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5G PCB Market Size, Share and Growth Analysis Report - Forecast Trends and Outlook (2025-2034)

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    Report

  • 155 Pages
  • June 2025
  • Region: Global
  • Expert Market Research
  • ID: 6111561
The 5G PCB market size reached around USD 23.34 Billion in 2024. The market is projected to grow at a CAGR of 14.70% between 2025 and 2034 to reach nearly USD 91.99 Billion by 2034.

Global 5G PCB Market Growth

As of 2020, there are approximately 26.66 billion active Internet of Things (IoT) devices worldwide. Statistics indicate that at least 127 new IoT devices are being connected to the internet every second. Moreover, experts anticipate that by 2025, the number of IoT devices connected to the web will exceed 75 billion. The increasing demand for IoT devices significantly contributes to the 5G PCB market value. IoT devices, which encompass smart home technologies, wearables, and industrial sensors, depend on 5G networks for optimal performance, particularly due to the substantial data they generate. This rising demand for connectivity necessitates the development of advanced 5G PCBs capable of managing higher frequencies and ensuring seamless communication across an extensive network of IoT devices. Therefore, the expansion of IoT is directly driving the need for 5G-enabled PCBs to support these technological advancements.

As per the 5G PCB market analysis, the advancement of 5G infrastructure is crucial to the growing demand for 5G printed circuit boards (PCBs). As telecom companies and government agencies invest in the development and improvement of 5G networks, there is an increasing need for advanced printed circuit boards that can support high-speed data transmission and handle higher frequencies. These PCBs are vital for the efficient functioning of 5G base stations, antennas, routers, and other network equipment. The global rollout of 5G technology greatly fuels the demand for specialised, high-performance PCBs.

Key Trends and Developments

The 5G PCB market growth can be attributed to the development of 5G infrastructure, growing demand for high-speed connectivity, and the expansion of IOT devices.

October 2024

Siemens Digital Industries Software and CELUS, an innovator in AI-driven electronic design automation solutions declared their partnership, aimed at revolutionising the PCB design environment for small and medium-sized businesses as well as engineers.

October 2024

VVDN, India based electronics manufacturing services provider decided to invest USD 100-200 million to manufacture various products including PCB, displays, camera lens, and connector to become self-sufficient and reduce its dependence on China.

July 2024

The Finance Minister of India proposed a 5% rise in customs duties on PCBAs to increase the costs for network rollouts. As a result, the total costs related to network deployment has rose by 4-5%.

Development of 5G Infrastructure

With significant investments from telecom operators and governments in the establishment of 5G infrastructure, there is a rising demand for printed circuit boards (PCBs) that can support sophisticated network equipment and devices, thereby propelling 5G PCB market expansion.

Growing Demand for High-Speed Connectivity

The increasing need for faster internet speeds and seamless communication drives the adoption of 5G technology, leading to a greater demand for advanced printed circuit boards (PCBs) that support the infrastructure required for 5G networks.

Expansion of IoT Devices

The rapid growth of Internet of Things (IoT) devices, which rely on 5G for quick and efficient communication, is boosting growth of the 5G PCB market, thereby facilitating the development and deployment of interconnected smart devices worldwide.

Growth in the Automotive Sector

The shift in the automotive sector towards autonomous vehicles and advanced driver assistance systems (ADAS), which require high-speed communication, increases the need for 5G PCBs to ensure reliable, high-performance connectivity in modern vehicles.

Rising Adoption of Smart Cities

The development of smart cities, which depend on 5G for real-time data processing and communication is driving the demand for 5G PCBs that offer effective, scalable, and secure solutions for urban infrastructure.

Global 5G PCB Market Trends

A major trend contributing to market expansion is the increasing demand for high-speed, low-latency connectivity, particularly in sectors like telecommunications, the Internet of Things (IoT), and automotive. As 5G networks evolve, the need for advanced PCBs capable of handling higher frequencies and enabling faster data transmission becomes more essential. Furthermore, innovations in PCB materials, such as the use of high-frequency laminates and integrated technologies, are leading to more efficient and compact designs. Additionally, the growing number of IoT devices and government investments in 5G infrastructure are driving growth of the market.

Global 5G PCB Industry Segmentation

The report titled “Global 5G PCB Market Report and Forecast 2025-2034” offers a detailed analysis of the market based on the following segments:

Breakup by PCB Type

  • Single-sided
  • Double-sided
  • Multi-layered
  • High-Density Interconnect (HDI)
  • Others

Breakup by Substrate

  • Rigid
  • Flexible
  • Rigid-Flexible

Breakup by Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa

Global 5G PCB Market Share

Based on the region, the market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East and Africa. Regions like Asia Pacific and Latin America are projected to grow at a CAGR of 16.5% and 15.9% during the forecast period of 2025-2034.The growing demand for 5G PCBs in these regions is driven by the rapid expansion of 5G infrastructure and the rising adoption of advanced telecommunications technologies.

Leading Companies in the Global 5G PCB Market

Market players are focusing on the adoption of technological advancements to gain a competitive edge in the market and to improve the 5G PCB market outlook.

Panasonic Holdings Corp.

