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Memory Packaging Market: Global Industry Analysis, Trends, Market Size, and Forecasts up to 2032

  • Report

  • 255 Pages
  • May 2025
  • Region: Global
  • Infinium Global Research
  • ID: 6099531
The report on the global memory packaging market provides qualitative and quantitative analysis for the period from 2022-2032. The global memory packaging market was valued at USD 27.56 billion in 2023 and is expected to reach USD 49.26 billion in 2032, with a CAGR of 6.80% during the forecast period 2024-2032. The study on memory packaging market covers the analysis of the leading geographies such as North America, Europe, Asia Pacific, and RoW for the period of 2022-2032.

The report on memory packaging market is a comprehensive study and presentation of drivers, restraints, opportunities, demand factors, market size, forecasts, and trends in the global memory packaging market over the period of 2022-2032. Moreover, the report is a collective presentation of primary and secondary research findings.

Porter's five forces model in the report provides insights into the competitive rivalry, supplier and buyer positions in the market and opportunities for the new entrants in the global memory packaging market over the period of 2022-2032. Furthermore, the growth matrix given in the report brings an insight into the investment areas that existing or new market players can consider.

Report Findings

1) Drivers

  • Rising demand for consumer electronics is fostering the memory packaging market expansion.
  • Rising demand for memory packaging from the automotive sector is propelling the market expansion.

2) Restraints

  • High manufacturing costs associated with the memory devices are hampering the market expansion.

3) Opportunities

  • Advancements in packaging technologies are expected to create lucrative opportunities in the market in the coming years.

Research Methodology

A) Primary Research

The primary research involves extensive interviews and analysis of the opinions provided by the primary respondents. The primary research starts with identifying and approaching the primary respondents, the primary respondents are approached include
1. Key Opinion Leaders
2. Internal and External subject matter experts
3. Professionals and participants from the industry

The primary research respondents typically include

1. Executives working with leading companies in the market under review
2. Product/brand/marketing managers
3. CXO level executives
4. Regional/zonal/ country managers
5. Vice President level executives.

B) Secondary Research

Secondary research involves extensive exploring through the secondary sources of information available in both the public domain and paid sources. Each research study is based on over 500 hours of secondary research accompanied by primary research. The information obtained through the secondary sources is validated through the crosscheck on various data sources.

The secondary sources of the data typically include

1. Company reports and publications
2. Government/institutional publications
3. Trade and associations journals
4. Databases such as WTO, OECD, World Bank, and among others.
5. Websites and publications by research agencies

Segment Covered

The global memory packaging market is segmented on the basis of platform, application, and end-use industry.

The Global Memory Packaging Market by Platform

  • Flip Chip
  • Wafer-level Chip Scale Packaging (WLCSP)
  • Lead Frame
  • Wire-bond
  • Through-silicon Vias (TSVs)

The Global Memory Packaging Market by Application

  • NAND Flash Packaging
  • DRAM Packaging
  • NOR Flash Memory
  • Others

The Global Memory Packaging Market by End-use Industry

  • IT and Telecom
  • Automotive
  • Consumer Electronics
  • Others

Company Profiles

The companies covered in the report include

  • HANA Micron Inc.
  • Formosa Advanced Technologies Co., Ltd. (FATC)
  • Amkor Technology, Inc.
  • Powertech Technology Inc.
  • Jiangsu Changdian Integrated Technology Co., Ltd.
  • ChipMOS TECHNOLOGIES INC.
  • King Yuan ELECTRONICS CO., LTD.
  • Tongfu Microelectronics Co., Ltd.
  • ASE Kaohsiung
  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

What does this report deliver?

1. Comprehensive analysis of the global as well as regional markets of the memory packaging market.
2. Complete coverage of all the segments in the memory packaging market to analyze the trends, developments in the global market and forecast of market size up to 2032.
3. Comprehensive analysis of the companies operating in the global memory packaging market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and latest developments of the company.
4. Growth Matrix presents an analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.

