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Semiconductor IC Design, Manufacturing, Packaging & Testing Market - Global Forecast to 2030- Product Image
Semiconductor IC Design, Manufacturing, Packaging & Testing Market - Global Forecast to 2030- Product Image
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Semiconductor IC Design, Manufacturing, Packaging & Testing Market - Global Forecast to 2030

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    Report

  • 195 Pages
  • May 2025
  • Region: Global
  • 360iResearch™
  • ID: 6082981
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The semiconductor integrated circuit (IC) industry underpins the digital economy, powering devices from smartphones and data centers to advanced driver-assistance systems and wearable health monitors. Over recent decades, relentless innovation in design processes, manufacturing techniques, packaging solutions, and testing protocols has driven node scaling from planar transistors to sub-10 nanometer technologies. Simultaneously, emerging applications in artificial intelligence, 5G communications, industrial automation, and healthcare have accelerated demand for specialized ICs with stringent performance, power, and reliability requirements. This ecosystem thrives on complex global supply chains that coordinate research and development, wafer fabrication, advanced lithography, packaging methodologies, and rigorous quality assurance. Today, industry leaders confront an inflection point: geopolitical tensions, evolving trade policies, and sustainability mandates are reshaping strategies across design houses, foundries, assembly partners, and test service providers. In this executive summary, we explore the pivotal trends and forces redefining the semiconductor IC landscape, offering insights to guide strategic decision-making and investment priorities in a climate defined by rapid technological shifts and policy uncertainty.

Transformative Shifts Reshaping the Semiconductor Landscape

The semiconductor landscape is undergoing profound transformation driven by technological breakthroughs and evolving end-market demands. Shrinking feature sizes beyond CMOS, migration to FinFET and Gate-All-Around FET architectures, and the adoption of extreme ultraviolet lithography have rekindled Moore’s Law ambitions. At the same time, advanced packaging innovations-from 2.5D/3D integration to wafer-level and fan-out technologies-are unlocking unprecedented performance and form-factor flexibility. In parallel, the ascendancy of artificial intelligence workloads has spurred demand for high-performance GPUs, domain-specific accelerators, and low-power edge inference chips. Connectivity trends such as 5G, Wi-Fi 6E, and emerging 6G research inject fresh momentum into RF front-end design, while automotive electronics expands its footprint with ADAS, infotainment, and power management solutions built on robust reliability standards. Meanwhile, healthcare applications leverage imaging systems and wearable trackers, and industrial automation harnesses robotics and control systems. These converging shifts compel stakeholders to embrace agile supply chains, diversify fabrication and packaging capacities, and invest strategically in differentiated IP to maintain competitive advantage.

Cumulative Impact of United States Tariffs 2025 on Semiconductor Value Chains

The introduction of new tariffs on semiconductor components and equipment in 2025 has generated material effects across design, manufacturing, packaging, and testing. Heightened duties on critical raw materials and capital expenditure equipment have elevated production costs at foundries and backend assembly sites, prompting leading foundries to pass incremental expenses onto fabless partners. Tariffs on imported test fixtures and probe cards have extended validation cycles and increased barriers for new entrants, while constraints on advanced packaging tools have slowed deployment of 3D integration and fan-out technologies. In response, many design teams are re-optimizing architectures to mitigate cost pressures, selecting alternative materials and prioritizing standard cell libraries that align with in-region manufacturing capabilities. Simultaneously, supply chain reconfiguration efforts have accelerated, with stakeholders exploring nearshoring, dual-sourcing, and strategic inventory buffers. While these measures safeguard continuity, they introduce complexity in logistics and inventory management. Ultimately, the 2025 tariff environment underscores the critical need for adaptable partnerships, transparent cross-border collaboration, and proactive scenario planning to preserve innovation velocity and supply resilience.

