Fan-out Packaging Market: Global Industry Analysis, Trends, Market Size, and Forecasts up to 2032

The report on the global fan-out packaging market provides qualitative and quantitative analysis for the period from 2022-2032. The global fan-out packaging market was valued at USD 2.57 billion in 2023 and is expected to reach USD 10.47 billion in 2032, with a CAGR of 17.91% during the forecast period 2024-2032. The study on fan-out packaging market covers the analysis of the leading geographies such as North America, Europe, Asia Pacific, and RoW for the period of 2022-2032.

The report on fan-out packaging market is a comprehensive study and presentation of drivers, restraints, opportunities, demand factors, market size, forecasts, and trends in the global fan-out packaging market over the period of 2022-2032. Moreover, the report is a collective presentation of primary and secondary research findings.

Porter's five forces model in the report provides insights into the competitive rivalry, supplier and buyer positions in the market and opportunities for the new entrants in the global fan-out packaging market over the period of 2022-2032. Furthermore, the growth matrix given in the report brings an insight into the investment areas that existing or new market players can consider.

Report Findings

1) Drivers

Increasing demand for the 5G infrastructure is propelling the market expansion.
Increasing demand for consumer electronics is fostering the fan-out packaging market growth.

2) Restraints

High manufacturing costs and capital investments are hampering the market expansion.

3) Opportunities

The implementation of artificial intelligence (AI) and machine learning (ML) is expected to create lucrative opportunities in the market in the coming years.

Research Methodology

A) Primary Research

The primary research involves extensive interviews and analysis of the opinions provided by the primary respondents. The primary research starts with identifying and approaching the primary respondents, the primary respondents are approached include
1. Key Opinion Leaders
2. Internal and External subject matter experts
3. Professionals and participants from the industry

The primary research respondents typically include

1. Executives working with leading companies in the market under review
2. Product/brand/marketing managers
3. CXO level executives
4. Regional/zonal/ country managers
5. Vice President level executives.

B) Secondary Research

Secondary research involves extensive exploring through the secondary sources of information available in both the public domain and paid sources. Each research study is based on over 500 hours of secondary research accompanied by primary research. The information obtained through the secondary sources is validated through the crosscheck on various data sources.

The secondary sources of the data typically include

1. Company reports and publications
2. Government/institutional publications
3. Trade and associations journals
4. Databases such as WTO, OECD, World Bank, and among others.
5. Websites and publications by research agencies

Segment Covered

The global fan-out packaging market is segmented on the basis of type, packaging type, carrier type, business model, and end-use industry.

The Global Fan-out Packaging Market by Type

Core Fan-out
High-density Fan-out
Ultra High-density Fan-out

The Global Fan-out Packaging Market by Packaging Type

Fan-out Wafer-level Packages (FOWLP)
Fan-out Chip-on-wafer Packages (FOCoW)
Fan-out Panel-level Packages (FOPLP)
Fan-out Chip-on-substrate Packages (FOCoS)

The Global Fan-out Packaging Market by Carrier Type

200 mm
300 mm
Panel

The Global Fan-out Packaging Market by Business Model

OSAT
IDM
Foundry

The Global Fan-out Packaging Market by End-use Industry

Artificial Intelligence (AI) / Machine Learning (ML)
High-performance Computing (HPC)
Consumer Electronics
Telecommunication
Automotive
Industrial
Others

Company Profiles

The companies covered in the report include

Taiwan Semiconductor Manufacturing Company Limited
Samsung Electronics Co., Ltd.
Amkor Technology, Inc.
Jiangsu Changdian Integrated Technology Co., Ltd.
Powertech Technology Inc.
ASE Technology Holding Co., Ltd.
Evatec AG.
Camtek
NEPES
SK HYNIX INC.

What does this report deliver?

1. Comprehensive analysis of the global as well as regional markets of the fan-out packaging market.
2. Complete coverage of all the segments in the fan-out packaging market to analyze the trends, developments in the global market and forecast of market size up to 2032.
3. Comprehensive analysis of the companies operating in the global fan-out packaging market. The company profile includes analysis of product portfolio, revenue, SWOT analysis and latest developments of the company.
4. Growth Matrix presents an analysis of the product segments and geographies that market players should focus to invest, consolidate, expand and/or diversify.

Chapter 1. Preface

1.1. Report Description
1.2. Research Methods
1.3. Research Approaches

Chapter 2. Executive Summary

2.1. Fan-out Packaging Market Highlights
2.2. Fan-out Packaging Market Projection
2.3. Fan-out Packaging Market Regional Highlights

Chapter 3. Global Fan-out Packaging Market Overview

3.1. Introduction
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Restraints
3.2.3. Opportunities
3.3. Porter's Five Forces Analysis
3.4. Growth Matrix Analysis
3.4.1. Growth Matrix Analysis by Type
3.4.2. Growth Matrix Analysis by Packaging Type
3.4.3. Growth Matrix Analysis by Carrier Type
3.4.4. Growth Matrix Analysis by Business Model
3.4.5. Growth Matrix Analysis by End-use Industry
3.4.6. Growth Matrix Analysis by Region
3.5. Value Chain Analysis of Fan-out Packaging Market

