intended to improve the efficiency and effectiveness of 3D integrated circuit (IC) design, with a focus on advanced semiconductor applications in areas such as edge AI, image processing, and wireless communication.

In January 2023, HEICO Corporation acquired Exxelia International, a France-based manufacturer of passive components and precision subsystems, including thick-film surface mount resistor circuits. This acquisition enhances HEICO's portfolio, expanding its range of components for aerospace, defense, space, and upscale markets, while also strengthening its presence in the European market.

Major companies operating in the thick film hybrid integrated circuits market are Panasonic Corporation, GE Aerospace, Infineon Technologies AG, ROHM CO. LTD, Vishay Intertechnology, KEMET Corporation, Fenghua Advanced Technology Holding CO.LTD, Semtech Corporation, TT Electronics, Beijing Sevenstar Electronics Co. Ltd., KYOCERA AVX, Ohmite Manufacturing Company, Electro Technik Industries Inc., Delphi Technologies, Zhejiang Huzhou Xinjingchang Electronics Co. Ltd., Corintech Ltd, VPT Inc., AUREL s.p.a., Custom Interconnect Limited, Japan Resistor Mfg. Co. Ltd., Micro Hybrid Electronic GmbH, Advance Circuit Technology Inc., Cermetek Microelectronics, Hybrionic Pte, Bergh Hybrid Circuits, Integrated Technology Lab, Midas Microelectronics, Weiking Electronics Manufacturing, Globec Limited.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have affected the thick-film hybrid integrated circuits market by increasing the cost of ceramic substrates, conductive pastes, and precision manufacturing equipment sourced globally. These impacts are most pronounced in automotive, aerospace, and telecom segments, particularly in regions reliant on cross-border component supply such as Asia-Pacific and Europe. However, tariffs have also encouraged local sourcing, domestic manufacturing investments, and supply chain diversification, supporting long-term resilience and technological self-reliance in the market.

The thick film hybrid integrated circuits market research report is one of a series of new reports that provides thick film hybrid integrated circuits market statistics, including thick film hybrid integrated circuits industry global market size, regional shares, competitors with an thick film hybrid integrated circuits market share, detailed thick film hybrid integrated circuits market segments, market trends and opportunities, and any further data you may need to thrive in the thick film hybrid integrated circuits industry. This thick film hybrid integrated circuits market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

Thick-film hybrid integrated circuits (HICs) are sophisticated electronic circuits that integrate multiple electrical components into a single unit. The "thick-film" aspect refers to the process of depositing conductive, resistive, and insulating materials onto a substrate, accomplished through techniques such as screen printing and firing layers of paste materials to form the desired circuit patterns. These circuits are designed to be compact, reliable, and high-performing, suitable for operation in challenging environments.

The primary substrates used in thick-film hybrid integrated circuits include 96% Al2O3 ceramic substrates, beryllium oxide (BeO) ceramic substrates, aluminum nitride (AIN)-based substrates, among others. The 96% Al2O3 ceramic substrate, made predominantly of aluminum oxide, is valued for its excellent electrical insulation, thermal conductivity, and stability, making it an ideal platform for circuit components in thick-film HICs. These circuits encompass various product types such as active, passive, and electromechanical components, serving diverse applications such as avionics and defense, automotive systems, telecommunications, computer technology, consumer electronics, and more.North America was the largest region in the thick film hybrid integrated circuits market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the thick film hybrid integrated circuits market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the thick film hybrid integrated circuits market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The thick-film hybrid integrated circuits market consist of sales resistors, capacitors, inductors, diodes, transistors, ICs, sensors, and power modules. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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