Semiconductor Dry Strip Equipment - Global Strategic Business Report

The global market for Semiconductor Dry Strip Equipment was valued at US$349.9 Million in 2024 and is projected to reach US$438.9 Million by 2030, growing at a CAGR of 3.9% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Semiconductor Dry Strip Equipment market.

Global 'Semiconductor Dry Strip Equipment' Market - Key Trends & Drivers Summarized

Why Is Dry Strip Technology Essential in Modern Fab Processing?

Dry strip equipment has become a critical component of semiconductor fabrication, providing essential post-lithography cleaning by removing photoresist and polymer residues from wafers. Unlike wet stripping, dry strip systems use plasma or downstream gas-phase reactions to gently eliminate residues without damaging delicate features. As device geometries shrink and wafer complexity increases, dry strip offers superior control over surface integrity, minimizing pattern distortion and contamination. In FinFET, GAAFET, and 3D NAND processes, traditional wet chemistries often fall short due to high aspect ratios and sensitivity to moisture or chemicals. Dry strip methods provide uniformity across large wafers and are more environmentally sustainable. With the growing push for precision and yield in each fab cycle, dry strip equipment plays a crucial role in maintaining cleanliness between steps without inducing wafer stress or material degradation.

Are Equipment Innovations Driving the Shift to Ultra-Low Damage Strip Methods?

As process nodes dive below 5nm, dry strip tools are evolving to meet stringent demands for ultra-low plasma damage, residue-free results, and compatibility with a wider range of advanced materials. Next-generation equipment now offers downstream plasma sources, controlled ion energy systems, and multi-step process chambers that support advanced resist materials like EUV resists and hardmask films. To minimize plasma-induced charging and etch bias, manufacturers are embedding AI-controlled recipe tuning, in situ endpoint detection, and chamber pressure modulation. Remote plasma configurations are also gaining popularity for their ability to strip without ion bombardment, preserving device structures. Furthermore, modern systems are designed for high-throughput processing while maintaining thermal and chemical uniformity - an essential factor for high-volume fabs. Dry strip is transitioning from a niche step to a performance-critical operation in advanced logic and memory production lines.

How Are Sustainability and Yield Optimization Shaping Equipment Design?

In today’s environmentally conscious semiconductor landscape, sustainability and operational efficiency are driving significant changes in dry strip equipment. Newer systems prioritize lower power consumption, reduced use of perfluorinated gases, and minimized process gas waste. Additionally, inline process diagnostics and real-time analytics reduce rework rates and improve wafer yield per lot. Advanced cooling techniques and process chamber materials extend tool life and lower downtime. Equipment OEMs are also offering modular upgrades and retrofittable plasma sources to extend the life cycle of installed base units, allowing fabs to remain competitive without full system overhauls. This combination of eco-efficiency and yield enhancement is making dry strip equipment a strategic investment, particularly for fabs focused on reducing operational costs while advancing to smaller process geometries.

What’s Accelerating Global Demand for Dry Strip Equipment in Fabs?

The growth in the global semiconductor dry strip equipment market is driven by several factors including increasing device complexity, EUV lithography adoption, and demand for yield optimization. The rise of high-aspect-ratio 3D structures in logic and NAND chips requires damage-free stripping solutions to maintain structural fidelity. EUV lithography, now entering high-volume production, necessitates advanced strip techniques for novel resist chemistries. Furthermore, fabs are under pressure to improve wafer yield and reduce defect rates, prompting a move to plasma-based strip methods with precise process control. Sustainability goals are pushing adoption of equipment with lower gas emissions and power usage. As new fabs are constructed globally under public-private semiconductor expansion initiatives, the demand for cleanroom-compatible, high-throughput dry strip tools is surging. Vendors offering customizable chambers, AI integration, and reduced cost-per-wafer solutions are leading the charge.

Report Scope

The report analyzes the Semiconductor Dry Strip Equipment market, presented in terms of market value (US$ Thousand). The analysis covers the key segments and geographic regions outlined below.

Segments: Type (Element Semiconductor, Compound Semiconductor); Application (Consumer Electronics, Automotive, Industrial, Other Applications).

Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Key Insights:

• Market Growth: Understand the significant growth trajectory of the Element Semiconductor Dry Strip Equipment segment, which is expected to reach US$257.5 Million by 2030 with a CAGR of a 3.1%. The Compound Semiconductor Dry Strip Equipment segment is also set to grow at 5.0% CAGR over the analysis period.
• Regional Analysis: Gain insights into the U.S. market, valued at $95.3 Million in 2024, and China, forecasted to grow at an impressive 7.0% CAGR to reach $88.0 Million by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Why You Should Buy This Report:

• Detailed Market Analysis: Access a thorough analysis of the Global Semiconductor Dry Strip Equipment Market, covering all major geographic regions and market segments.
• Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
• Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Semiconductor Dry Strip Equipment Market.
• Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

• How is the Global Semiconductor Dry Strip Equipment Market expected to evolve by 2030?
• What are the main drivers and restraints affecting the market?
• Which market segments will grow the most over the forecast period?
• How will market shares for different regions and segments change by 2030?
• Who are the leading players in the market, and what are their prospects?

Report Features:

• Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
• In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
• Company Profiles: Coverage of players such as ACM Research, Inc., Advanced Micro-Fabrication Equipment Inc. (AMEC), Applied Materials, Inc., Axcelis Technologies, Inc., Beijing E-Town Semiconductor Technology Co., Ltd. and more.
• Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Some of the 36 companies featured in this Semiconductor Dry Strip Equipment market report include:

• ACM Research, Inc.
• Advanced Micro-Fabrication Equipment Inc. (AMEC)
• Applied Materials, Inc.
• Axcelis Technologies, Inc.
• Beijing E-Town Semiconductor Technology Co., Ltd.
• C&D Semiconductor Services Inc.
• Grand Process Technology Co., Ltd.
• Hitachi High-Tech Corporation
• Kokusai Electric Corporation
• Lam Research Corporation
• Mattson Technology, Inc.
• MKS Instruments, Inc.
• NAURA Technology Group Co., Ltd.
• Novellus Systems, Inc.
• Panasonic Corporation
• Plasma-Therm LLC
• PSK Inc.
• Samco Inc.
• SCREEN Holdings Co., Ltd.
• Tokyo Electron Limited
• ULVAC Inc.

Tariff Impact Analysis: Key Insights for 2025

Global tariff negotiations across 180+ countries are reshaping supply chains, costs, and competitiveness. This report reflects the latest developments as of April 2025 and incorporates forward-looking insights into the market outlook.

The analysts continuously track trade developments worldwide, drawing insights from leading global economists and over 200 industry and policy institutions, including think tanks, trade organizations, and national economic advisory bodies. This intelligence is integrated into forecasting models to provide timely, data-driven analysis of emerging risks and opportunities.

What's Included in This Edition:

• Tariff-adjusted market forecasts by region and segment
• Analysis of cost and supply chain implications by sourcing and trade exposure
• Strategic insights into geographic shifts

Buyers receive a free July 2025 update with:

• Finalized tariff impacts and new trade agreement effects
• Updated projections reflecting global sourcing and cost shifts
• Expanded country-specific coverage across the industry