The global market for Semiconductor and Circuit Manufacturing was valued at US$60.8 Billion in 2024 and is projected to reach US$66.9 Billion by 2030, growing at a CAGR of 1.6% from 2024 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions. The report includes the most recent global tariff developments and how they impact the Semiconductor and Circuit Manufacturing market.
Beyond lithography, innovations such as gate-all-around (GAA) FETs, nanosheet transistors, and chiplet-based system-on-package (SoP) designs are redefining semiconductor architectures. These advancements allow for improved performance-per-watt, signal integrity, and interconnect density. Simultaneously, 2.5D and 3D integration techniques-like through-silicon via (TSV) stacking and interposer-based assembly-are enabling multi-die systems that combine logic, memory, and analog circuits into compact, high-bandwidth configurations. Such approaches are essential for meeting the data-intensive demands of AI, edge computing, and next-gen communications, necessitating major upgrades in fabrication facilities, materials engineering, and metrology systems.
Simultaneously, integrated device manufacturers (IDMs) and fabless firms are entering strategic partnerships with foundries to secure wafer capacity, diversify supplier bases, and implement supply assurance contracts. Vertical integration is on the rise, with tech giants like Apple, Tesla, and Amazon designing custom chips in-house and outsourcing manufacturing under long-term agreements. Additionally, equipment makers and EDA tool providers are collaborating with foundries to enable faster process node migration, defect reduction, and predictive yield modeling. The result is a more regionally distributed, technologically robust, and vertically integrated semiconductor value chain.
On the automation front, smart manufacturing powered by AI, digital twins, and predictive analytics is becoming standard across leading fabs. Advanced process control (APC), fault detection and classification (FDC), and equipment health monitoring systems are optimizing tool uptime, process uniformity, and yield rates. Collaborative robots (cobots), automated material handling systems (AMHS), and fab-wide Manufacturing Execution Systems (MES) are orchestrating wafer flows with minimal human intervention. These technologies not only boost productivity and cost-efficiency but also enhance cleanroom compliance and operational flexibility in high-mix, low-volume fabrication environments.
Wafer starts are increasing not only in cutting-edge nodes but also in mature nodes such as 28nm, 45nm, and 90nm, which are critical for analog, power management, and embedded control applications. Equipment suppliers for deposition, etching, ion implantation, metrology, and inspection are scaling operations to meet this capacity surge, supported by long-term order backlogs. Talent development, foundry diversification, and localized material sourcing are also receiving policy and corporate focus, ensuring supply chain redundancy.
With rising chip content in nearly every electronic system and sustained capital outlay from governments and private enterprises, semiconductor and circuit manufacturing is entering a golden decade of strategic growth, technological reinvention, and infrastructure proliferation on a truly global scale.
Global Semiconductor And Circuit Manufacturing Market - Key Trends & Drivers Summarized
How Are Next-Generation Architectures and Lithography Techniques Reshaping Chip Manufacturing?
Semiconductor and circuit manufacturing is entering a transformative era marked by shrinking transistor geometries, heterogeneous integration, and advanced packaging innovations. With the migration toward sub-5nm and even 3nm nodes, foundries are investing heavily in extreme ultraviolet (EUV) lithography to maintain Moore’s Law scaling. EUV enables finer patterning precision, essential for accommodating the increasing density of logic gates in modern microprocessors, GPUs, and AI accelerators. Leading-edge fabs operated by TSMC, Samsung, and Intel are deploying EUV in both front-end and back-end of line processes, significantly enhancing throughput, fidelity, and energy efficiency of chips.Beyond lithography, innovations such as gate-all-around (GAA) FETs, nanosheet transistors, and chiplet-based system-on-package (SoP) designs are redefining semiconductor architectures. These advancements allow for improved performance-per-watt, signal integrity, and interconnect density. Simultaneously, 2.5D and 3D integration techniques-like through-silicon via (TSV) stacking and interposer-based assembly-are enabling multi-die systems that combine logic, memory, and analog circuits into compact, high-bandwidth configurations. Such approaches are essential for meeting the data-intensive demands of AI, edge computing, and next-gen communications, necessitating major upgrades in fabrication facilities, materials engineering, and metrology systems.
Why Are Governments and OEMs Prioritizing Localization and Supply Chain Resilience?
