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China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semiconductor Export, Alternate Destination - Trends and Strategic Recommendation

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    Report

  • 104 Pages
  • June 2025
  • Region: China, Global
  • Markets and Markets
  • ID: 6102350
In 2024, China’s exports of automotive semiconductors reached USD 419.15 billion in 2024, from USD 280.81 billion in 2020, with a CAGR of 8.9%, driven by increased sales of autonomous and electric vehicles.

China’s semiconductor market for the automotive sector is experiencing substantial investment from both domestic and global companies. Major players such as SMIC, Huawei’s HiSilicon, YMTC, BYD Semiconductor, and Tsinghua Unigroup are leading domestic efforts, while international firms like Intel, Samsung, and SK Hynix are expanding their presence through joint ventures and new fabrication plants. The Chinese government supports the market with the National Integrated Circuit Industry Investment Fund (Big Fund), local government funds, subsidies, tax breaks, and low-interest loans, all aimed at achieving self-sufficiency and a complete supply chain.

As global demand for advanced electronics and automotive technologies surges, China exports semiconductors worldwide, often using Hong Kong as a trade hub. The rise of modern vehicles, primarily electric and connected cars, has significantly increased the demand for semiconductors, as these vehicles require advanced chips for powertrain control, advanced driver assistance, infotainment, and battery management. Consequently, the automotive sector has become a key driver of semiconductor growth in China.

Memory chips are the second-largest segment in China’s automotive semiconductor market.

Memory chips rank second in the Chinese automotive semiconductor market. These chips also hold the second-largest position in the global semiconductor industry due to soaring demand for data storage and processing, driven by AI, data centers, consumer electronics, and advanced automotive technologies. Memory chips are vital for storing and retrieving data in electronic devices, enabling everything from application execution to real-time system operations - an essential requirement for modern vehicles that rely on significant amounts of data for infotainment, ADAS, and autonomous driving features. Memory chips are extensively used in high-end infotainment systems, ADAS, and digital instrument clusters in cars.

Electric and autonomous vehicles demand even more memory due to their complex computing and data processing needs. China is focusing on boosting domestic production of mature-node chips while also making significant advancements in advanced memory technology, particularly in NAND and DRAM, with companies like YMTC and CXMT leading the way. YMTC has developed advanced 3D TLC NAND chips that compete with global leaders like Samsung and Micron, while CXMT has produced and released G4 DDR5 DRAM. SMIC has also manufactured 7 nm chips for Huawei’s Mate 60 Pro.

India is the second-largest importer of semiconductors from China.

India is the second-largest importer of electronics, integrated circuits, and memory chips worldwide. This is primarily due to the country’s robust electronics sector, digitalization, and the lack of large-scale domestic semiconductor manufacturing. In 2024, imports of electronic integrated circuits from China alone reached USD 6.1 million. These components are essential in the automotive sector for advanced features such as infotainment, ADAS, telematics, and digital instrument clusters, which require significant memory and processing power. The Indian market for advanced automotive features is rapidly growing, driven by rising consumer demand for connectivity, safety, and electrification.

The adoption of EVs and connected cars is accelerating, supported by government initiatives like the Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME) scheme. Investment in India’s electronics and semiconductor ecosystem is also on the rise, with both domestic and international companies expanding production and R&D. The government has launched incentive programs such as the Production-Linked Incentive (PLI) scheme for electronics manufacturing, further increasing demand for imported memory and integrated circuits as local supply struggles to keep pace. Recent examples include automakers like Tata Motors and Mahindra integrating more sophisticated electronics into their latest models, reflecting the broader trend of technology-driven growth in India’s automotive and electronics sectors.

Research Coverage:

The report provides an in-depth analysis of the China semiconductor market for automotive, focusing on various types, including microcontrollers, power semiconductors, sensors & MEMS devices, memory chips, and analog & mixed-signal integrated circuits. It examines export trends, the impact of trade policies and restrictions, and the diversification of the semiconductor industry away from China. The report also explores alternative manufacturing destinations, offering a comparative analysis of these locations, along with the challenges and strategies associated with the transition.

