Ball Grid Array (BGA) Packaging Market Report 2026

The ball grid array (bga) packaging market size has grown strongly in recent years. It will grow from $8.98 billion in 2025 to $9.43 billion in 2026 at a compound annual growth rate (CAGR) of 5%. The growth in the historic period can be attributed to increasing complexity of integrated circuits, expansion of consumer electronics manufacturing, rising adoption of surface-mount technology, demand for compact electronic devices, advancements in semiconductor assembly processes.

The ball grid array (bga) packaging market size is expected to see strong growth in the next few years. It will grow to $11.53 billion in 2030 at a compound annual growth rate (CAGR) of 5.1%. The growth in the forecast period can be attributed to increasing demand from automotive electronics, rising investments in advanced semiconductor packaging, expansion of high-performance computing applications, growing adoption in rf and power devices, increasing focus on heat dissipation performance. Major trends in the forecast period include increasing adoption of high-density ic packaging, rising demand for thermally enhanced bga solutions, growing use of fine-pitch interconnect technologies, expansion of package-on-package architectures, enhanced focus on miniaturized high-performance packages.

The expanding consumer electronics sector is expected to drive the growth of the ball grid array (BGA) packaging market in the future. The consumer electronics industry focuses on designing, manufacturing, and selling electronic devices for everyday use. As consumers increasingly seek sustainable, energy-efficient, and smart gadgets, there is a growing demand for products that integrate eco-friendly materials, energy-saving designs, and smart technology. Ball grid array (BGA) packaging supports this demand by enabling higher component density, improved electrical performance, and better heat dissipation, which is essential for developing compact, high-performance devices. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported that Japan’s electronic equipment production reached 771,457 units, with consumer electronics manufacturing increasing to 32,099 units, up from 25,268 units in May 2022. This growth in consumer electronics is contributing to the rise in the BGA packaging market.

Companies in the BGA packaging market are focusing on innovations such as chip substrates to improve performance, thermal management, and support for advanced semiconductor applications. A chip substrate serves as the base layer in semiconductor packaging, providing mechanical support, electrical connections, and thermal dissipation for integrated circuit (IC) chips. For example, in February 2023, Samsung Electronics Co. Ltd. introduced an advanced flip-chip ball grid array (FC-BGA) substrate designed for autonomous driving applications. This high-performance substrate connects high-density semiconductor chips to the mainboard, optimizing electrical signal and power transmission. It enhances chip performance by reducing latency, improving thermal management, and enabling faster data processing.

In November 2023, Jabil Inc., a US-based provider of design, manufacturing, and supply chain solutions, acquired Retronix for an undisclosed amount. Through this acquisition, Jabil seeks to strengthen its circular economy efforts by broadening its capabilities in recovering, refurbishing, and recycling electronic components, aiming to minimize waste and promote sustainable manufacturing. Retronix Inc. is a UK-based company offering services such as component recovery, laser reballing, retinning, and authenticity verification of electronic components.

Major companies operating in the ball grid array (bga) packaging market are Intel Corporation, Qualcomm, Micron Technology, Toshiba, ASE Technology Holding Co. Ltd., Infineon Technologies AG, Amkor Technology, Unimicron Technology, Samsung Electronics, Ibiden Co. Ltd., TTM Technologies Inc., Nanya PCB, Jiangsu Changjiang Electronics Technology Co., Micro Systems Engineering GmbH, Palomar Technologies, INDIC - EMS Electronics Pvt. Ltd., Cirexx International, Naprotek LLC, Delphon, Advanced Interconnections Inc.

Asia-Pacific was the largest region in the ball grid array (BGA) packaging market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the ball grid array (bga) packaging market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the ball grid array (bga) packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The ball grid array (BGA) packaging market consists of revenues earned by entities by providing services such as BGA packaging design and development, BGA assembly and soldering services, BGA testing and inspection, and BGA substrate manufacturing. The market value includes the value of related goods sold by the service provider or included within the service offering. The ball grid array (BGA) packaging market also includes sales of flip-chip ball grid array (FCBGA), ceramic ball grid array (CBGA), tape ball grid array (TBGA), and plastic ball grid array (PBGA). Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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