Polyamide Hot Melt Adhesives Market Report 2026

The polyamide hot melt adhesives market size has grown strongly in recent years. It will grow from $0.66 billion in 2025 to $0.7 billion in 2026 at a compound annual growth rate (CAGR) of 5.6%. The growth in the historic period can be attributed to growth of footwear manufacturing, expansion of woodworking industries, demand for durable bonding materials, adoption of thermoplastic adhesives, industrial automation growth.

The polyamide hot melt adhesives market size is expected to see strong growth in the next few years. It will grow to $0.87 billion in 2030 at a compound annual growth rate (CAGR) of 5.6%. The growth in the forecast period can be attributed to rising electric vehicle production, increased demand for lightweight bonding solutions, growth in electronics manufacturing, shift toward solvent free adhesives, expansion of automated assembly lines. Major trends in the forecast period include growing use in automotive assembly, rising demand for high heat resistant adhesives, expansion in footwear and textile bonding, increased adoption in electrical components, focus on faster setting adhesive solutions.

The rising demand for consumer electronics is projected to drive the growth of the polyamide hot melt adhesives market in the coming years. Consumer electronics encompass devices designed for everyday use, reflecting advancements in technology, increased internet connectivity, and the widespread adoption of smart devices to meet diverse consumer needs. Polyamide hot melt adhesives offer high thermal stability, excellent electrical insulation, and strong, durable bonds that endure mechanical stress and temperature changes, ensuring reliable and long-lasting assembly of components. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported that total electronic equipment production in Japan reached 771,457 units. Furthermore, consumer electronics production in May 2023 rose to 32,099 units from 25,268 units in May 2022. Thus, the growing demand for consumer electronics is fueling the polyamide hot melt adhesives market.

Key players in the polyamide hot melt adhesives market are developing hot melt label adhesive solutions to enhance durability, performance, and versatility across various labeling applications. These adhesives are activated by heat to apply labels effectively. For instance, in April 2023, Avery Dennison and Dow, a U.S.-based materials science and digital identification company, introduced an innovative hot melt label adhesive designed to improve packaging recyclability. This adhesive facilitates the mechanical recycling of polyolefin filmic labels and polypropylene (PP) or polyethylene (PE) packaging in a single stream, treating them as a mono-material. It is the first olefinic hot melt adhesive specifically designed for chilled food applications within the labeling market and has received Recyclass approval for recycling in the high-density polyethylene (HDPE) colored stream in European markets.

In May 2025, Lisheng, a China-based specialty chemical manufacturer, partnered with ADINO Group GmbH to create a joint venture named Shandong ADINO New Materials Co. Through this partnership, Lisheng and ADINO seek to advance high-performance hot melt adhesive technologies, particularly polyamide (PA) hot melt adhesives, by integrating Lisheng’s manufacturing expertise and local market presence with ADINO’s proprietary adhesive formulations, thereby improving product performance for demanding industrial applications. ADINO Group GmbH is a Germany-based adhesives technology company focused on the development of advanced adhesive solutions and high-performance hot melt systems.

Major companies operating in the polyamide hot melt adhesives market are BASF SE, Henkel AG & Co. KGaA, H.B. Fuller Company, Arkema S.A., DuPont, Evonik Industries, Huntsman Corporation, 3M Company, Bostik, Beardow Adams Ltd., Jowat SE, Bühnen GmbH & Co. KG, Palmetto Adhesives Company, Schaetti, Sipol, Shanghai Tianyang Hot Melt Adhesive Co., Ltd., Huate Bonding Material, Avery Dennison Corporation, Paramelt B.V., Tex Year Industries Inc., Nan Pao Resins Chemical Co., Ltd., DELO Industrie Klebstoffe GmbH & Co. KGaA.

Asia-Pacific was the largest region in the polyamide hot melt adhesives market in 2025, and is expected to be the fastest-growing region in the forecast period. The regions covered in the polyamide hot melt adhesives market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the polyamide hot melt adhesives market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The polyamide hot melt adhesives market consists of sales of aliphatic polyamide, aromatic polyamide, semi-aromatic polyamide, and modified polyamide. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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