Key Segmentation Insights Driving Market Dynamics

A granular view of market segmentation reveals nuanced drivers shaping each domain. Based on technology node, offerings range from Beyond CMOS research initiatives through established FinFET and planar processes to advanced Gate-All-Around FET platforms, with sub-10 nanometer technologies further disaggregated into process nodes at 3 nm, 5 nm, and 7 nm. In end-use industries, demand patterns span automotive electronics with modules for ADAS, infotainment, and power management; consumer electronics featuring smartphones, tablets, and wearables; healthcare encompassing imaging systems, medical devices, and wearable health tracking; and telecommunications covering networking equipment alongside wireless communication technologies. Device type segmentation includes analog ICs such as amplifiers and power management chips, logic ICs, memory ICs like DRAM and flash memory, and microprocessors covering central processing units and graphics processing units. Material type differentiation highlights compound semiconductors, gallium nitride, silicon carbide, and traditional silicon substrates. Applications range from data centers with networking hardware and servers to industrial automation via control systems and robotics, mined data processing, and wireless communication networks. Manufacturing process insights cover deposition methods, etching, lithography, and wafer production, while packaging types span 2.5D/3D IC integration, fan-out, flip chip, and wafer-level approaches. Finally, testing techniques such as boundary scan, burn-in, functional, and parametric testing, alongside electric characteristics focused on high frequency, high performance, and low power, complete the segmentation landscape.

Regional Dynamics: Uncovering Growth Patterns across Major Markets

Across the Americas, supply chain reinvention is well underway, with substantial investment flows into advanced packaging hubs and IDMs expanding fab footprints in the United States and Mexico. Stakeholders benefit from supportive incentives but must navigate localized workforce constraints and logistical bottlenecks. In Europe, Middle East & Africa, collaborative R&D initiatives stride forward, bolstered by government funding for strategic autonomy in chipmaking and targeted support for compound semiconductor clusters. Yet, harmonizing standards across diverse regulatory environments demands close coordination. Asia-Pacific continues to command the largest share of manufacturing capacity, led by the scale and sophistication of facilities in Taiwan, South Korea, Japan, and China. Rapid growth in consumer electronics, telecommunications infrastructure, and electric vehicles sustains robust demand, while regional consolidation maximizes operational synergies and cost efficiencies. Taken together, these regional nuances underscore the importance of tailored market entry and expansion strategies that align local strengths with global end-market requirements.

Competitive Landscape: Insights into Leading Semiconductor Players

The competitive landscape is anchored by foundry giants and system-level innovators. Advanced Micro Devices, Inc. drives high-performance computing segments through CPU and GPU leadership, while Analog Devices, Inc. excels in signal processing and precision analog solutions. ASE Technology Holding Co., Ltd. and Taiwan Semiconductor Manufacturing Company, Ltd. leverage advanced packaging and process expertise to deliver differentiated integration capabilities. Broadcom Inc. offers a broad portfolio of networking and connectivity ICs, paralleled by Qualcomm Incorporated’s dominance in mobile platforms and wireless modems. Infineon Technologies AG and NXP Semiconductors N.V. capitalize on strengths in automotive and industrial controls, whereas Intel Corporation’s IDM model remains central to roadmap diversification. Memory specialists Micron Technology, Inc. and SK Hynix Inc. pursue performance and density improvements, and Samsung Electronics Co., Ltd. balances memory leadership with logic foundry ambitions. ON Semiconductor Corporation and Texas Instruments Incorporated sustain strong footprints in discrete and analog segments, while Renesas Electronics Corporation focuses on microcontrollers for automotive and IoT applications. STMicroelectronics N.V. advances across MEMS, sensors, and power electronics, rounding out a dynamic ecosystem driven by R&D investments and strategic partnerships.

Actionable Recommendations for Industry Leaders to Navigate Disruption

To capitalize on emerging opportunities and mitigate dislocation risks, industry leaders should: - Cultivate flexible partnerships across foundries and assembly houses, enabling rapid shifts in capacity allocation and diversification of supplier risk. - Invest in design-for-manufacturability initiatives aligned with advanced packaging roadmaps, ensuring IP portability across process nodes and backend technologies. - Prioritize supply chain visibility and digital twin frameworks to anticipate tariff impacts, raw material shortages, and logistics disruptions. - Accelerate development of low-power, high-frequency IC architectures that address AI inference, 5G infrastructure, and next-generation automotive requirements. - Expand regional R&D and prototyping centers to foster collaboration with customers, regulators, and academia, aligning product roadmaps with localized standards and incentives. - Embed sustainability criteria across material selection, energy usage, and end-of-life recycling programs to meet environmental mandates and stakeholder expectations.