Geopolitical tensions, pandemic-induced disruptions, and unprecedented demand surges have exposed vulnerabilities in the global semiconductor supply chain, prompting a paradigm shift toward regional self-sufficiency and supply chain resilience. Nations such as the U.S., EU, India, South Korea, and Japan have launched multi-billion-dollar incentive programs, including the CHIPS Act (U.S.), European Chips Act, and Make in India electronics initiatives, to localize semiconductor manufacturing and reduce reliance on foreign fabs. These programs offer subsidies, tax breaks, and infrastructure support to attract foundries, material suppliers, and equipment vendors.Simultaneously, integrated device manufacturers (IDMs) and fabless firms are entering strategic partnerships with foundries to secure wafer capacity, diversify supplier bases, and implement supply assurance contracts. Vertical integration is on the rise, with tech giants like Apple, Tesla, and Amazon designing custom chips in-house and outsourcing manufacturing under long-term agreements. Additionally, equipment makers and EDA tool providers are collaborating with foundries to enable faster process node migration, defect reduction, and predictive yield modeling. The result is a more regionally distributed, technologically robust, and vertically integrated semiconductor value chain.
What Role Are Emerging Materials and Automation Playing in Manufacturing Efficiency?
The drive toward advanced node manufacturing and complex chip architectures is intensifying the focus on materials innovation. High-mobility channel materials such as germanium, indium gallium arsenide (InGaAs), and transition metal dichalcogenides (TMDs) are being explored to replace or augment traditional silicon in high-speed and low-leakage transistors. Simultaneously, low-k and ultra-low-k dielectric materials, advanced photoresists, and cobalt or ruthenium-based interconnects are being adopted to improve signal transmission and reduce parasitic capacitance in dense layouts.On the automation front, smart manufacturing powered by AI, digital twins, and predictive analytics is becoming standard across leading fabs. Advanced process control (APC), fault detection and classification (FDC), and equipment health monitoring systems are optimizing tool uptime, process uniformity, and yield rates. Collaborative robots (cobots), automated material handling systems (AMHS), and fab-wide Manufacturing Execution Systems (MES) are orchestrating wafer flows with minimal human intervention. These technologies not only boost productivity and cost-efficiency but also enhance cleanroom compliance and operational flexibility in high-mix, low-volume fabrication environments.
What Is Fueling the Global Expansion of Semiconductor Manufacturing Infrastructure?
The growth in the semiconductor and circuit manufacturing market is driven by several factors, including exploding demand for chips across AI, 5G, IoT, automotive, and data center verticals; rising strategic importance of semiconductor autonomy; and rapid advancements in process technology. The digital transformation of global economies has turned semiconductors into the foundational layer of everything from cloud computing and quantum systems to smart cities and autonomous mobility. As a result, both public and private sectors are channeling record investments into wafer fabs, R&D centers, and packaging facilities to meet long-term demand.Wafer starts are increasing not only in cutting-edge nodes but also in mature nodes such as 28nm, 45nm, and 90nm, which are critical for analog, power management, and embedded control applications. Equipment suppliers for deposition, etching, ion implantation, metrology, and inspection are scaling operations to meet this capacity surge, supported by long-term order backlogs. Talent development, foundry diversification, and localized material sourcing are also receiving policy and corporate focus, ensuring supply chain redundancy.
With rising chip content in nearly every electronic system and sustained capital outlay from governments and private enterprises, semiconductor and circuit manufacturing is entering a golden decade of strategic growth, technological reinvention, and infrastructure proliferation on a truly global scale.
Scope of the Report
The report analyzes the Semiconductor and Circuit Manufacturing market, presented in terms of market value (USD). The analysis covers the key segments and geographic regions outlined below:- Segments: Type (Semiconductors, Circuit Boards); Application (Consumer Electronics Application, Automotive Application).
- Geographic Regions/Countries: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.
Key Insights:
- Market Growth: Understand the significant growth trajectory of the Semiconductors segment, which is expected to reach US$41.3 Billion by 2030 with a CAGR of a 1.2%. The Circuit Boards segment is also set to grow at 2.3% CAGR over the analysis period.
- Regional Analysis: Gain insights into the U.S. market, valued at $16.6 Billion in 2024, and China, forecasted to grow at an impressive 3.0% CAGR to reach $12.2 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.