Chapter 4. Fan-out Packaging Market Macro Indicator Analysis

Chapter 5. Company Profiles and Competitive Landscape

5.1. Competitive Landscape in the Global Fan-out Packaging Market
5.2. Companies Profiles
5.2.1. Taiwan Semiconductor Manufacturing Company Limited
5.2.2. Samsung Electronics Co., Ltd.
5.2.3. Amkor Technology, Inc.
5.2.4. Jiangsu Changdian Integrated Technology Co., Ltd.
5.2.5. Powertech Technology Inc.
5.2.6. ASE Technology Holding Co., Ltd.
5.2.7. Evatec AG.
5.2.8. Camtek
5.2.9. NEPES
5.2.10. SK HYNIX INC.

Chapter 6. Global Fan-out Packaging Market by Type

6.1. Core Fan-out
6.2. High-density Fan-out
6.3. Ultra High-density Fan-out

Chapter 7. Global Fan-out Packaging Market by Packaging Type

7.1. Fan-out Wafer-level Packages (FOWLP)
7.2. Fan-out Chip-on-wafer Packages (FOCoW)
7.3. Fan-out Panel-level Packages (FOPLP)
7.4. Fan-out Chip-on-substrate Packages (FOCoS)

Chapter 8. Global Fan-out Packaging Market by Carrier Type

8.1. 200 mm
8.2. 300 mm
8.3. Panel

Chapter 9. Global Fan-out Packaging Market by Business Model

9.1. OSAT
9.2. IDM
9.3. Foundry

Chapter 10. Global Fan-out Packaging Market by End-use Industry

10.1. Artificial Intelligence (AI) / Machine Learning (ML)
10.2. High-performance Computing (HPC)
10.3. Consumer Electronics
10.4. Telecommunication
10.5. Automotive
10.6. Industrial
10.7. Others