Conclusion: Charting the Future of Semiconductor Innovation

The semiconductor IC design, manufacturing, packaging, and testing ecosystem stands at a crossroads defined by unprecedented technological promise and geopolitical complexity. Leaders who deftly navigate tariff landscapes, embrace modular, node-agnostic design strategies, and invest selectively in advanced packaging will capture new growth vectors in AI, connectivity, automotive, and healthcare. Regional diversification strategies, underpinned by robust supply chain analytics and digital platforms, will enhance resilience against policy shocks and material shortages. Collaboration across the value chain-from fabless innovators to assembly and test specialists-remains essential to accelerate time-to-market and optimize total cost of ownership. By embedding sustainability, workforce development, and process standardization into core business models, organizations can future-proof operations and cultivate long-term stakeholder trust. As the industry transitions toward sub-10 nanometer nodes and heterogeneous integration, proactive engagement with evolving standards bodies and ecosystem consortia will ensure interoperability and drive collective innovation.

Market Segmentation & Coverage

This research report categorizes the Semiconductor IC Design, Manufacturing, Packaging & Testing Market to forecast the revenues and analyze trends in each of the following sub-segmentations:

  • Beyond CMOS
  • FinFET Process
  • Gate-All-Around FET
  • Planar Process
  • Sub-10 Nanometer Technologies
    • 3nm
    • 5nm
    • 7nm
  • Automotive Electronics
    • ADAS
    • Infotainment Systems
    • Power Management
  • Consumer Electronics
    • Smartphones
    • Tablets
    • Wearables
  • Healthcare
    • Imaging Systems
    • Medical Devices
    • Wearable Health Tracking
  • Telecommunications
    • Networking Equipment
    • Wireless Communication Technologies
  • Analog ICs
    • Amplifiers
    • Power Management
  • Logic ICs
  • Memory ICs
    • DRAM
    • Flash Memory
  • Microprocessors
    • Central Processing Units
    • Graphics Processing Units
  • Compound Semiconductors
  • Gallium Nitride
  • Silicon
  • Silicon Carbide
  • Data Centers
    • Networking Hardware
    • Servers
  • Industrial Automation
    • Control Systems
    • Robotics
  • Mined Data Processing
  • Wireless Communication
  • Deposition Methods
  • Etching
  • Lithography
  • Wafer Production
  • 2.5D/3D IC
  • Fan-Out
  • Flip Chip
  • Wafer-Level Packaging
  • Boundary Scan Testing
  • Burn-In Testing
  • Functional Testing
  • Parametric Testing
  • High Frequency
  • High Performance
  • Low Power

This research report categorizes the Semiconductor IC Design, Manufacturing, Packaging & Testing Market to forecast the revenues and analyze trends in each of the following sub-regions:

  • Americas
    • Argentina
    • Brazil
    • Canada
    • Mexico
    • United States
      • California
      • Florida
      • Illinois
      • New York
      • Ohio
      • Pennsylvania
      • Texas
  • Asia-Pacific
    • Australia
    • China
    • India
    • Indonesia
    • Japan
    • Malaysia
    • Philippines
    • Singapore
    • South Korea
    • Taiwan
    • Thailand
    • Vietnam
  • Europe, Middle East & Africa
    • Denmark
    • Egypt
    • Finland
    • France
    • Germany
    • Israel
    • Italy
    • Netherlands
    • Nigeria
    • Norway
    • Poland
    • Qatar
    • Russia
    • Saudi Arabia
    • South Africa
    • Spain
    • Sweden
    • Switzerland
    • Turkey
    • United Arab Emirates
    • United Kingdom

This research report categorizes the Semiconductor IC Design, Manufacturing, Packaging & Testing Market to delves into recent significant developments and analyze trends in each of the following companies:

  • Advanced Micro Devices, Inc. (AMD)
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • Broadcom Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
  • Texas Instruments Incorporated