Additionally, the report assesses the effects of the global automotive sector on the semiconductor market and presents a future outlook. It includes detailed information about the major factors driving growth in China’s semiconductor market. A thorough analysis of key industry players provides insights into their business overviews, product offerings, key strategies, contracts, partnerships, agreements, new product launches, mergers, and acquisitions.

Key Benefits of Buying this Report:

The report provides valuable information for market leaders and new entrants regarding revenue estimates for both the overall automotive semiconductor market in China and its sub-segments. It will assist stakeholders in understanding the competitive landscape, positioning their businesses more effectively, and planning appropriate go-to-market strategies. Additionally, the report offers insights into the current market conditions and highlights key drivers, restraints, challenges, and opportunities within the industry.

The report provides insights into the following points:

  • Analysis of critical drivers (increased domestic investments in semiconductors), restraints (shortage of manufacturing facilities for 12 mm machines), opportunities (substantial investments by < 12-inch wafer manufacturers), and challenges (technological gap) influencing the growth of the China semiconductor market for automotive
  • Product Development/Innovation: Detailed insights into upcoming technologies and new products launched in the China semiconductor market for automotive
  • Market Development: Comprehensive market information - the report analyses the authentication and brand protection market across Chinese countries
  • Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the China semiconductor market for automotive
  • Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players, such as SMIC, GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon

Table of Contents

1 Introduction
1.1 Global Automotive Semiconductor Industry Overview
1.2 Historical Development of China Automotive Semiconductor Industry
1.2.1 2010-2014
1.2.2 2015-2020
1.2.3 2021-2025
1.3 Key Factors Driving Industry Shift from China
1.3.1 Regulatory Factors
1.3.1.1 Restrictive Controls by Us Government
1.3.1.2 Chips Act and Other Global Legislation
1.3.1.3 National Security Concerns
1.3.2 Geopolitical Factors
1.3.2.1 Taiwan Strait Tensions
1.3.2.2 Russia-Ukraine War
1.3.2.3 Technology Alliances
1.3.2.4 Technology Limitations
1.3.3 Economic and Supply Chain Factors
1.3.3.1 Rising Manufacturing Costs in China
1.3.3.2 Incentives from Alternative Locations
1.3.4 Challenges
1.3.4.1 Dependency on Foreign Ip & Architecture and Gaps in Certification
1.3.4.2 Heavy Reliance on Imported Semiconductor Manufacturing Equipment
2 China Automotive Semiconductor Industry
2.1 Current State of China's Automotive Semiconductors
2.1.1 Microcontrollers
2.1.1.1 Key Manufacturers, Core Competencies, and Production Capacities
2.1.1.2 Future Roadmap
2.1.2 Power Semiconductors
2.1.2.1 Key Manufacturers, Core Competencies, and Production Capacities
2.1.2.2 Future Roadmap
2.1.3 Sensors & Mems
2.1.3.1 Key Manufacturers, Core Competencies, and Production Capacities
2.1.3.2 Future Roadmap
2.1.4 Memory Chips
2.1.4.1 Key Manufacturers, Core Competencies, and Production Capacities
2.1.4.2 Future Roadmap
2.1.5 Analog & Mixed-Signal Integrated Circuits
2.1.5.1 Key Manufacturers, Core Competencies, and Production Capacities
2.1.5.2 Future Roadmap
2.2 Market Value Assessment
3 Key Players in China Automotive Semiconductor Industry
3.1 Domestic Manufacturers
3.1.1 Smic
3.1.1.1 Overview
3.1.1.2 Recent Financials
3.1.1.3 Production Plants and Capacity
3.1.1.4 Future Strategy
3.1.2 Gigadevice
3.1.2.1 Overview
3.1.2.2 Recent Financials
3.1.2.3 Production Plants and Capacity
3.1.2.4 Future Strategy
3.1.3 Novosense Microelectronics
3.1.3.1 Overview
3.1.3.2 Recent Financials
3.1.3.3 Production Plants and Capacity
3.1.3.4 Future Strategy
3.1.4 Silan Microelectronics
3.1.4.1 Overview
3.1.4.2 Recent Financials
3.1.4.3 Production Plants and Capacity
3.1.4.4 Future Strategy
3.1.5 Hisilicon
3.1.5.1 Overview
3.1.5.2 Recent Financials
3.1.5.3 Production Plants and Capacity
3.1.5.4 Future Strategy
3.1.6 Hua Hong Semiconductor Limited
3.1.6.1 Overview
3.1.6.2 Recent Financials
3.1.6.3 Production Plants and Capacity
3.1.6.4 Future Strategy
3.1.7 Byd Semiconductor
3.1.7.1 Overview
3.1.7.2 Recent Financials
3.1.7.3 Production Plants and Capacity
3.1.7.4 Future Strategy
3.1.8 Nexperia
3.1.8.1 Overview
3.1.8.2 Recent Financials
3.1.8.3 Production Plants and Capacity
3.1.8.4 Future Strategy
3.1.9 Changxin Memory Technologies
3.1.9.1 Overview
3.1.9.2 Recent Financials
3.1.9.3 Production Plants and Capacity
3.1.9.4 Future Strategy
3.1.10 Yangtze Memory Technologies Corp
3.1.10.1 Overview
3.1.10.2 Recent Financials
3.1.10.3 Production Plants and Capacity
3.1.10.4 Future Strategy
3.1.11 Goertek Microelectronics Inc.
3.1.11.1 Overview
3.1.11.2 Recent Financials
3.1.11.3 Production Plants and Capacity
3.1.11.4 Future Strategy
3.1.12 China Resources Microelectronics Limited
3.1.12.1 Overview
3.1.12.2 Recent Financials
3.1.12.3 Production Plants and Capacity
3.1.12.4 Future Strategy
3.1.13 Hesai Technology
3.1.13.1 Overview
3.1.13.2 Recent Financials
3.1.13.3 Production Plants and Capacity
3.1.13.4 Future Strategy
3.1.14 Others
3.2 Global Manufacturers in China
3.2.1 Nxp Semiconductors
3.2.1.1 Overview
3.2.1.2 Recent Financials
3.2.1.3 Production Plants and Capacity
3.2.1.4 Future Strategy
3.2.2 Infineon Technologies
3.2.2.1 Overview
3.2.2.2 Recent Financials
3.2.2.3 Production Plants and Capacity
3.2.2.4 Future Strategy
3.2.3 Stmicroelectronics
3.2.3.1 Overview
3.2.3.2 Recent Financials
3.2.3.3 Production Plants and Capacity
3.2.3.4 Future Strategy
3.2.4 Texas Instruments
3.2.4.1 Overview
3.2.4.2 Recent Financials