Headquartered in Osaka, Japan, Panasonic Holdings Corp. was founded in 1918. The company is a global leader in electronics, offering products and solutions across a wide range of sectors, including automotive, home appliances, and industrial technology.

Tripod Technology Corporation

Founded in 1996 and based in Taoyuan, Taiwan, Tripod Technology Corporation specialises in high-performance printed circuit boards (PCBs). The company provides innovative solutions to various sectors, including telecommunications, automotive, and consumer electronics.

Xinfeng Huihe Circuits Co., Ltd.

Established in 1992 and headquartered in Shenzhen, China, Xinfeng Huihe Circuits Co., Ltd. is a leading manufacturer of printed circuit boards. As per 5G PCB market analysis, the company offers solutions for consumer electronics, telecommunications, and industrial applications.

Chin Poon Industrial Co., Ltd.

Founded in 1979 and headquartered in Taoyuan, Taiwan, Chin Poon Industrial Co., Ltd. is a prominent PCB manufacturer. The company provides high-quality printed circuit boards for various sectors, including telecommunications, automotive, and consumer electronics, globally.

Other major players included in the 5G PCB market report are Shennan Circuits Co., Ltd., WUS Printed Circuit Co., Ltd., Zhen Ding Technology Holding Limited, Hannstar Board Co., Ltd., Kinsus Interconnect Technology Corp., and Compeq Manufacturing Co. Ltd., among others.

