The Global Advanced Semiconductor Packaging Market 2025-2035

1.1 Semiconductor Packaging Technology Overview
1.1.1 Key challenges
1.1.2 Evolution of semiconductor packaging
1.1.2.1 From 1D to 3D
1.1.3 Conventional packaging approaches
1.1.4 Advanced packaging approaches
1.2 Semiconductor Supply Chain
1.3 Advanced Packaging Supply Chain
1.4 Key Technology Trends in Advanced Packaging
1.5 Market Growth Drivers
1.6 Competitive Landscape
1.7 Market Challenges
1.8 Future outlook
1.8.1 Heterogeneous Integration
1.8.2 Chiplets and Die Disaggregation
1.8.3 Advanced Interconnects
1.8.4 Scaling and Miniaturization
1.8.5 Thermal Management
1.8.6 Materials Innovation
1.8.7 Supply Chain Developments
1.8.8 Role of Simulation and Data Analytics

2.1 Transistor Device Scaling
2.1.1 Overview
2.1.2 Heterogeneous Architecture Transition
2.1.3 Co-Design Focus Areas
2.2 Wafer Level Packaging
2.3 Fan-Out Wafer Level Packaging
2.4 Chiplets
2.4.1 AMD EPYC and Ryzen processor families
2.4.2 Disaggregation Needs
2.5 Interconnection in Semiconductor Packaging
2.5.1 Overview
2.5.2 Wire Bonding
2.5.3 Flip-chip bonding
2.5.4 Interposer
2.5.4.1 Glass interposer
2.5.5 Through-silicon via (TSV) bonding
2.5.6 Hybrid bonding with chiplets
2.6 2.5D and 3D Packaging
2.6.1 2.5D packaging
2.6.1.1 Overview
2.6.1.1.1 Silicon Interposer 2.5D
2.6.1.1.1.1 Through Si Via (TSV)
2.6.1.1.1.2 (SiO2) based redistribution layers (RDLs)
2.6.1.1.2 2.5D Organic-based packaging
2.6.1.1.2.1 Chip-first and chip-last fan-out packaging
2.6.1.1.2.2 Organic substrates
2.6.1.1.2.3 Organic RDL
2.6.1.1.3 2.5D glass-based packaging
2.6.1.1.3.1 Benefits
2.6.1.1.3.2 Glass Si interposers in advanced packaging
2.6.1.1.3.3 Glass material properties
2.6.1.1.3.4 2/2 µm line/space metal pitch on glass substrates
2.6.1.1.3.5 3D Glass Panel Embedding (GPE) packaging
2.6.1.1.3.6 Thermal management
2.6.1.1.3.7 Polymer dielectric films
2.6.1.1.3.8 Challenges
2.6.1.1.3.9 Comparison with other substrates
2.6.1.1.4 2.5D vs. 3D Packaging
2.6.1.2 Benefits
2.6.1.3 Challenges
2.6.1.4 Trends
2.6.1.5 Market players
2.6.2 3D packaging
2.6.2.1 Overview
2.6.2.1.1 Conventional 3D packaging
2.6.2.1.2 Advanced 3D Packaging with through-silicon vias (TSVs)
2.6.2.1.3 Three-dimensional (3D) hybrid bonding
2.6.2.1.3.1 Devices using hybrid bonding
2.6.2.2 3D Microbump technology
2.6.2.2.1 Technologies
2.6.2.2.2 Challenges
2.6.2.2.3 Bumpless copper-to-copper (Cu-Cu) hybrid bonding
2.6.2.3 Trends
2.6.2.3.1 3D interconnect trends
2.6.2.4 Hybrid Bond and Fusion Bond