3.2.4.3 Production Plants and Capacity
3.2.4.4 Future Strategy
3.2.5 Renesas Electronics Corporation
3.2.5.1 Overview
3.2.5.2 Recent Financials
3.2.5.3 Production Plants and Capacity
3.2.5.4 Future Strategy
3.3 Joint Ventures and Strategic Partnerships
4 Export Analysis of China's Automotive Semiconductors
4.1 Key Export Product Categories
4.2 Global Semiconductor Exports
4.2.1 Electronic Integrated Circuits (Hs Code 854231)
4.2.2 Electronic Integrated Circuits as Memories (Hs Code 854232)
4.2.3 Electronic Integrated Circuits as Amplifiers (Hs Code 854233)
4.2.4 Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers) (Hs Code 854239)
4.2.5 Parts of Electronic Integrated Circuits (Hs Code 854290)
4.3 Exports from China
4.3.1 Electronic Integrated Circuits (Hs Code 854231)
4.3.1.1 China
4.3.1.2 Hong Kong, China
4.3.2 Electronic Integrated Circuits as Memories (Hs Code 854232)
4.3.2.1 China
4.3.2.2 Hong Kong, China
4.3.3 Electronic Integrated Circuits as Amplifiers (Hs Code 854233)
4.3.3.1 China
4.3.3.2 Hong Kong, China
4.3.4 Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers) (Hs Code 854239)
4.3.4.1 China
4.3.4.2 Taipei, China
4.3.4.3 Hong Kong, China
5 Diversification of China Automotive Semiconductor Industry
5.1 Geopolitical Factors
5.1.1 Us-China Trade Tensions
5.1.1.1 Us-China Tariffs
5.1.1.2 Diversification Strategies
5.1.2 Technology Export Controls
5.1.2.1 Us & Chinese Technology Export Controls
5.1.2.2 Impact of Export Controls
5.1.3 National Security Concerns
5.2 Supply Chain Resilience Strategies
5.2.1 Knowledge Gained from COVID-19 Pandemic
5.2.1.1 Realization by China After COVID-19
5.2.1.2 Impact on Global Players
5.2.1.3 Shift from Jit to Strategic Resilience
5.3 Economic Factors
5.3.1 Rising Manufacturing Costs in China
5.3.1.1 Cost Comparison
5.3.1.2 Bill of Materials
5.3.2 Incentive Programs in Alternative Locations
5.4 Impact on Global Automotive Industry
5.4.1 Effects on Automotive Production Costs
5.4.2 Supply Chain Reliability and Resilience
5.4.3 Regional Manufacturing Clusters
5.4.4 Technology Development and Innovation Patterns
6 Alternative Manufacturing Destinations
6.1 Overview
6.2 Comparative Analysis of Alternative Manufacturing Locations
6.2.1 Ranking as Alternatives to China
6.3 Technology Dominance, by Country/Region
6.4 Southeast Asia
6.4.1 Malaysia
6.4.1.1 Government Incentives and Support
6.4.1.2 Key Diversifications
6.4.1.3 Challenges
6.4.2 Vietnam
6.4.2.1 Government Incentives and Support
6.4.2.2 Key Diversifications
6.4.2.3 Challenges
6.4.3 Thailand
6.4.3.1 Government Incentives and Support
6.4.3.2 Key Diversifications
6.4.3.3 Challenges
6.4.4 Singapore
6.4.4.1 Government Incentives and Support
6.4.4.2 Key Diversifications
6.4.4.3 Challenges
6.4.5 South Korea
6.4.5.1 Government Incentives and Support
6.4.5.2 Key Diversifications
6.4.5.3 Impact of Key Players
6.4.5.3.1 Samsung
6.4.5.3.2 Sk Hynix
6.4.5.4 Challenges
6.4.6 Taiwan
6.4.6.1 Government Incentives and Support
6.4.6.2 Key Diversifications
6.4.6.3 Impact of Key Players
6.4.6.3.1 Tsmc
6.4.6.4 Challenges
6.5 North America
6.5.1 Government Incentives and Support
6.5.2 Key Diversifications
6.5.2.1 Us
6.5.2.2 Mexico
6.5.3 Challenges
6.6 Europe
6.6.1 Incentives by European Countries
6.6.1.1 Germany
6.6.1.2 France
6.6.1.3 Italy
6.6.2 European Manufacturing Hubs
6.7 India
6.7.1 Government Incentives and Support
6.7.2 Key Diversifications
6.7.3 Challenges
7 Future Outlook and Recommendations
7.1 Projected Industry Shifts, 2025-2030
7.2 Technology Roadmap
7.3 Strategic Recommendations for Industry Stakeholders
7.3.1 Diversification
7.3.2 Technology
7.3.3 Supply Chain
List of Tables
Table 1 Automotive Semiconductor Components Dominated by China
Table 2 Us Export Controls and Sanctions
Table 3 Semiconductor Support Programs
Table 4 Price Hikes of Semiconductor-Related Materials Before And After Russia-Ukraine War
Table 5 Technology Alliances and Their Impact on China Automotive Semiconductor Industry
