Ceramic Substrates in Electronic Packaging Market Report 2026

The ceramic substrates in electronic packaging market size has grown strongly in recent years. It will grow from $5.58 billion in 2025 to $5.92 billion in 2026 at a compound annual growth rate (CAGR) of 6%. The growth in the historic period can be attributed to expansion of power electronics manufacturing, growth of telecommunications infrastructure, adoption of ceramic substrates in aerospace systems, rising demand for reliable electronic packaging, availability of advanced ceramic materials.

The ceramic substrates in electronic packaging market size is expected to see strong growth in the next few years. It will grow to $7.48 billion in 2030 at a compound annual growth rate (CAGR) of 6%. The growth in the forecast period can be attributed to increasing deployment of electric vehicles, growth of high-frequency electronics, rising investments in advanced semiconductor packaging, increasing demand for thermal management solutions, expansion of automotive electronics. Major trends in the forecast period include increasing use in high-power electronic applications, rising demand for high thermal conductivity substrates, growing adoption in electric vehicles, expansion of advanced packaging technologies, enhanced focus on miniaturization.

The increasing demand for miniaturized electronics is expected to drive the growth of the ceramic substrates in electronic packaging market in the coming years. Miniaturized electronics refer to smaller and more compact electronic devices and components that deliver the same functionality as larger counterparts while occupying less space and often improving efficiency and performance. The rising demand for miniaturized electronics is fueled by the need for portable, high-performance devices such as smartphones, wearables, and Internet of Things (IoT) products. As technology continues to advance, consumers and businesses seek efficient and portable products that also offer enhanced performance. Ceramic substrates are widely used in miniaturized electronics to support and interconnect smaller components within limited space. They enhance device durability and operational efficiency, making them well suited for high-performance, compact electronic applications. For example, in November 2025, according to a report published by the Semiconductor Industry Association, a US-based trade association, semiconductor sales surged to $208.4 billion in Q3 2025, reflecting a 15.8% increase from Q2 and a 7% month-on-month growth in September. Therefore, the growing demand for miniaturized electronics is driving the expansion of the ceramic substrates in electronic packaging market.

Key players in the ceramic substrates in electronic packaging market are making strategic investments, such as advanced manufacturing plants, to boost production capacity, meet growing demand, and improve supply chain efficiency. These modern manufacturing plants employ cutting-edge technologies such as automation, robotics, and AI to enhance efficiency and precision in production. For example, in November 2024, Heraeus Electronics, a Germany-based manufacturer specializing in materials for assembling and packaging electronics, opened a new state-of-the-art facility in Changshu New & Hi-tech Industrial Development Zone (CNZ) in Jiangsu Province, China. This facility focuses on producing high-performance semiconductor metal ceramic substrates, including Active Metal Brazed (AMB) substrates. These products serve industries such as electric vehicles, wind energy, and photovoltaics, supporting China’s goals of carbon peak and carbon neutrality.

In July 2024, NGK Insulators Ltd., a Japan-based company specializing in battery manufacturing, partnered with PanelSemi Corporation to create advanced hybrid ceramic substrates for high-power applications. PanelSemi Corporation, a Taiwan-based firm, focuses on developing ultra-thin, flexible LED displays and semiconductor substrates.

Major companies operating in the ceramic substrates in electronic packaging market are Compagnie de Saint-Gobain, Heraeus Holding GmbH, Toshiba Corporation, TDK Corporation, Kyocera Corporation, Murata Manufacturing Co. Ltd., NGK Spark Plug Co. Ltd., Vishay Intertechnology Inc., Schott AG, CoorsTek Inc., Morgan Advanced Materials plc, Rogers Corporation, Chaozhou Three-Circle (Group) Co. Ltd., CeramTec GmbH, Yokowo Co. Ltd., Tong Hsing Electronic Industries Ltd., Maruwa Co. Ltd., Nippon Carbide Industries Co. Inc., KOA Corporation, Ferro Corporation.

North America was the largest region in the ceramic substrates in electronic packaging market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the ceramic substrates in electronic packaging market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the ceramic substrates in electronic packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The ceramic substrates in electronic packaging market consist of sales of products including glass-ceramic substrates, multilayer ceramic substrates, and porous ceramic substrates. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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