Table of Contents

Chapter 1. Preface
1.1. Report Description
1.2. Research Methods
1.3. Research Approaches
Chapter 2. Executive Summary
2.1. Memory Packaging Market Highlights
2.2. Memory Packaging Market Projection
2.3. Memory Packaging Market Regional Highlights
Chapter 3. Global Memory Packaging Market Overview
3.1. Introduction
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Restraints
3.2.3. Opportunities
3.3. Porter's Five Forces Analysis
3.4. Growth Matrix Analysis
3.4.1. Growth Matrix Analysis by Platform
3.4.2. Growth Matrix Analysis by Application
3.4.3. Growth Matrix Analysis by End-use Industry
3.4.4. Growth Matrix Analysis by Region
3.5. Value Chain Analysis of Memory Packaging Market
Chapter 4. Memory Packaging Market Macro Indicator Analysis
Chapter 5. Company Profiles and Competitive Landscape
5.1. Competitive Landscape in the Global Memory Packaging Market
5.2. Companies Profiles
5.2.1. HANA Micron Inc.
5.2.2. Formosa Advanced Technologies Co., Ltd. (FATC)
5.2.3. Amkor Technology, Inc.
5.2.4. Powertech Technology Inc.
5.2.5. Jiangsu Changdian Integrated Technology Co., Ltd.
5.2.6. ChipMOS TECHNOLOGIES INC.
5.2.7. King Yuan ELECTRONICS CO., LTD.
5.2.8. Tongfu Microelectronics Co., Ltd.
5.2.9. ASE Kaohsiung
5.2.10. SHINKO ELECTRIC INDUSTRIES CO., LTD.
Chapter 6. Global Memory Packaging Market by Platform
6.1. Flip Chip
6.2. Wafer-level Chip Scale Packaging (WLCSP)
6.3. Lead Frame
6.4. Wire-bond
6.5. Through-silicon Vias (TSVs)
Chapter 7. Global Memory Packaging Market by Application
7.1. NAND Flash Packaging
7.2. DRAM Packaging
7.3. NOR Flash Memory
7.4. Others
Chapter 8. Global Memory Packaging Market by End-use Industry
8.1. IT and Telecom
8.2. Automotive
8.3. Consumer Electronics
8.4. Others
Chapter 9. Global Memory Packaging Market by Region 2024-2032
9.1. North America
9.1.1. North America Memory Packaging Market by Platform
9.1.2. North America Memory Packaging Market by Application
9.1.3. North America Memory Packaging Market by End-use Industry
9.1.4. North America Memory Packaging Market by Country
9.1.4.1. The U.S. Memory Packaging Market
9.1.4.1.1. The U.S. Memory Packaging Market by Platform
9.1.4.1.2. The U.S. Memory Packaging Market by Application
9.1.4.1.3. The U.S. Memory Packaging Market by End-use Industry
9.1.4.2. Canada Memory Packaging Market
9.1.4.2.1. Canada Memory Packaging Market by Platform
9.1.4.2.2. Canada Memory Packaging Market by Application
9.1.4.2.3. Canada Memory Packaging Market by End-use Industry
9.1.4.3. Mexico Memory Packaging Market
9.1.4.3.1. Mexico Memory Packaging Market by Platform
9.1.4.3.2. Mexico Memory Packaging Market by Application
9.1.4.3.3. Mexico Memory Packaging Market by End-use Industry
9.2. Europe
9.2.1. Europe Memory Packaging Market by Platform
9.2.2. Europe Memory Packaging Market by Application
9.2.3. Europe Memory Packaging Market by End-use Industry
9.2.4. Europe Memory Packaging Market by Country
9.2.4.1. Germany Memory Packaging Market
9.2.4.1.1. Germany Memory Packaging Market by Platform
9.2.4.1.2. Germany Memory Packaging Market by Application
9.2.4.1.3. Germany Memory Packaging Market by End-use Industry
9.2.4.2. United Kingdom Memory Packaging Market
9.2.4.2.1. United Kingdom Memory Packaging Market by Platform
9.2.4.2.2. United Kingdom Memory Packaging Market by Application
9.2.4.2.3. United Kingdom Memory Packaging Market by End-use Industry
9.2.4.3. France Memory Packaging Market
9.2.4.3.1. France Memory Packaging Market by Platform
9.2.4.3.2. France Memory Packaging Market by Application
9.2.4.3.3. France Memory Packaging Market by End-use Industry
9.2.4.4. Rest of Europe Memory Packaging Market
9.2.4.4.1. Rest of Europe Memory Packaging Market by Platform
9.2.4.4.2. Rest of Europe Memory Packaging Market by Application
9.2.4.4.3. Rest of Europe Memory Packaging Market by End-use Industry
9.3. Asia Pacific
9.3.1. Asia Pacific Memory Packaging Market by Platform
9.3.2. Asia Pacific Memory Packaging Market by Application
9.3.3. Asia Pacific Memory Packaging Market by End-use Industry
9.3.4. Asia Pacific Memory Packaging Market by Country
9.3.4.1. China Memory Packaging Market
9.3.4.1.1. China Memory Packaging Market by Platform
9.3.4.1.2. China Memory Packaging Market by Application
9.3.4.1.3. China Memory Packaging Market by End-use Industry
9.3.4.2. Japan Memory Packaging Market
9.3.4.2.1. Japan Memory Packaging Market by Platform
9.3.4.2.2. Japan Memory Packaging Market by Application
9.3.4.2.3. Japan Memory Packaging Market by End-use Industry
9.3.4.3. India Memory Packaging Market
9.3.4.3.1. India Memory Packaging Market by Platform
9.3.4.3.2. India Memory Packaging Market by Application
9.3.4.3.3. India Memory Packaging Market by End-use Industry
9.3.4.4. Rest of Asia-Pacific Memory Packaging Market
9.3.4.4.1. Rest of Asia-Pacific Memory Packaging Market by Platform
9.3.4.4.2. Rest of Asia-Pacific Memory Packaging Market by Application
9.3.4.4.3. Rest of Asia-Pacific Memory Packaging Market by End-use Industry
9.4. RoW
9.4.1. RoW Memory Packaging Market by Platform
9.4.2. RoW Memory Packaging Market by Application
9.4.3. RoW Memory Packaging Market by End-use Industry
9.4.4. RoW Memory Packaging Market by Sub-region
9.4.4.1. Latin America Memory Packaging Market
9.4.4.1.1. Latin America Memory Packaging Market by Platform
9.4.4.1.2. Latin America Memory Packaging Market by Application
9.4.4.1.3. Latin America Memory Packaging Market by End-use Industry
9.4.4.2. Middle East Memory Packaging Market
9.4.4.2.1. Middle East Memory Packaging Market by Platform
9.4.4.2.2. Middle East Memory Packaging Market by Application
9.4.4.2.3. Middle East Memory Packaging Market by End-use Industry
9.4.4.3. Africa Memory Packaging Market
9.4.4.3.1. Africa Memory Packaging Market by Platform
9.4.4.3.2. Africa Memory Packaging Market by Application
9.4.4.3.3. Africa Memory Packaging Market by End-use Industry

Table Information