This product will be delivered within 1-3 business days.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. Market Sizing & Forecasting
5. Market Dynamics
6. Market Insights
6.1. Porter’s Five Forces Analysis
6.2. PESTLE Analysis
7. Cumulative Impact of United States Tariffs 2025
8. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Technology Node
8.1. Introduction
8.2. Beyond CMOS
8.3. FinFET Process
8.4. Gate-All-Around FET
8.5. Planar Process
8.6. Sub-10 Nanometer Technologies
8.6.1. 3nm
8.6.2. 5nm
8.6.3. 7nm
9. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by End-Use Industry
9.1. Introduction
9.2. Automotive Electronics
9.2.1. ADAS
9.2.2. Infotainment Systems
9.2.3. Power Management
9.3. Consumer Electronics
9.3.1. Smartphones
9.3.2. Tablets
9.3.3. Wearables
9.4. Healthcare
9.4.1. Imaging Systems
9.4.2. Medical Devices
9.4.3. Wearable Health Tracking
9.5. Telecommunications
9.5.1. Networking Equipment
9.5.2. Wireless Communication Technologies
10. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Device Type
10.1. Introduction
10.2. Analog ICs
10.2.1. Amplifiers
10.2.2. Power Management
10.3. Logic ICs
10.4. Memory ICs
10.4.1. DRAM
10.4.2. Flash Memory
10.5. Microprocessors
10.5.1. Central Processing Units
10.5.2. Graphics Processing Units
11. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Material Type
11.1. Introduction
11.2. Compound Semiconductors
11.3. Gallium Nitride
11.4. Silicon
11.5. Silicon Carbide
12. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Application
12.1. Introduction
12.2. Data Centers
12.2.1. Networking Hardware
12.2.2. Servers
12.3. Industrial Automation
12.3.1. Control Systems
12.3.2. Robotics
12.4. Mined Data Processing
12.5. Wireless Communication
13. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Manufacturing Process
13.1. Introduction
13.2. Deposition Methods
13.3. Etching
13.4. Lithography
13.5. Wafer Production
14. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Packaging Type
14.1. Introduction
14.2. 2.5D/3D IC
14.3. Fan-Out
14.4. Flip Chip
14.5. Wafer-Level Packaging
15. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Testing Technique
15.1. Introduction
15.2. Boundary Scan Testing
15.3. Burn-In Testing
15.4. Functional Testing
15.5. Parametric Testing
16. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Electric Characteristics
16.1. Introduction
16.2. High Frequency
16.3. High Performance
16.4. Low Power
17. Americas Semiconductor IC Design, Manufacturing, Packaging & Testing Market
17.1. Introduction
17.2. Argentina
17.3. Brazil
17.4. Canada
17.5. Mexico
17.6. United States
18. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging & Testing Market
18.1. Introduction
18.2. Australia
18.3. China
18.4. India
18.5. Indonesia
18.6. Japan
18.7. Malaysia
18.8. Philippines
18.9. Singapore
18.10. South Korea
18.11. Taiwan
18.12. Thailand
18.13. Vietnam
19. Europe, Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging & Testing Market
19.1. Introduction
19.2. Denmark
19.3. Egypt
19.4. Finland
19.5. France
19.6. Germany
19.7. Israel
19.8. Italy
19.9. Netherlands
19.10. Nigeria
19.11. Norway
19.12. Poland
19.13. Qatar
19.14. Russia
19.15. Saudi Arabia
19.16. South Africa
19.17. Spain
19.18. Sweden
19.19. Switzerland
19.20. Turkey
19.21. United Arab Emirates
19.22. United Kingdom
20. Competitive Landscape
20.1. Market Share Analysis, 2024
20.2. FPNV Positioning Matrix, 2024
20.3. Competitive Analysis
20.3.1. Advanced Micro Devices, Inc. (AMD)
20.3.2. Analog Devices, Inc.
20.3.3. ASE Technology Holding Co., Ltd.
20.3.4. Broadcom Inc.
20.3.5. Infineon Technologies AG
20.3.6. Intel Corporation
20.3.7. Micron Technology, Inc.
20.3.8. NXP Semiconductors N.V.
20.3.9. ON Semiconductor Corporation
20.3.10. Qualcomm Incorporated
20.3.11. Renesas Electronics Corporation
20.3.12. Samsung Electronics Co., Ltd.
20.3.13. SK Hynix Inc.
20.3.14. STMicroelectronics N.V.
20.3.15. Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
20.3.16. Texas Instruments Incorporated
21. ResearchAI
22. ResearchStatistics
23. ResearchContacts
24. ResearchArticles
25. Appendix
List of Figures
FIGURE 1. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET MULTI-CURRENCY
FIGURE 2. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET MULTI-LANGUAGE
FIGURE 3. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET RESEARCH PROCESS
FIGURE 4. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 5. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY REGION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 6. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 7. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2024 VS 2030 (%)
FIGURE 8. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 9. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2024 VS 2030 (%)
FIGURE 10. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 11. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2024 VS 2030 (%)
FIGURE 12. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 13. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2030 (%)
FIGURE 14. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 15. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2024 VS 2030 (%)
FIGURE 16. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 17. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2024 VS 2030 (%)
FIGURE 18. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 19. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2030 (%)
FIGURE 20. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 21. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2024 VS 2030 (%)
FIGURE 22. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 23. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2024 VS 2030 (%)
FIGURE 24. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 25. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 26. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 27. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2024 VS 2030 (%)
FIGURE 28. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 29. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 30. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 31. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
FIGURE 32. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
FIGURE 33. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SHARE, BY KEY PLAYER, 2024
FIGURE 34. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET, FPNV POSITIONING MATRIX, 2024
List of Tables
TABLE 1. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
TABLE 3. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 6. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 7. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BEYOND CMOS, BY REGION, 2018-2030 (USD MILLION)
TABLE 8. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FINFET PROCESS, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY GATE-ALL-AROUND FET, BY REGION, 2018-2030 (USD MILLION)
TABLE 10. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PLANAR PROCESS, BY REGION, 2018-2030 (USD MILLION)
TABLE 11. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
TABLE 12. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 3NM, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 5NM, BY REGION, 2018-2030 (USD MILLION)
TABLE 14. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 7NM, BY REGION, 2018-2030 (USD MILLION)
TABLE 15. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 16. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 17. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 18. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADAS, BY REGION, 2018-2030 (USD MILLION)
TABLE 19. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY POWER MANAGEMENT, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 22. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 23. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2030 (USD MILLION)