3.1 Introduction
3.1.1 WLP to PLP
3.2 Benefits
3.3 Types of Wafer Level Packaging
3.3.1 Wafer Level Chip Scale Packaging
3.3.1.1 Overview
3.3.1.2 Advantages
3.3.1.3 Applications
3.3.2 Wafer Level Fan-Out Packaging
3.3.2.1 Overview
3.3.2.2 Advantages
3.3.2.3 Applications
3.3.3 Wafer Level Fan-In Packaging
3.3.3.1 Overview
3.3.3.2 Advantages
3.3.3.3 Applications
3.3.4 Other Types of WLP
3.3.4.1 Cu-Pillar Flip Chip
3.3.4.2 Advantages
3.3.4.2.1 Applications
3.3.4.3 Embedded Wafer Level BGA (eWLB)
3.3.4.4 Advantages
3.3.4.4.1 Applications
3.3.4.5 Chip-last FO-WLP
3.3.4.5.1 Advantages
3.3.4.5.2 Applications
3.3.4.6 Wafer-on-Wafer (WoW)
3.3.4.6.1 Applications
3.4 WLP Manufacturing Processes
3.4.1 Wafer Preparation
3.4.2 RDL Buildup
3.4.3 Bumping
3.4.4 Encapsulation
3.4.5 Integration
3.4.6 Test and Singulation
3.5 Wafer Level Packaging Trends
3.6 Applications of Wafer Level Packaging
3.6.1 Mobile and Consumer Electronics
3.6.2 Automotive Electronics
3.6.3 IoT and Industrial
3.6.4 High Performance Computing
3.6.5 Aerospace and Defense
3.7 Wafer Level Packaging Outlook

4.1 Introduction
4.2 Approaches for heterogenous integration
4.2.1 Technology Building Blocks
4.3 SiP Manufacturing Approaches
4.3.1 2.5D Integrated Interposers
4.3.2 Multi-Chip Modules
4.3.3 3D Stacked packages
4.3.4 Fan-Out Wafer Level Packaging
4.3.5 Flip Chip Package-on-Package
4.4 SiP Component Integration
4.5 Heterogeneous Integration Drivers
4.6 Trends Driving SiP Adoption
4.7 SiP Applications
4.8 SiP Industry Landscape
4.9 Future Outlook on Heterogeneous Integration
4.10 CPO (Co-Packaged Optics)
4.10.1 Co-packaging approaches
4.10.2 Heterogeneous integration of EIC and PIC
4.10.3 Advantages and limitations
4.11 IC Substrates

5.1 Overview
5.1.1 Transitioning from 2D Systems
5.1.2 Motivation for developing monolithic 3D manufacturing
5.1.3 Improved M3D Interconnect Density
5.1.4 Heterogenous 3D vs Monolithic 3D
5.1.5 2D Materials
5.2 Benefits
5.3 Challenges
5.4 Future outlook

