Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset - Global Strategic Business Report

The global market for Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset was estimated at US$42.1 Billion in 2024 and is projected to reach US$86.9 Billion by 2030, growing at a CAGR of 12.8% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset market.

Global Wi-Fi 6, Wi-Fi 6E, and Wi-Fi 7 Chipset Market - Key Trends & Drivers Summarized

Why Are Wi-Fi 6E and Wi-Fi 7 Chipsets Becoming Critical for Next-Generation Wireless Connectivity?

As wireless networking continues to evolve, the introduction of Wi-Fi 6E and Wi-Fi 7 chipsets is setting new benchmarks for ultra-fast and reliable connectivity. Wi-Fi 6E extends the capabilities of Wi-Fi 6 by utilizing the newly available 6 GHz spectrum, reducing network congestion and enabling higher bandwidth applications. This additional spectrum provides faster speeds, lower latency, and improved network performance in crowded environments. Meanwhile, Wi-Fi 7, also known as 802.11be, represents the next major advancement in wireless networking, offering multi-gigabit speeds, improved efficiency, and ultra-low latency for emerging applications such as AR/VR, cloud gaming, and industrial automation. With the increasing demand for high-performance wireless networks in homes, enterprises, and public spaces, Wi-Fi 6E and Wi-Fi 7 chipsets are becoming essential components in routers, access points, and connected devices, driving the future of seamless digital connectivity.

How Are Wi-Fi 6E and Wi-Fi 7 Chipsets Enhancing Performance for High-Demand Applications?

Wi-Fi 6E and Wi-Fi 7 chipsets introduce several key technological enhancements that significantly improve wireless performance. Wi-Fi 6E expands the available spectrum by adding up to 1,200 MHz of bandwidth in the 6 GHz band, reducing interference and enabling higher-speed data transfer. This is particularly beneficial for businesses and high-density environments where multiple devices require stable and fast connections. Wi-Fi 7 takes performance a step further by introducing Multi-Link Operation (MLO), which allows devices to connect across multiple frequency bands simultaneously, optimizing speed and reliability. Additionally, Wi-Fi 7 leverages wider 320 MHz channels, increasing throughput and enabling ultra-fast wireless data transmission for bandwidth-intensive applications such as 8K streaming, AI-powered cloud computing, and real-time industrial automation. These technological advancements position Wi-Fi 6E and Wi-Fi 7 chipsets as crucial enablers of next-generation wireless communication.

What Challenges Are Hindering the Market Adoption of Wi-Fi 6E and Wi-Fi 7 Chipsets?

Despite their potential, the adoption of Wi-Fi 6E and Wi-Fi 7 chipsets faces challenges related to regulatory approvals, infrastructure upgrades, and device compatibility. The rollout of the 6 GHz spectrum for Wi-Fi 6E varies across different countries, with some regions still working on regulatory clearances. This affects global adoption and limits market expansion in certain areas. Additionally, upgrading to Wi-Fi 6E and Wi-Fi 7 requires new networking hardware, including routers, access points, and client devices, leading to higher costs for businesses and consumers. Device compatibility is another challenge, as older hardware may not support these advanced technologies, requiring users to invest in next-generation devices to experience the full benefits. Addressing these challenges will require collaborative efforts from chipset manufacturers, regulatory bodies, and device makers to accelerate adoption and ensure a seamless transition to next-generation Wi-Fi standards.

What Factors Are Driving the Growth of the Wi-Fi 6E and Wi-Fi 7 Chipset Market?

The growth in the Wi-Fi 6E and Wi-Fi 7 chipset market is driven by several factors, including the increasing demand for high-speed internet, the expansion of smart home and IoT ecosystems, and advancements in cloud-based and real-time applications. The surge in remote work, online gaming, and immersive content consumption has heightened the need for ultra-fast and low-latency connectivity, accelerating the adoption of next-generation Wi-Fi chipsets. Enterprises and industrial facilities are also investing in Wi-Fi 6E and Wi-Fi 7 infrastructure to support digital transformation initiatives, including automation, edge computing, and AI-driven analytics. The rapid proliferation of connected devices, from smart home appliances to autonomous vehicles, has further fueled demand for advanced Wi-Fi chipsets that can handle massive device connectivity with minimal interference. As regulatory approvals expand and chipset manufacturers continue to innovate, the adoption of Wi-Fi 6E and Wi-Fi 7 is expected to accelerate, shaping the future of wireless networking with unprecedented speed and reliability.