TABLE 24. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TABLETS, BY REGION, 2018-2030 (USD MILLION)
TABLE 25. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WEARABLES, BY REGION, 2018-2030 (USD MILLION)
TABLE 26. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 27. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
TABLE 28. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IMAGING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
TABLE 29. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
TABLE 30. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WEARABLE HEALTH TRACKING, BY REGION, 2018-2030 (USD MILLION)
TABLE 31. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 32. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
TABLE 33. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY NETWORKING EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
TABLE 34. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WIRELESS COMMUNICATION TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
TABLE 35. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 36. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 37. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 38. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AMPLIFIERS, BY REGION, 2018-2030 (USD MILLION)
TABLE 39. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY POWER MANAGEMENT, BY REGION, 2018-2030 (USD MILLION)
TABLE 40. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 41. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY LOGIC ICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 42. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 43. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DRAM, BY REGION, 2018-2030 (USD MILLION)
TABLE 44. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FLASH MEMORY, BY REGION, 2018-2030 (USD MILLION)
TABLE 45. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 46. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, BY REGION, 2018-2030 (USD MILLION)
TABLE 47. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CENTRAL PROCESSING UNITS, BY REGION, 2018-2030 (USD MILLION)
TABLE 48. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY GRAPHICS PROCESSING UNITS, BY REGION, 2018-2030 (USD MILLION)
TABLE 49. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 50. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 51. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COMPOUND SEMICONDUCTORS, BY REGION, 2018-2030 (USD MILLION)
TABLE 52. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY GALLIUM NITRIDE, BY REGION, 2018-2030 (USD MILLION)
TABLE 53. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SILICON, BY REGION, 2018-2030 (USD MILLION)
TABLE 54. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SILICON CARBIDE, BY REGION, 2018-2030 (USD MILLION)
TABLE 55. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 56. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, BY REGION, 2018-2030 (USD MILLION)
TABLE 57. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY NETWORKING HARDWARE, BY REGION, 2018-2030 (USD MILLION)
TABLE 58. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SERVERS, BY REGION, 2018-2030 (USD MILLION)
TABLE 59. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 60. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 61. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONTROL SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
TABLE 62. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ROBOTICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 63. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 64. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MINED DATA PROCESSING, BY REGION, 2018-2030 (USD MILLION)
TABLE 65. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WIRELESS COMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 66. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 67. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEPOSITION METHODS, BY REGION, 2018-2030 (USD MILLION)
TABLE 68. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ETCHING, BY REGION, 2018-2030 (USD MILLION)
TABLE 69. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY LITHOGRAPHY, BY REGION, 2018-2030 (USD MILLION)
TABLE 70. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER PRODUCTION, BY REGION, 2018-2030 (USD MILLION)
TABLE 71. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 72. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 2.5D/3D IC, BY REGION, 2018-2030 (USD MILLION)
TABLE 73. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FAN-OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 74. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
TABLE 75. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER-LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
TABLE 76. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 77. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BOUNDARY SCAN TESTING, BY REGION, 2018-2030 (USD MILLION)
TABLE 78. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BURN-IN TESTING, BY REGION, 2018-2030 (USD MILLION)
TABLE 79. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FUNCTIONAL TESTING, BY REGION, 2018-2030 (USD MILLION)
TABLE 80. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PARAMETRIC TESTING, BY REGION, 2018-2030 (USD MILLION)
TABLE 81. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 82. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HIGH FREQUENCY, BY REGION, 2018-2030 (USD MILLION)
TABLE 83. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HIGH PERFORMANCE, BY REGION, 2018-2030 (USD MILLION)
TABLE 84. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY LOW POWER, BY REGION, 2018-2030 (USD MILLION)
TABLE 85. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 86. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 87. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 88. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 89. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 90. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 91. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 92. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 93. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 94. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 95. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 96. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 97. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 98. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 99. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 100. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 101. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 102. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 103. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 104. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 105. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 106. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 107. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 108. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 109. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 110. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 111. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 112. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 113. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 114. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 115. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 116. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 117. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 118. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 119. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 120. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 121. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 122. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 123. ARGENTINA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 124. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 125. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 126. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 127. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 128. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 129. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 130. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 131. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 132. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 133. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 134. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 135. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 136. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 137. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 138. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 139. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 140. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 141. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 142. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 143. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 144. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 145. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 146. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 147. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 148. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 149. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 150. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 151. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 152. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 153. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 154. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 155. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 156. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 157. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 158. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 159. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 160. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 161. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 162. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 163. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 164. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 165. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 166. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 167. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 168. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 169. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 170. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 171. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 172. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 173. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 174. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 175. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 176. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 177. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 178. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 179. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 180. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 181. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 182. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 183. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 184. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 185. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 186. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 187. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 188. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 189. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 190. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 191. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 192. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 193. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 194. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 195. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 196. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 197. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 198. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 199. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 200. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 201. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 202. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 203. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 204. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 205. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 206. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 207. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 208. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 209. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 210. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 211. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 212. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 213. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 214. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 215. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 216. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MANUFACTURING PROCESS, 2018-2030 (USD MILLION)
TABLE 217. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
TABLE 218. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TESTING TECHNIQUE, 2018-2030 (USD MILLION)
TABLE 219. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ELECTRIC CHARACTERISTICS, 2018-2030 (USD MILLION)
TABLE 220. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 221. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TECHNOLOGY NODE, 2018-2030 (USD MILLION)
TABLE 222. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SUB-10 NANOMETER TECHNOLOGIES, 2018-2030 (USD MILLION)
TABLE 223. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END-USE INDUSTRY, 2018-2030 (USD MILLION)
TABLE 224. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 225. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
TABLE 226. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, 2018-2030 (USD MILLION)
TABLE 227. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TELECOMMUNICATIONS, 2018-2030 (USD MILLION)
TABLE 228. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEVICE TYPE, 2018-2030 (USD MILLION)
TABLE 229. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG ICS, 2018-2030 (USD MILLION)
TABLE 230. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY ICS, 2018-2030 (USD MILLION)
TABLE 231. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MICROPROCESSORS, 2018-2030 (USD MILLION)
TABLE 232. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MATERIAL TYPE, 2018-2030 (USD MILLION)
TABLE 233. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 234. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DATA CENTERS, 2018-2030 (USD MILLION)
TABLE 235. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRIAL AUTOMATION, 2018-2030 (USD MILLION)
TABLE 236. AUSTRALIA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET

Companies Mentioned

  • Advanced Micro Devices, Inc. (AMD)
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • Broadcom Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
  • Texas Instruments Incorporated

Methodology

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