Table 6 Country-Wise Incentives on Semiconductor Components
Table 7 Equipment and Key Foreign Suppliers
Table 8 Microcontrollers: Key Manufacturers, Core Competencies, And Production Capacities
Table 9 Power Semiconductors: Key Manufacturers, Core Competencies, And Production Capacities
Table 10 Sensors & Mems: Key Manufacturers, Core Competencies, And Production Capacities
Table 11 Lidar: Key Manufacturers, Core Competencies, And Production Capacities
Table 12 Memory Chips: Key Manufacturers, Core Competencies, And Production Capacities
Table 13 Analog & Mixed-Signal Integrated Circuits: Key Manufacturers, Core Competencies, and Production Capacities
Table 14 Smic: Recent Financials, 2023 Vs. 2024
Table 15 Smic: Production Plants
Table 16 Smic: Production Capacity
Table 17 Gigadevice: Recent Financials, 2023 Vs. 2024
Table 18 Gigadevice: Production Plants
Table 19 Novosense Microelectronics: Recent Financials, 2023 Vs. 2024
Table 20 Novosense Microelectronics: Production Plants
Table 21 Novosense Microelectronics: Production Capacity
Table 22 Silen Microelectronics: Recent Financials, 2023 Vs. 2024
Table 23 Silen Microelectronics: Production Plants
Table 24 Silen Microelectronics: Production Capacity
Table 25 Hisilicon: Recent Financials, 2023 Vs. 2024
Table 26 Hisilicon: Recent Financials, by Region, 2023 Vs. 2024
Table 27 Hisilicon: Recent Financials, by Business Segment, 2023 Vs. 2024
Table 28 Hisilicon: Production Plants
Table 29 Hua Hong Semiconductor Limited: Recent Financials, 2023 Vs. 2024
Table 30 Hua Hong Semiconductor Limited: Recent Financials, By Service, 2023 Vs. 2024
Table 31 Hua Hong Semiconductor Limited: Recent Financials, By End Market, 2023 Vs. 2024
Table 32 Hua Hong Semiconductor Limited: Production Plants
Table 33 Hua Hong Semiconductor Limited: Production Capacity
Table 34 Byd Semiconductor: Recent Financials, 2023 Vs. 2024
Table 35 Byd Semiconductor: Production Plants
Table 36 Byd Semiconductor: Production Capacity
Table 37 Nexperia: Recent Financials, 2023 Vs. 2024
Table 38 Nexperia: Production Plants
Table 39 Nexperia: Production Capacity
Table 40 Changxin Memory Technologies: Production Plants
Table 41 Changxin Memory Technologies: Production Capacity
Table 42 Yangtze Memory Technologies Corp: Recent Financials, 2023 Vs. 2024
Table 43 Yangtze Memory Technologies Corp: Production Plants
Table 44 Yangtze Memory Technologies Corp: Production Capacity
Table 45 Goertek Microelectronics Inc.: Recent Financials, 2023 Vs. 2024
Table 46 Goertek Microelectronics Inc.: Production Plants
Table 47 China Resources Microelectronics Limited: Recent Financials, 2023 Vs. 2024
Table 48 China Resources Microelectronics Limited: Production Plants
Table 49 China Resources Microelectronics Limited: Production Capacity
Table 50 Hesai Technology: Recent Financials, 2023 Vs. 2024
Table 51 Hesai Technology: Production Plants
Table 52 Hesai Technology: Production Capacity
Table 53 Other Chinese Automotive Semiconductor Manufacturers: Recent Financials and Products Manufactured
Table 54 Nxp Semiconductors: Recent Financials, 2023 Vs. 2024
Table 55 Nxp Semiconductors: Production Plants
Table 56 Infineon Technologies: Recent Financials, 2023 Vs. 2024
Table 57 Infineon Technologies: Production Plants
Table 58 Stmicroelectronics: Recent Financials, 2023 Vs. 2024
Table 59 Stmicroelectronics: Production Plants
Table 60 Texas Instruments: Recent Financials, 2023 Vs. 2024
Table 61 Texas Instruments: Production Plants
Table 62 Renesas Electronics Corporation: Recent Financials, 2023 Vs. 2024
Table 63 Renesas Electronics Corporation: Production Plants
Table 64 Strategic Partnerships Between Semiconductor Manufacturers in China
Table 65 Global Semiconductor Exports, by Product, 2020-2024 (USD Billion)
Table 66 China Semiconductor Exports, by Product, 2020-2024 (USD Billion)
Table 67 Exports of Electronics Integrated Circuits, By Country, 2020-2024 (USD Billion)