Chapter 11. Global Fan-out Packaging Market by Region 2024-2032

11.1. North America
11.1.1. North America Fan-out Packaging Market by Type
11.1.2. North America Fan-out Packaging Market by Packaging Type
11.1.3. North America Fan-out Packaging Market by Carrier Type
11.1.4. North America Fan-out Packaging Market by Business Model
11.1.5. North America Fan-out Packaging Market by End-use Industry
11.1.6. North America Fan-out Packaging Market by Country
11.1.6.1. The U.S. Fan-out Packaging Market
11.1.6.1.1. The U.S. Fan-out Packaging Market by Type
11.1.6.1.2. The U.S. Fan-out Packaging Market by Packaging Type
11.1.6.1.3. The U.S. Fan-out Packaging Market by Carrier Type
11.1.6.1.4. The U.S. Fan-out Packaging Market by Business Model
11.1.6.1.5. The U.S. Fan-out Packaging Market by End-use Industry
11.1.6.2. Canada Fan-out Packaging Market
11.1.6.2.1. Canada Fan-out Packaging Market by Type
11.1.6.2.2. Canada Fan-out Packaging Market by Packaging Type
11.1.6.2.3. Canada Fan-out Packaging Market by Carrier Type
11.1.6.2.4. Canada Fan-out Packaging Market by Business Model
11.1.6.2.5. Canada Fan-out Packaging Market by End-use Industry
11.1.6.3. Mexico Fan-out Packaging Market
11.1.6.3.1. Mexico Fan-out Packaging Market by Type
11.1.6.3.2. Mexico Fan-out Packaging Market by Packaging Type
11.1.6.3.3. Mexico Fan-out Packaging Market by Carrier Type
11.1.6.3.4. Mexico Fan-out Packaging Market by Business Model
11.1.6.3.5. Mexico Fan-out Packaging Market by End-use Industry
11.2. Europe
11.2.1. Europe Fan-out Packaging Market by Type
11.2.2. Europe Fan-out Packaging Market by Packaging Type
11.2.3. Europe Fan-out Packaging Market by Carrier Type
11.2.4. Europe Fan-out Packaging Market by Business Model
11.2.5. Europe Fan-out Packaging Market by End-use Industry
11.2.6. Europe Fan-out Packaging Market by Country
11.2.6.1. Germany Fan-out Packaging Market
11.2.6.1.1. Germany Fan-out Packaging Market by Type
11.2.6.1.2. Germany Fan-out Packaging Market by Packaging Type
11.2.6.1.3. Germany Fan-out Packaging Market by Carrier Type
11.2.6.1.4. Germany Fan-out Packaging Market by Business Model
11.2.6.1.5. Germany Fan-out Packaging Market by End-use Industry
11.2.6.2. United Kingdom Fan-out Packaging Market
11.2.6.2.1. United Kingdom Fan-out Packaging Market by Type
11.2.6.2.2. United Kingdom Fan-out Packaging Market by Packaging Type
11.2.6.2.3. United Kingdom Fan-out Packaging Market by Carrier Type
11.2.6.2.4. United Kingdom Fan-out Packaging Market by Business Model
11.2.6.2.5. United Kingdom Fan-out Packaging Market by End-use Industry
11.2.6.3. France Fan-out Packaging Market
11.2.6.3.1. France Fan-out Packaging Market by Type
11.2.6.3.2. France Fan-out Packaging Market by Packaging Type
11.2.6.3.3. France Fan-out Packaging Market by Carrier Type
11.2.6.3.4. France Fan-out Packaging Market by Business Model
11.2.6.3.5. France Fan-out Packaging Market by End-use Industry
11.2.6.4. Rest of Europe Fan-out Packaging Market
11.2.6.4.1. Rest of Europe Fan-out Packaging Market by Type
11.2.6.4.2. Rest of Europe Fan-out Packaging Market by Packaging Type
11.2.6.4.3. Rest of Europe Fan-out Packaging Market by Carrier Type
11.2.6.4.4. Rest of Europe Fan-out Packaging Market by Business Model
11.2.6.4.5. Rest of Europe Fan-out Packaging Market by End-use Industry
11.3. Asia Pacific
11.3.1. Asia Pacific Fan-out Packaging Market by Type
11.3.2. Asia Pacific Fan-out Packaging Market by Packaging Type
11.3.3. Asia Pacific Fan-out Packaging Market by Carrier Type
11.3.4. Asia Pacific Fan-out Packaging Market by Business Model
11.3.5. Asia Pacific Fan-out Packaging Market by End-use Industry
11.3.6. Asia Pacific Fan-out Packaging Market by Country
11.3.6.1. China Fan-out Packaging Market
11.3.6.1.1. China Fan-out Packaging Market by Type
11.3.6.1.2. China Fan-out Packaging Market by Packaging Type
11.3.6.1.3. China Fan-out Packaging Market by Carrier Type
11.3.6.1.4. China Fan-out Packaging Market by Business Model
11.3.6.1.5. China Fan-out Packaging Market by End-use Industry
11.3.6.2. Japan Fan-out Packaging Market
11.3.6.2.1. Japan Fan-out Packaging Market by Type
11.3.6.2.2. Japan Fan-out Packaging Market by Packaging Type
11.3.6.2.3. Japan Fan-out Packaging Market by Carrier Type
11.3.6.2.4. Japan Fan-out Packaging Market by Business Model
11.3.6.2.5. Japan Fan-out Packaging Market by End-use Industry
11.3.6.3. India Fan-out Packaging Market
11.3.6.3.1. India Fan-out Packaging Market by Type
11.3.6.3.2. India Fan-out Packaging Market by Packaging Type
11.3.6.3.3. India Fan-out Packaging Market by Carrier Type
11.3.6.3.4. India Fan-out Packaging Market by Business Model
11.3.6.3.5. India Fan-out Packaging Market by End-use Industry
11.3.6.4. Rest of Asia-Pacific Fan-out Packaging Market
11.3.6.4.1. Rest of Asia-Pacific Fan-out Packaging Market by Type
11.3.6.4.2. Rest of Asia-Pacific Fan-out Packaging Market by Packaging Type
11.3.6.4.3. Rest of Asia-Pacific Fan-out Packaging Market by Carrier Type
11.3.6.4.4. Rest of Asia-Pacific Fan-out Packaging Market by Business Model
11.3.6.4.5. Rest of Asia-Pacific Fan-out Packaging Market by End-use Industry
11.4. RoW
11.4.1. RoW Fan-out Packaging Market by Type
11.4.2. RoW Fan-out Packaging Market by Packaging Type
11.4.3. RoW Fan-out Packaging Market by Carrier Type
11.4.4. RoW Fan-out Packaging Market by Business Model
11.4.5. RoW Fan-out Packaging Market by End-use Industry
11.4.6. RoW Fan-out Packaging Market by Sub-region
11.4.6.1. Latin America Fan-out Packaging Market
11.4.6.1.1. Latin America Fan-out Packaging Market by Type
11.4.6.1.2. Latin America Fan-out Packaging Market by Packaging Type
11.4.6.1.3. Latin America Fan-out Packaging Market by Carrier Type
11.4.6.1.4. Latin America Fan-out Packaging Market by Business Model
11.4.6.1.5. Latin America Fan-out Packaging Market by End-use Industry
11.4.6.2. Middle East Fan-out Packaging Market
11.4.6.2.1. Middle East Fan-out Packaging Market by Type
11.4.6.2.2. Middle East Fan-out Packaging Market by Packaging Type
11.4.6.2.3. Middle East Fan-out Packaging Market by Carrier Type
11.4.6.2.4. Middle East Fan-out Packaging Market by Business Model
11.4.6.2.5. Middle East Fan-out Packaging Market by End-use Industry
11.4.6.3. Africa Fan-out Packaging Market
11.4.6.3.1. Africa Fan-out Packaging Market by Type
11.4.6.3.2. Africa Fan-out Packaging Market by Packaging Type
11.4.6.3.3. Africa Fan-out Packaging Market by Carrier Type
11.4.6.3.4. Africa Fan-out Packaging Market by Business Model
11.4.6.3.5. Africa Fan-out Packaging Market by End-use Industry

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