Table of Contents

1 Executive Summary
1.1 Market Size 2024-2025
1.2 Market Growth 2025(F)-2034(F)
1.3 Key Demand Drivers
1.4 Key Players and Competitive Structure
1.5 Industry Best Practices
1.6 Recent Trends and Developments
1.7 Industry Outlook
2 Market Overview and Stakeholder Insights
2.1 Market Trends
2.2 Key Verticals
2.3 Key Regions
2.4 Supplier Power
2.5 Buyer Power
2.6 Key Market Opportunities and Risks
2.7 Key Initiatives by Stakeholders
3 Economic Summary
3.1 GDP Outlook
3.2 GDP Per Capita Growth
3.3 Inflation Trends
3.4 Democracy Index
3.5 Gross Public Debt Ratios
3.6 Balance of Payment (BoP) Position
3.7 Population Outlook
3.8 Urbanisation Trends
4 Country Risk Profiles
4.1 Country Risk
4.2 Business Climate
5 Global 5G PCB Market Analysis
5.1 Key Industry Highlights
5.2 Global 5G PCB Historical Market (2018-2024)
5.3 Global 5G PCB Market Forecast (2025-2034)
5.4 Global 5G PCB Market by PCB Type
5.4.1 Single-sided
5.4.1.1 Historical Trend (2018-2024)
5.4.1.2 Forecast Trend (2025-2034)
5.4.2 Double-sided
5.4.2.1 Historical Trend (2018-2024)
5.4.2.2 Forecast Trend (2025-2034)
5.4.3 Multi-layered
5.4.3.1 Historical Trend (2018-2024)
5.4.3.2 Forecast Trend (2025-2034)
5.4.4 High-Density Interconnect (HDI)
5.4.4.1 Historical Trend (2018-2024)
5.4.4.2 Forecast Trend (2025-2034)
5.4.5 Others
5.5 Global 5G PCB Market by Substrate
5.5.1 Rigid
5.5.1.1 Historical Trend (2018-2024)
5.5.1.2 Forecast Trend (2025-2034)
5.5.2 Flexible
5.5.2.1 Historical Trend (2018-2024)
5.5.2.2 Forecast Trend (2025-2034)
5.5.3 Rigid-Flexible
5.5.3.1 Historical Trend (2018-2024)
5.5.3.2 Forecast Trend (2025-2034)
5.6 Global 5G PCB Market by Region
5.6.1 North America
5.6.1.1 Historical Trend (2018-2024)
5.6.1.2 Forecast Trend (2025-2034)
5.6.2 Europe
5.6.2.1 Historical Trend (2018-2024)
5.6.2.2 Forecast Trend (2025-2034)
5.6.3 Asia Pacific
5.6.3.1 Historical Trend (2018-2024)
5.6.3.2 Forecast Trend (2025-2034)
5.6.4 Latin America
5.6.4.1 Historical Trend (2018-2024)
5.6.4.2 Forecast Trend (2025-2034)
5.6.5 Middle East and Africa
5.6.5.1 Historical Trend (2018-2024)
5.6.5.2 Forecast Trend (2025-2034)
6 North America 5G PCB Market Analysis
6.1 United States of America
6.1.1 Historical Trend (2018-2024)
6.1.2 Forecast Trend (2025-2034)
6.2 Canada
6.2.1 Historical Trend (2018-2024)
6.2.2 Forecast Trend (2025-2034)
7 Europe 5G PCB Market Analysis
7.1 United Kingdom
7.1.1 Historical Trend (2018-2024)
7.1.2 Forecast Trend (2025-2034)
7.2 Germany
7.2.1 Historical Trend (2018-2024)
7.2.2 Forecast Trend (2025-2034)
7.3 France
7.3.1 Historical Trend (2018-2024)
7.3.2 Forecast Trend (2025-2034)
7.4 Italy
7.4.1 Historical Trend (2018-2024)
7.4.2 Forecast Trend (2025-2034)
7.5 Others
8 Asia Pacific 5G PCB Market Analysis
8.1 China
8.1.1 Historical Trend (2018-2024)
8.1.2 Forecast Trend (2025-2034)
8.2 Japan
8.2.1 Historical Trend (2018-2024)
8.2.2 Forecast Trend (2025-2034)
8.3 India
8.3.1 Historical Trend (2018-2024)
8.3.2 Forecast Trend (2025-2034)
8.4 ASEAN
8.4.1 Historical Trend (2018-2024)
8.4.2 Forecast Trend (2025-2034)
8.5 Australia
8.5.1 Historical Trend (2018-2024)
8.5.2 Forecast Trend (2025-2034)
8.6 Others
9 Latin America 5G PCB Market Analysis
9.1 Brazil
9.1.1 Historical Trend (2018-2024)
9.1.2 Forecast Trend (2025-2034)
9.2 Argentina
9.2.1 Historical Trend (2018-2024)
9.2.2 Forecast Trend (2025-2034)
9.3 Mexico
9.3.1 Historical Trend (2018-2024)
9.3.2 Forecast Trend (2025-2034)
9.4 Others
10 Middle East and Africa 5G PCB Market Analysis
10.1 Saudi Arabia
10.1.1 Historical Trend (2018-2024)
10.1.2 Forecast Trend (2025-2034)
10.2 United Arab Emirates
10.2.1 Historical Trend (2018-2024)
10.2.2 Forecast Trend (2025-2034)
10.3 Nigeria
10.3.1 Historical Trend (2018-2024)
10.3.2 Forecast Trend (2025-2034)
10.4 South Africa
10.4.1 Historical Trend (2018-2024)
10.4.2 Forecast Trend (2025-2034)
10.5 Others
11 Market Dynamics
11.1 SWOT Analysis
11.1.1 Strengths
11.1.2 Weaknesses
11.1.3 Opportunities
11.1.4 Threats
11.2 Porter’s Five Forces Analysis
11.2.1 Supplier’s Power
11.2.2 Buyer’s Power
11.2.3 Threat of New Entrants
11.2.4 Degree of Rivalry
11.2.5 Threat of Substitutes
11.3 Key Indicators of Demand
11.4 Key Indicators of Price
12 Competitive Landscape
12.1 Supplier Selection
12.2 Key Global Players
12.3 Key Regional Players
12.4 Key Player Strategies
12.5 Company Profiles
12.5.1 Panasonic Holdings Corp.
12.5.1.1 Company Overview
12.5.1.2 Product Portfolio
12.5.1.3 Demographic Reach and Achievements
12.5.1.4 Certifications
12.5.2 Tripod Technology Corporation
12.5.2.1 Company Overview
12.5.2.2 Product Portfolio
12.5.2.3 Demographic Reach and Achievements
12.5.2.4 Certifications
12.5.3 Xinfeng Huihe Circuits Co., Ltd.
12.5.3.1 Company Overview
12.5.3.2 Product Portfolio
12.5.3.3 Demographic Reach and Achievements
12.5.3.4 Certifications
12.5.4 Chin Poon Industrial Co., Ltd.
12.5.4.1 Company Overview
12.5.4.2 Product Portfolio
12.5.4.3 Demographic Reach and Achievements
12.5.4.4 Certifications
12.5.5 Shennan Circuits Co., Ltd.
12.5.5.1 Company Overview
12.5.5.2 Product Portfolio
12.5.5.3 Demographic Reach and Achievements
12.5.5.4 Certifications
12.5.6 WUS Printed Circuit Co., Ltd.
12.5.6.1 Company Overview
12.5.6.2 Product Portfolio
12.5.6.3 Demographic Reach and Achievements
12.5.6.4 Certifications
12.5.7 Zhen Ding Technology Holding Limited
12.5.7.1 Company Overview
12.5.7.2 Product Portfolio
12.5.7.3 Demographic Reach and Achievements
12.5.7.4 Certifications
12.5.8 Hannstar Board Co., Ltd.
12.5.8.1 Company Overview
12.5.8.2 Product Portfolio
12.5.8.3 Demographic Reach and Achievements
12.5.8.4 Certifications
12.5.9 Kinsus Interconnect Technology Corp.
12.5.9.1 Company Overview
12.5.9.2 Product Portfolio
12.5.9.3 Demographic Reach and Achievements
12.5.9.4 Certifications
12.5.10 Compeq Manufacturing Co. Ltd.
12.5.10.1 Company Overview
12.5.10.2 Product Portfolio
12.5.10.3 Demographic Reach and Achievements
12.5.10.4 Certifications
12.5.11 Others

Companies Mentioned

  • Panasonic Holdings Corp.
  • Tripod Technology Corporation
  • Xinfeng Huihe Circuits Co., Ltd.
  • Chin Poon Industrial Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Hannstar Board Co., Ltd.
  • Kinsus Interconnect Technology Corp.
  • Compeq Manufacturing Co. Ltd.