Table 68 Exports of Electronics Integrated Circuits as Memories, By Country, 2020-2024 (USD Billion)
Table 69 Exports of Electronics Integrated Circuits as Memories, By Country, 2020-2024 (USD Million)
Table 70 Exports of Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers), by Country, 2020-2024 (USD Million)
Table 71 Exports of Parts of Electronic Integrated Circuits, By Country, 2020-2024 (USD Million)
Table 72 China: Exports of Electronics Integrated Circuits, By Country, 2020-2024 (USD Million)
Table 73 Hong Kong, China: Exports of Electronics Integrated Circuits, By Country, 2020-2024 (USD Million)
Table 74 China: Exports of Electronics Integrated Circuits as Memories, By Country, 2020-2024 (USD Million)
Table 75 Hong Kong, China: Exports of Electronics Integrated Circuits as Memories, by Country, 2020-2024 (USD Million)
Table 76 China: Exports of Electronics Integrated Circuits as Amplifiers, By Country, 2020-2024 (USD Million)
Table 77 Hong Kong, China: Exports of Electronics Integrated Circuits as Amplifiers, by Country, 2020-2024 (USD Million)
Table 78 China: Exports of Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers), by Country, 2020-2024 (USD Million)
Table 79 Taipei, China: Exports of Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers), By Country, 2020-2024 (USD Million)
Table 80 Hong Kong, China: Exports of Electronic Integrated Circuits (Excl. Processors, Controllers, Memories, and Amplifiers), By Country, 2020-2024 (USD Million)
Table 81 Us-China Tariffs, 2023-2025
Table 82 Us Tariffs on Key Chinese Products/Components
Table 83 Chinese Semiconductor Manufacturers’ Diversification Strategies
Table 84 Us Technology Export Controls and Impact on China Automotive Semiconductor Industry
Table 85 Chinese Technology Export Controls and Impact on Us Automotive Semiconductor Industry
Table 86 China's Allegations of Cybersecurity and Espionage
Table 87 Global Supply Chain Recalibration: Key Examples
Table 88 Cost Comparison of Automotive Semiconductors, 2020-2021 Vs. 2024-2025
Table 89 Bill of Materials of Automotive Semiconductors, 2023 Vs. 2024
Table 90 Incentives/Subsidies for Automotive Semiconductor Manufacturing Outside China
Table 91 Comparative Analysis of Alternative Manufacturing Locations
Table 92 Technology Dominance, by Country/Region
Table 93 Players Diversifying to Malaysia and Their Automotive Focus
Table 94 Players Diversifying to Vietnam and Their Automotive Focus
Table 95 Players Diversifying to Thailand and Their Automotive Focus
Table 96 Players Diversifying to Singapore and Their Automotive Focus
Table 97 Players Diversifying to South Korea and Their Automotive Focus
Table 98 Players Diversifying to Taiwan and Their Automotive Focus
Table 99 Players Diversifying to Us and Their Automotive Focus
Table 100 Players Diversifying to Mexico and Their Automotive Focus
Table 101 Incentives for Automotive Semiconductor Industry By European Countries
Table 102 European Semiconductor Manufacturing Hubs
Table 103 Players Diversifying to India and Their Automotive Focus
Table 104 Automotive Semiconductor Technology Roadmap, 2024-2030
Table 105 Strategy for Country Selection
Table 106 Strategy for Technology Selection
Table 107 Strategy for Collaborative Models
List of Figures
Figure 1 Semiconductor Technology Trend, 1987-2023
Figure 2 Global Semiconductor Exports, 2020 Vs. 2024
Figure 3 China and Hong Kong Semiconductor Exports, 2020 Vs. 2024

Companies Mentioned

  • Smic
  • Gigadevice
  • Novosense Microelectronics
  • Silan Microelectronics
  • Hisilicon
  • Hua Hong Semiconductor Limited
  • Byd Semiconductor
  • Nexperia
  • Changxin Memory Technologies
  • Yangtze Memory Technologies Corp
  • Goertek Microelectronics Inc.
  • China Resources Microelectronics Limited
  • Hesai Technology
  • Nxp Semiconductors
  • Infineon Technologies
  • Stmicroelectronics
  • Texas Instruments
  • Renesas Electronics Corporation

Table Information