Why You Should Buy This Report:
- Detailed Market Analysis: Access a thorough analysis of the Global Semiconductor and Circuit Manufacturing Market, covering all major geographic regions and market segments.
- Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
- Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global Semiconductor and Circuit Manufacturing Market.
- Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.
Key Questions Answered:
- How is the Global Semiconductor and Circuit Manufacturing Market expected to evolve by 2030?
- What are the main drivers and restraints affecting the market?
- Which market segments will grow the most over the forecast period?
- How will market shares for different regions and segments change by 2030?
- Who are the leading players in the market, and what are their prospects?
Report Features:
- Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2024 to 2030.
- In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
- Company Profiles: Coverage of players such as Advanced Micro Devices (AMD), Analog Devices, Broadcom Inc., GlobalFoundries, Infineon Technologies and more.
- Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.
Some of the 42 companies featured in this Semiconductor and Circuit Manufacturing market report include:
- Advanced Micro Devices (AMD)
- Analog Devices
- Broadcom Inc.
- GlobalFoundries
- Infineon Technologies
- Intel Corporation
- Marvell Technology
- MediaTek Inc.
- Microchip Technology Inc.
- Micron Technology
- Nvidia Corporation
- NXP Semiconductors
- ON Semiconductor (onsemi)
- Renesas Electronics
- Rohm Semiconductor
- Samsung Electronics
- SK hynix
- STMicroelectronics
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Texas Instruments
This edition integrates the latest global trade and economic shifts into comprehensive market analysis. Key updates include:
- Tariff and Trade Impact: Insights into global tariff negotiations across 180+ countries, with analysis of supply chain turbulence, sourcing disruptions, and geographic realignment. Special focus on 2025 as a pivotal year for trade tensions, including updated perspectives on the Trump-era tariffs.
- Adjusted Forecasts and Analytics: Revised global and regional market forecasts through 2030, incorporating tariff effects, economic uncertainty, and structural changes in globalization. Includes historical analysis from 2015 to 2023.
- Strategic Market Dynamics: Evaluation of revised market prospects, regional outlooks, and key economic indicators such as population and urbanization trends.
- Innovation & Technology Trends: Latest developments in product and process innovation, emerging technologies, and key industry drivers shaping the competitive landscape.
- Competitive Intelligence: Updated global market share estimates for 2025 (E), competitive positioning of major players (Strong/Active/Niche/Trivial), and refined focus on leading global brands and core players.
- Expert Insight & Commentary: Strategic analysis from economists, trade experts, and domain specialists to contextualize market shifts and identify emerging opportunities.
Table of Contents
I. METHODOLOGYII. EXECUTIVE SUMMARY2. FOCUS ON SELECT PLAYERSIII. MARKET ANALYSISSOUTH KOREAREST OF ASIA-PACIFICARGENTINABRAZILMEXICOREST OF LATIN AMERICAIRANISRAELSAUDI ARABIAUNITED ARAB EMIRATESREST OF MIDDLE EASTIV. COMPETITION
1. MARKET OVERVIEW
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
UNITED STATES
CANADA
JAPAN
CHINA
EUROPE
FRANCE
GERMANY
ITALY
UNITED KINGDOM
SPAIN
RUSSIA
REST OF EUROPE
ASIA-PACIFIC
AUSTRALIA
INDIA
LATIN AMERICA
MIDDLE EAST
AFRICA
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Advanced Micro Devices (AMD)
- Analog Devices
- Broadcom Inc.
- GlobalFoundries
- Infineon Technologies
- Intel Corporation
- Marvell Technology
- MediaTek Inc.
- Microchip Technology Inc.
- Micron Technology
- Nvidia Corporation
- NXP Semiconductors
- ON Semiconductor (onsemi)
- Renesas Electronics
- Rohm Semiconductor
- Samsung Electronics
- SK hynix
- STMicroelectronics
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Texas Instruments
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 273 |
| Published | July 2025 |
| Forecast Period | 2024 - 2030 |
| Estimated Market Value ( USD | $ 60.8 Billion |
| Forecasted Market Value ( USD | $ 66.9 Billion |
| Compound Annual Growth Rate | 1.6% |
| Regions Covered | Global |