6.1 Market value chain
6.1.1 SiP OEM/Designers
6.1.2 Chiplet OEM/Designer and Chiplet Foundry
6.1.3 Chiplet Integrator
6.1.3.1 Integrated Device Manufacturers (IDMs)
6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers
6.1.4 Material Suppliers
6.1.5 Equipment Suppliers
6.1.6 Substrate and PCB suppliers
6.1.7 EDA Tools Suppliers
6.1.8 Interposer Foundry
6.2 Packaging trends by market
6.2.1 Mobile Devices
6.2.2 High-Performance Computing (HPC)
6.2.3 Automotive
6.2.4 Internet of Things (IoT)
6.2.5 Consumer Electronics
6.2.6 Aerospace and Defense
6.2.7 Medical Devices
6.3 Design requirements
6.4 Artificial Intelligence (AI)
6.4.1 Challenges in AI
6.4.2 Advanced Packaging Solutions
6.4.2.1 2.5D and 3D Integration
6.4.2.2 Chiplet-based Packaging
6.4.2.3 Wafer-Level Packaging (WLP)
6.4.3 Addressing AI Challenges through Advanced Packaging
6.4.3.1 Processing Power
6.4.3.2 Memory Bandwidth
6.4.3.3 Energy Efficiency
6.4.3.4 Scalability
6.4.4 Applications
6.4.4.1 Data Center and Cloud Computing
6.4.4.2 Edge Devices and IoT
6.4.4.3 Healthcare and Medical Devices
6.4.4.4 Autonomous Vehicles
6.5 Mobile Devices
6.5.1 Challenges
6.5.2 Advanced Packaging Solutions
6.5.2.1 System-in-Package (SiP)
6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
6.5.2.3 3D IC Packaging
6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)
6.5.3 Addressing Challenges through Advanced Packaging
6.5.3.1 Power Consumption and Thermal Management
6.5.3.2 Size Constraints
6.5.3.3 Cost
6.5.4 Applications
6.5.4.1 Smartphones
6.5.4.2 Tablets
6.5.4.3 Wearables
6.5.4.4 AR/VR Devices
6.5.5 Future trends
6.6 High Performance Computing (HPC)
6.6.1 Challenges
6.6.2 Advanced Packaging Solutions for HPC
6.6.2.1 2.5D and 3D Integration
6.6.2.2 Hybrid bonding
6.6.2.3 Multi-Chip Modules (MCMs)
6.6.2.4 Chiplet-based Architectures
6.6.2.5 Advanced Interconnect Technologies
6.6.3 Addressing HPC Challenges through Advanced Packaging
6.6.3.1 Performance Scaling
6.6.3.2 Power Consumption
6.6.3.3 Interconnect Bandwidth
6.6.3.4 Reliability
6.6.4 Applications
6.6.4.1 Supercomputers
6.6.4.2 Data Center and Cloud Computing
6.6.4.3 Artificial Intelligence and Machine Learning
6.6.4.4 Scientific Computing and Simulation
6.6.4.5 Co-Packaged Optics
6.6.4.5.1 Network Switch
6.6.4.5.2 Optical communication in data centers
6.6.4.5.3 Thermal Management
6.6.4.5.4 Challenges in CPO
6.6.4.5.5 Package Structure
6.6.4.5.6 Fan-Out Embedded Bridge (FOEB) structure
6.6.4.5.7 Advancing Switching and AI Networks
6.6.5 Future Trends
6.7 Automotive Electronics
6.7.1 Challenges
6.7.2 Advanced Packaging Solutions for Automotive Electronics
6.7.2.1 System-in-Package (SiP)
6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)
6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)
6.7.3 Addressing Automotive Electronics Challenges through Advanced Packaging
6.7.3.1 ADAS/Autonomous driving systems
6.7.3.2 Harsh Environment Reliability
6.7.3.3 Safety and Reliability
6.7.3.4 Miniaturization and Integration
6.7.3.5 High-Speed Communication
6.7.3.6 Thermal Management
6.7.4 Applications
6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving
6.7.4.1.1 Radar packaging
6.7.4.2 Electric Vehicle (EV) Power Electronics
6.7.4.3 Infotainment and Telematics
6.7.4.4 Sensors and Actuators
6.7.5 Future Trends
6.8 Internet of Things (IoT) Devices
6.8.1 Challenges
6.8.2 Advanced Packaging Solutions for IoT Devices
6.8.2.1 Wafer-Level Packaging (WLP)
6.8.2.2 System-in-Package (SiP)
6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)
6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)
6.8.3 Addressing IoT Device Challenges through Advanced Packaging
6.8.3.1 Size Constraints
6.8.3.2 Power Consumption
6.8.3.3 Cost Pressures
6.8.3.4 Integration and Functionality
6.8.3.5 Reliability and Robustness
6.8.4 Applications
6.8.4.1 Wearable Devices
6.8.4.2 Smart Home Devices
6.8.4.3 Industrial IoT Devices
6.8.4.4 Medical IoT Devices
6.8.5 Future Trends
6.9 5G & 6G Communications Infrastructure
6.9.1 Challenges
6.9.2 Trends in 5G and 6G packaging
6.9.3 Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
6.9.3.1 Antenna-in-Package (AiP)
6.9.3.2 System-in-Package (SiP)
6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)
6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)
6.9.4 Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
6.9.4.1 High-Frequency Operation
6.9.4.2 Massive MIMO and Beamforming
6.9.4.3 Energy Efficiency
6.9.4.4 Cost and Scalability
6.9.4.5 Thermal Management
6.9.5 Applications
6.9.5.1 Base Stations and Small Cells
6.9.5.2 Backhaul and Fronthaul Networks
6.9.5.3 Edge Computing and Network Slicing
6.9.5.4 Satellite and Non-Terrestrial Networks
6.9.6 Future Trends
6.10 Aerospace and Defense Electronics
6.10.1 Challenges
6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics
6.10.2.1 3D Packaging and Through-Silicon Vias (TSVs)
6.10.2.2 Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)
6.10.2.3 Flip-Chip and Ball Grid Array (BGA) Packaging
6.10.2.4 Hermetic Packaging and Sealing
6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
6.10.3.1 Size, Weight, and Power (SWaP) Optimization
6.10.3.2 Harsh Environment Reliability
6.10.3.3 High Performance and Speed
6.10.3.4 Long-Term Reliability and Maintainability
6.10.3.5 Security and Anti-Tamper Features
6.10.4 Applications
6.10.4.1 Avionics and Flight Control Systems
6.10.4.2 Radar and Electronic Warfare Systems
6.10.4.3 Satellite Communications and Payload Electronics
6.10.4.4 Missile Guidance and Control Electronics
6.10.5 Future Trends
6.11 Medical Electronics
6.11.1 Challenges
6.11.2 Advanced Packaging Solutions for Medical Electronics
6.11.2.1 3D Packaging and Through-Silicon Vias (TSVs)
6.11.2.2 Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)
6.11.2.3 Flexible and Stretchable Packaging
6.11.2.4 Microfluidic Packaging
6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging
6.11.3.1 Miniaturization
6.11.3.2 Biocompatibility
6.11.3.3 Reliability
6.11.3.4 Power Efficiency
6.11.3.5 High Performance
6.11.4 Applications
6.11.4.1 Implantable Devices
6.11.4.2 Wearable Health Monitors
6.11.4.3 Diagnostic Imaging Equipment
6.11.4.4 Surgical Robotics and Instruments
6.11.5 Future Trends
6.12 Consumer Electronics
6.12.1 Challenges
6.12.2 Advanced Packaging Solutions for Consumer Electronics
6.12.2.1 System-in-Package (SiP)
6.12.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
6.12.2.3 3D Packaging and Through-Silicon Vias (TSVs)
6.12.2.4 Embedded Die Packaging
6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging
6.12.3.1 Miniaturization
6.12.3.2 Power Efficiency
6.12.3.3 High Performance
6.12.3.4 Cost Reduction
6.12.3.5 Time-to-Market
6.12.4 Applications
6.12.4.1 Smartphones and Tablets
6.12.4.2 Wearables and IoT Devices
6.12.4.3 Gaming Consoles and VR/AR Devices
6.12.4.4 Smart Home Devices
6.12.5 Future Trends
6.13 Additive manufacturing for advanced packaging
6.14 Silicon photonics

