Next Generation Integrated Circuits - Global Strategic Business Report

The global market for Next Generation Integrated Circuits was estimated at US$1.5 Billion in 2024 and is projected to reach US$3.8 Billion by 2030, growing at a CAGR of 16.8% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Next Generation Integrated Circuits market.

Global Next Generation Integrated Circuits Market - Key Trends & Drivers Summarized

How Are Architectural Shifts Transforming Integrated Circuit Design?

Next generation integrated circuits (ICs) are being shaped by a shift away from traditional monolithic architectures toward more flexible and efficient configurations. Key developments include chiplets, 3D stacking, and heterogeneous integration, allowing multiple functional components to be combined into a single package. These approaches offer performance improvements while managing power consumption and reducing footprint. As semiconductor nodes approach physical limits, new design philosophies are required to maintain advancement in logic density and compute efficiency.

Chiplet-based architectures are gaining popularity, especially in high-performance computing and AI accelerators. These allow designers to combine components such as CPUs, GPUs, and memory modules with greater customization and yield efficiency. 3D ICs and through-silicon via (TSV) technologies are also enabling tighter integration of logic and memory, reducing latency and improving bandwidth. These innovations reflect the broader industry shift from transistor scaling to system-level innovation as the new driver of IC evolution.

What Role Do Materials and Fabrication Techniques Play in Innovation?

Material innovations are central to the development of next generation ICs. Use of silicon carbide, gallium nitride, and other wide-bandgap semiconductors is expanding, particularly in power electronics and high-frequency applications. These materials offer improved thermal performance, higher breakdown voltages, and faster switching, making them ideal for next-gen circuits used in electric vehicles, aerospace, and industrial automation systems.

On the fabrication side, extreme ultraviolet (EUV) lithography is enabling more precise patterning at advanced process nodes below 7nm. This is critical for integrating more transistors per chip while minimizing leakage and improving energy efficiency. Alongside, back-end-of-line (BEOL) process enhancements and novel interconnect solutions are supporting the high-density integration needed in modern ICs. Together, these advances in materials and manufacturing are laying the foundation for the next phase of semiconductor performance gains.

Why Is the End-Use Landscape Diversifying for Next Gen ICs?

Next generation integrated circuits are being rapidly adopted across a widening range of industries. Data centers and AI-focused hardware lead in terms of demand, as they require increasingly powerful and efficient compute systems. Consumer electronics, particularly smartphones and wearables, continue to benefit from energy-efficient SoC designs that integrate multiple functions on a single chip. Automotive systems, especially those involving autonomous driving and electric powertrains, also require specialized ICs capable of operating under strict thermal and safety constraints.

Industrial IoT, robotics, and edge computing applications are also contributing to demand, as they require customized ICs that combine sensing, processing, and communication capabilities. In the healthcare sector, miniaturized and high-performance ICs are essential for portable diagnostics, smart implants, and real-time patient monitoring. The market is no longer dominated by general-purpose chips alone-sector-specific requirements are driving the need for tailored IC solutions that combine performance, security, and reliability.

Growth in the next generation integrated circuits market is driven by several factors.

Rising demand for computing performance and energy efficiency in AI, data centers, and edge devices is pushing innovation in IC architecture and materials. The shift toward heterogeneous integration and chiplet-based design is enabling modularity, yield improvement, and scalability. Expansion of EVs, 5G networks, and industrial automation is increasing the need for ICs that perform under high power, frequency, and thermal constraints. Use of advanced fabrication techniques, such as EUV lithography and 3D integration, is allowing further miniaturization and functionality enhancement. Growth in custom ICs for industry-specific applications is also accelerating adoption across healthcare, automotive, aerospace, and consumer sectors.

Scope Of Study:

The report analyzes the Next Generation Integrated Circuits market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments: Component (Lasers Component, Modulators Component, Photo Detectors Component, Attenuators Component, Optical Amplifiers Component); Technology (Analog Technology, Digital Technology); Application (Industrial Application, Consumer Electronics Application, Automotive Application, Aerospace & Defense Application, IT & Telecom Application, Other Applications)

Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Key Insights:

• Market Growth: Understand the significant growth trajectory of the Lasers Component segment, which is expected to reach US$1.9 Billion by 2030 with a CAGR of a 18.6%. The Modulators Component segment is also set to grow at 14.0% CAGR over the analysis period.
• Regional Analysis: Gain insights into the U.S. market, estimated at $394.4 Million in 2024, and China, forecasted to grow at an impressive 15.7% CAGR to reach $584.4 Million by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Why You Should Buy This Report:

• Detailed Market Analysis: Access a thorough analysis of the Global Next Generation Integrated Circuits Market, covering all major geographic regions and market segments.
• Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
• Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Next Generation Integrated Circuits Market.
• Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

• How is the Global Next Generation Integrated Circuits Market expected to evolve by 2030?
• What are the main drivers and restraints affecting the market?
• Which market segments will grow the most over the forecast period?
• How will market shares for different regions and segments change by 2030?
• Who are the leading players in the market, and what are their prospects?

Report Features:

• Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
• In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
• Company Profiles: Coverage of players such as AMD (Advanced Micro Devices, Inc.), Analog Devices, Inc., ASML Holding N.V., Broadcom Inc., Intel Corporation and more.
• Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Some of the 48 companies featured in this Next Generation Integrated Circuits market report include:

• AMD (Advanced Micro Devices, Inc.)
• Analog Devices, Inc.
• ASML Holding N.V.
• Broadcom Inc.
• Intel Corporation
• Marvell Technology, Inc.
• MediaTek Inc.
• Micron Technology, Inc.
• NXP Semiconductors N.V.
• NVIDIA Corporation
• On Semiconductor Corporation (onsemi)
• Qualcomm Incorporated
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• STMicroelectronics N.V.
• Taiwan Semiconductor Manufacturing Company Ltd. (TSMC)
• Texas Instruments Incorporated
• Tower Semiconductor Ltd.
• Xilinx, Inc. (now part of AMD)
• Innoscience (Suzhou) Technology Holding Co., Ltd.
• Rapidus Corporation

This edition integrates the latest global trade and economic shifts as of June 2025 into comprehensive market analysis. Key updates include:

• Tariff and Trade Impact: Insights into global tariff negotiations across 180+ countries, with analysis of supply chain turbulence, sourcing disruptions, and geographic realignment. Special focus on 2025 as a pivotal year for trade tensions, including updated perspectives on the Trump-era tariffs.
• Adjusted Forecasts and Analytics: Revised global and regional market forecasts through 2030, incorporating tariff effects, economic uncertainty, and structural changes in globalization. Includes segmentation by product, technology, type, material, distribution channel, application, and end-use, with historical analysis since 2015.
• Strategic Market Dynamics: Evaluation of revised market prospects, regional outlooks, and key economic indicators such as population and urbanization trends.
• Innovation & Technology Trends: Latest developments in product and process innovation, emerging technologies, and key industry drivers shaping the competitive landscape.
• Competitive Intelligence: Updated global market share estimates for 2025, competitive positioning of major players (Strong/Active/Niche/Trivial), and refined focus on leading global brands and core players.
• Expert Insight & Commentary: Strategic analysis from economists, trade experts, and domain specialists to contextualize market shifts and identify emerging opportunities.
• Complimentary Update: Buyers receive a free July 2025 update with finalized tariff impacts, new trade agreement effects, revised projections, and expanded country-level coverage.