The global market for Semiconductor Etching Equipment was valued at US$14.1 Billion in 2024 and is projected to reach US$20.4 Billion by 2030, growing at a CAGR of 6.3% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Semiconductor Etching Equipment market.
Segments: Type (Wet Etch Equipment, Dry Etch Equipment); Product Type (High-density Etch Equipment, Low-density Etch Equipment); Etching Film Type (Conductor Etching, Dielectric Etching, Polysilicon Etching); Application (MEMS Application, Power Devices Application, Logic ICs Application, Memory Application); End-Use (Foundry End-Use, OEM End-Use, IDM End-Use).
Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
The analysts continuously track trade developments worldwide, drawing insights from leading global economists and over 200 industry and policy institutions, including think tanks, trade organizations, and national economic advisory bodies. This intelligence is integrated into forecasting models to provide timely, data-driven analysis of emerging risks and opportunities.
Global 'Semiconductor Etching Equipment' Market - Key Trends & Drivers Summarized
Why Is Etching Equipment at the Core of the Next Semiconductor Revolution?
As semiconductor devices continue to scale down in size while increasing in complexity, etching equipment has become an essential pillar in advanced chip manufacturing. This equipment plays a critical role in transferring intricate circuit patterns onto wafers, enabling the development of cutting-edge nodes at 5nm and below. Etching is no longer a straightforward subtractive process - it now demands extreme precision, selectivity, and uniformity to accommodate 3D architectures such as FinFETs and gate-all-around (GAA) transistors. Dry (plasma) etching and wet etching systems are both evolving to address diverse patterning challenges in logic, memory, and power devices. As leading foundries and integrated device manufacturers (IDMs) shift toward EUV lithography, etching tools must complement these advancements with high-aspect-ratio processing and minimal defect rates. Furthermore, heterogeneous integration and advanced packaging are expanding the utility of etching in interposer and TSV (through-silicon via) formation. The growing demand for AI chips, automotive-grade semiconductors, and IoT sensors has placed enormous pressure on etching systems to deliver repeatability and productivity under strict environmental controls. Equipment makers are racing to innovate process chambers, gas delivery systems, and endpoint detection technologies to stay ahead in a hypercompetitive market. These capabilities are no longer optional - they are essential enablers for future node transitions.How Are Equipment Suppliers Innovating to Meet Future Node Demands?
The rapid miniaturization of semiconductor components requires etching equipment manufacturers to push the limits of precision, material compatibility, and chamber design. Leading suppliers are investing heavily in atomic layer etching (ALE) technology, which enables angstrom-level accuracy by controlling etching at the atomic scale. ALE is particularly crucial in minimizing line edge roughness and achieving ultra-thin features in DRAM, NAND, and advanced logic nodes. Furthermore, process modularity and multi-patterning compatibility have become key focus areas, as fabs look for flexible tools that can adapt to varying design rules. Suppliers are also incorporating AI and machine learning into etching systems to optimize process parameters, predict maintenance, and ensure uniformity across wafers. Hybrid etching platforms that integrate plasma and wet processing are gaining traction to meet specific use cases like etching of compound semiconductors (e.g., GaN, SiC). In addition, chamber materials are being redesigned to minimize contamination and particle generation, which is critical for achieving yield at smaller geometries. As fabs seek greater throughput without sacrificing control, high-density plasma (HDP) systems with advanced RF control are being rolled out. These innovations are reshaping competitive dynamics in the semiconductor equipment market, with differentiation increasingly tied to software, process integration, and customization capabilities rather than hardware alone.How Are Regional Policies, Supply Chain Changes, and Market Dynamics Shaping the Landscape?
Global shifts in semiconductor supply chains and industrial policy are having a profound effect on the etching equipment market. Geopolitical tensions have led to a reconfiguration of manufacturing hubs, with the U.S., EU, South Korea, Japan, and China investing billions into domestic chipmaking capabilities. This regionalization is increasing demand for localized equipment suppliers and strategic technology partnerships. Export restrictions on advanced tools have intensified the push for self-reliance, particularly in China, where homegrown equipment firms are scaling rapidly to replace U.S.-made alternatives. Simultaneously, the expansion of semiconductor fabs worldwide - especially those focused on automotive and edge computing - has opened up new demand pockets for mid-tier and legacy-node etching systems. Moreover, the rise of fabless design models has increased reliance on foundries, further consolidating demand among a few high-volume customers. Environmental regulations are also influencing equipment design, prompting a move toward greener etching processes that reduce toxic by-products and energy consumption. The industry is seeing a surge in refurbishing and upgrading older etching systems to meet sustainability and cost-efficiency goals. Meanwhile, the pandemic-induced component shortages have heightened the focus on equipment resilience, multi-sourcing strategies, and predictive maintenance infrastructure. These trends are redefining supply chain strategies, operational footprints, and partnership models across the value chain.The Growth In The Semiconductor Etching Equipment Market Is Driven By Several Factors
The growth in the semiconductor etching equipment market is driven by several factors including the transition to sub-5nm process nodes, rising adoption of 3D and heterogeneous integration, and the proliferation of end-use applications such as AI, 5G, and automotive electronics. Technological trends like atomic layer etching (ALE), high-density plasma systems, and AI-enabled process optimization are enhancing the performance and precision of etching tools. End-user demand is diversifying, with memory, logic, and power semiconductor manufacturers requiring specialized etch solutions tailored to new architectures and material stacks. The ongoing buildout of semiconductor fabs globally, supported by national semiconductor strategies, is significantly increasing the installed base of etching systems. Furthermore, the shift toward smart manufacturing and Industry 4.0 practices is accelerating demand for software-integrated, self-calibrating, and predictive-capable etching equipment. Changing consumer electronics trends - particularly the growth in wearable tech, autonomous vehicles, and quantum computing - are indirectly expanding market demand by pushing the limits of device miniaturization and complexity. In addition, increasing demand for silicon carbide and gallium nitride devices for high-power and RF applications is driving specialized etching system innovations. These converging factors ensure that etching equipment will remain one of the most vital - and fastest-evolving - segments in the semiconductor manufacturing value chain.Report Scope
The report analyzes the Semiconductor Etching Equipment market, presented in terms of market value (US$ Thousand). The analysis covers the key segments and geographic regions outlined below.Segments: Type (Wet Etch Equipment, Dry Etch Equipment); Product Type (High-density Etch Equipment, Low-density Etch Equipment); Etching Film Type (Conductor Etching, Dielectric Etching, Polysilicon Etching); Application (MEMS Application, Power Devices Application, Logic ICs Application, Memory Application); End-Use (Foundry End-Use, OEM End-Use, IDM End-Use).
Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
Key Insights:
- Market Growth: Understand the significant growth trajectory of the Wet Etch Equipment segment, which is expected to reach US$12.0 Billion by 2030 with a CAGR of a 4.9%. The Dry Etch Equipment segment is also set to grow at 8.6% CAGR over the analysis period.
- Regional Analysis: Gain insights into the U.S. market, valued at $3.7 Billion in 2024, and China, forecasted to grow at an impressive 6.3% CAGR to reach $3.3 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.
Why You Should Buy This Report:
- Detailed Market Analysis: Access a thorough analysis of the Global Semiconductor Etching Equipment Market, covering all major geographic regions and market segments.
- Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
- Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Semiconductor Etching Equipment Market.
- Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.
Key Questions Answered:
- How is the Global Semiconductor Etching Equipment Market expected to evolve by 2030?
- What are the main drivers and restraints affecting the market?
- Which market segments will grow the most over the forecast period?
- How will market shares for different regions and segments change by 2030?
- Who are the leading players in the market, and what are their prospects?
Report Features:
- Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
- In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
- Company Profiles: Coverage of players such as ACM Research, Advanced Micro-Fabrication Equipment Inc. (AMEC), Applied Materials Inc., ASML Holding N.V., Axcelis Technologies Inc. and more.
- Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.
Some of the 39 companies featured in this Semiconductor Etching Equipment market report include:
- ACM Research
- Advanced Micro-Fabrication Equipment Inc. (AMEC)
- Applied Materials Inc.
- ASML Holding N.V.
- Axcelis Technologies Inc.
- Canon Anelva Corporation
- EV Group (EVG)
- Hitachi High-Tech Corporation
- KLA Corporation
- Lam Research Corporation
- Mattson Technology Inc.
- NAURA Technology Group Co., Ltd.
- Oxford Instruments plc
- Panasonic Corporation
- Plasma-Therm LLC
- Samco Inc.
- SEMES Co., Ltd.
- Shibaura Mechatronics Corporation
- SPTS Technologies Ltd.
- Tokyo Electron Limited (TEL)
Tariff Impact Analysis: Key Insights for 2025
Global tariff negotiations across 180+ countries are reshaping supply chains, costs, and competitiveness. This report reflects the latest developments as of April 2025 and incorporates forward-looking insights into the market outlook.The analysts continuously track trade developments worldwide, drawing insights from leading global economists and over 200 industry and policy institutions, including think tanks, trade organizations, and national economic advisory bodies. This intelligence is integrated into forecasting models to provide timely, data-driven analysis of emerging risks and opportunities.
What's Included in This Edition:
- Tariff-adjusted market forecasts by region and segment
- Analysis of cost and supply chain implications by sourcing and trade exposure
- Strategic insights into geographic shifts
Buyers receive a free July 2025 update with:
- Finalized tariff impacts and new trade agreement effects
- Updated projections reflecting global sourcing and cost shifts
- Expanded country-specific coverage across the industry
Table of Contents
I. METHODOLOGYII. EXECUTIVE SUMMARY2. FOCUS ON SELECT PLAYERSIII. MARKET ANALYSISCANADAITALYREST OF EUROPEREST OF WORLDIV. COMPETITION
1. MARKET OVERVIEW
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
UNITED STATES
JAPAN
CHINA
EUROPE
FRANCE
GERMANY
UNITED KINGDOM
ASIA-PACIFIC
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ACM Research
- Advanced Micro-Fabrication Equipment Inc. (AMEC)
- Applied Materials Inc.
- ASML Holding N.V.
- Axcelis Technologies Inc.
- Canon Anelva Corporation
- EV Group (EVG)
- Hitachi High-Tech Corporation
- KLA Corporation
- Lam Research Corporation
- Mattson Technology Inc.
- NAURA Technology Group Co., Ltd.
- Oxford Instruments plc
- Panasonic Corporation
- Plasma-Therm LLC
- Samco Inc.
- SEMES Co., Ltd.
- Shibaura Mechatronics Corporation
- SPTS Technologies Ltd.
- Tokyo Electron Limited (TEL)
Table Information
Report Attribute | Details |
---|---|
No. of Pages | 315 |
Published | May 2025 |
Forecast Period | 2024 - 2030 |
Estimated Market Value ( USD | $ 14.1 Billion |
Forecasted Market Value ( USD | $ 20.4 Billion |
Compound Annual Growth Rate | 6.3% |
Regions Covered | Global |