Scope of Study:

The report analyzes the Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset market in terms of units by the following Segments, and Geographic Regions/Countries:

• Segments: Chipset (Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7); Device (WLAN Infrastructure Devices, Consumer Devices, Wireless Cameras, Industrial IoT Devices, Connected Vehicles, Drones, Others); Application (Residential / Consumers, Commercial, Industrial, Smart City, Transportation & Logistics, Government & Defense, Others)
• Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Key Insights:

• Market Growth: Understand the significant growth trajectory of the Wi-Fi 6 segment, which is expected to reach US$47.1 Billion by 2030 with a CAGR of a 11.6%. The Wi-Fi 6E segment is also set to grow at 14.0% CAGR over the analysis period.
• Regional Analysis: Gain insights into the U.S. market, estimated at $11.1 Billion in 2024, and China, forecasted to grow at an impressive 12.1% CAGR to reach $13.6 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Why You Should Buy This Report:

• Detailed Market Analysis: Access a thorough analysis of the Global Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset Market, covering all major geographic regions and market segments.
• Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
• Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset Market.
• Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

• How is the Global Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset Market expected to evolve by 2030?
• What are the main drivers and restraints affecting the market?
• Which market segments will grow the most over the forecast period?
• How will market shares for different regions and segments change by 2030?
• Who are the leading players in the market, and what are their prospects?

Report Features:

• Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
• In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
• Company Profiles: Coverage of players such as Advanced Micro Devices, Inc. (AMD), Broadcom Inc., Celeno Communications, Cypress Semiconductor Corporation, Intel Corporation and more.
• Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Some of the 37 companies featured in this Wi-Fi 6, Wi-Fi 6E and Wi-Fi 7 Chipset market report include:

• Advanced Micro Devices, Inc. (AMD)
• Broadcom Inc.
• Celeno Communications
• Cypress Semiconductor Corporation
• Intel Corporation
• Marvell Technology Group Ltd.
• MaxLinear, Inc.
• MediaTek Inc.
• Microchip Technology Inc.
• NXP Semiconductors N.V.
• ON Semiconductor Corporation
• Peraso Technologies, Inc.
• Qualcomm Technologies, Inc.
• Qorvo, Inc.
• Realtek Semiconductor Corp.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• STMicroelectronics N.V.
• Synaptics Incorporated
• Texas Instruments Incorporated

This edition integrates the latest global trade and economic shifts as of June 2025 into comprehensive market analysis. Key updates include:

• Tariff and Trade Impact: Insights into global tariff negotiations across 180+ countries, with analysis of supply chain turbulence, sourcing disruptions, and geographic realignment. Special focus on 2025 as a pivotal year for trade tensions, including updated perspectives on the Trump-era tariffs.
• Adjusted Forecasts and Analytics: Revised global and regional market forecasts through 2030, incorporating tariff effects, economic uncertainty, and structural changes in globalization. Includes segmentation by product, technology, type, material, distribution channel, application, and end-use, with historical analysis since 2015.
• Strategic Market Dynamics: Evaluation of revised market prospects, regional outlooks, and key economic indicators such as population and urbanization trends.
• Innovation & Technology Trends: Latest developments in product and process innovation, emerging technologies, and key industry drivers shaping the competitive landscape.
• Competitive Intelligence: Updated global market share estimates for 2025, competitive positioning of major players (Strong/Active/Niche/Trivial), and refined focus on leading global brands and core players.
• Expert Insight & Commentary: Strategic analysis from economists, trade experts, and domain specialists to contextualize market shifts and identify emerging opportunities.
• Complimentary Update: Buyers receive a free July 2025 update with finalized tariff impacts, new trade agreement effects, revised projections, and expanded country-level coverage.