7.1 By type
7.2 By Units & Wafers
7.3 By market
7.4 By region
7.5 3D SoC
7.6 3D Stacked memory
7.7 UHD FO / RDL Interposer
7.8 2.5D Interposers
7.9 Embedded Si bridge

8.1 Data center
8.2 AI and Graphics
8.3 CPU
8.4 Autonomous vehicles
8.5 Roadmap
8.5.1 Interconnect technology trend
8.5.2 By interconnect density and technology node
8.5.3 By reticle size
8.5.4 By front-end vs back-end
8.5.5 By 2.5D and 3D Technology Trends
8.5.6 By I/O density, I/O pitch and package size
8.6 Commercialized Products
8.6.1 3D Memory
8.6.2 GPU
8.6.2.1 Nvidia Hopper and Blackwell
8.6.2.2 AMD Instinct MI300 series
8.6.2.3 Intel Jaguar Shores
8.6.3 AI ASICs
8.6.3.1 Intel Gaudi 2 & 3
8.6.3.2 Google TPU
8.6.3.3 Amazon Trainium & Inferentia
8.6.3.4 Microsoft Azure Maia 100
8.6.3.5 Huawei Ascend Series
8.6.4 CPU
8.6.4.1 AMD Ryzen AI Max Pro 300
8.6.4.2 AMD Ryzen & EPYC
8.6.4.3 AWS Graviton
8.6.4.4 Intel Emerald Rapids
8.6.4.5 Intel Meteor Lake
8.6.4.6 Intel Arrow Lake & Lunar Lake

9.1 Integrated Device Manufacturers
9.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies
9.3 Foundries
9.4 Electronics OEMs
9.5 Packaging Equipment and Materials Companies

Table 1. Evolution of semiconductor packaging
Table 2. Summary of key advanced semiconductor packaging approaches
Table 3. Key Technology Trends in Advanced Semiconductor Packaging
Table 4. Market Growth Drivers for advanced semiconductor packaging
Table 5. Challenges Facing Advanced Packaging Adoption
Table 6. Challenges in transistor scaling
Table 7. Use cases and benefits of using chiplets in semiconductor design
Table 8. Specifications of interconnection methods
Table 9. Interconnection technique in semiconductor packaging
Table 10. Passive vs active interposer
Table 11. TSMC Interposer comparison
Table 12. Comparative benchmark overview table of key semiconductor interconnection technologies
Table 13. Fan-out packaging process overview
Table 14. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates
Table 15. Benefits of glass in 2.5D glass-based packaging
Table 16. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications
Table 17. Challenges of glass semiconductor packaging
Table 18. Comparison between silicon, organic laminates and glass as packaging substrates
Table 19. 2.5D vs. 3D packaging
Table 20. 2.5D packaging challenges
Table 21. Market players in 2.5D packaging
Table 22. Advantages and disadvantages of 3D packaging
Table 23. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding
Table 24. Challenges in 3D Hybrid Bonding
Table 25. Challenges in scaling bumps
Table 26. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
Table 27. Micro bumps vs Cu-Cu bumpless hybrid bonding
Table 28. W2W vs D2W vs collective D2W - process and comparison
Table 29. Comparison of WLP and PLP for large package size
Table 30. Benefits of Wafer-Level Packaging
Table 31. Types of wafer level packaging
Table 32. Key trends shaping wafer level packaging
Table 33. Packaging approaches utilized for assembling System-in-Package modules
Table 34. Considerations for integrating key component categories into system-in-package (SiP) modules/
Table 35. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages
Table 36. Key trends influencing adoption of System-in-Package modules
Table 37. System-in-package (SiP) module applications
Table 38. Comparison between heterogeneous 3D integration and monolithic 3D integration
Table 39. Key 2D materials in monolithic 3D integrated circuits
Table 40. Benefits of monolithic 3D ICs
Table 41. Challenges of monolithic 3D ICs
Table 42. Advanced semiconductor packaging trends by market
Table 43. Design requirements in advanced packaging, by market
Table 44. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD)
Table 45. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD)
Table 46. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD)
Table 47. Recent expansion activities by companies in Malaysia
Table 48. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD)
Table 49. Main Global Wafer Foundry Companies 2023
Table 50. Market challenges for advanced semiconductor packaging
Table 51. AMD AI chip range
Table 52. Intel's products that adopt 3D FOVEROS

Figure 1. Timeline of different packaging technologies
Figure 2. Evolution roadmap for semiconductor packaging
Figure 3. Semiconductor Supply Chain
Figure 4. Advanced packaging supply chain
Figure 5. Scaling technology roadmap
Figure 6. Wafer-level chip scale packaging (WLCSP)
Figure 7. Embedded wafer-level ball grid array (eWLB)
Figure 8. Fan-out wafer-level packaging (FOWLP)
Figure 9. Chiplet design
Figure 10. Chiplet SoC
Figure 11. 2D chip packaging
Figure 12. Typical structure of 2.5D IC package utilizing interposer
Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow
Figure 14. Manufacturing process for glass interposers
Figure 15. 3D Glass Panel Embedding (GPE) package
Figure 16. Typical FOWLP structure
Figure 17. System-in-Package (SiP) for HI
Figure 18. 2.5D chiplet integration
Figure 19. Advanced packaging supply chain
Figure 20. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving
Figure 21. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD)
Figure 22. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD)
Figure 23. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD)
Figure 24. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD)
Figure 25. Absolic glass substrate
Figure 26. AMD Radeon Instinct
Figure 27. AMD Ryzen 7040
Figure 28. Alveo V70
Figure 29. Versal Adaptive SOC
Figure 30. AMD’s MI300 chip
Figure 31. 12-layer HBM3