High-Strength Epoxy Adhesives Market Report 2026

The high-strength epoxy adhesives market size has grown strongly in recent years. It will grow from $2.93 billion in 2025 to $3.11 billion in 2026 at a compound annual growth rate (CAGR) of 6.4%. The growth in the historic period can be attributed to aerospace structural bonding needs, industrial epoxy resin adoption, construction material bonding, marine repair applications, electronics protection demand.

The high-strength epoxy adhesives market size is expected to see strong growth in the next few years. It will grow to $3.97 billion in 2030 at a compound annual growth rate (CAGR) of 6.3%. The growth in the forecast period can be attributed to renewable energy infrastructure growth, electric vehicle assembly demand, advanced electronics manufacturing, lightweight composite usage, long life adhesive demand. Major trends in the forecast period include increasing use in structural bonding applications, rising demand from aerospace and defense, growth in wind energy installations, expansion in electronics encapsulation, focus on high temperature resistant adhesives.

The growing demand for consumer goods and electronics is expected to drive the expansion of the high-strength epoxy adhesives market in the future. This surge in demand is driven by rapid technological advancements and rising disposable incomes, which fuel consumer enthusiasm for the latest gadgets and lifestyle products. High-strength epoxy adhesives offer excellent mechanical strength, heat resistance, and chemical resistance, making them ideal for assembling electronic components. For instance, according to Invest India, the National Investment Promotion and Facilitation Agency of India, as of March 2023, India's electronics market was valued at $101 billion, with domestic production accounting for approximately 65%. Therefore, the increasing demand for consumer goods and electronics is a major driver of growth for the high-strength epoxy adhesives market.

Leading companies in the high-strength epoxy adhesives market are focusing on the development of innovative products, such as fast-curing adhesive formulations, to enhance production efficiency, reduce assembly time, and improve bonding performance. Fast-curing adhesive formulations involve advanced chemical compositions that enable rapid bonding, reducing curing time while maintaining high strength and durability. For example, in February 2025, Panacol, a Germany-based industrial adhesives manufacturer, introduced Structalit 5859, a one-component epoxy adhesive designed for magnet bonding in electric motor assemblies. This adhesive cures at temperatures as low as 100°C, reducing the curing time to just five minutes at 150°C. It offers extended open time, remaining processable at room temperature for up to seven days. Structalit 5859 features a high glass transition temperature (Tg) of 143°C and maintains a tensile shear strength of 17 MPa on steel, even at elevated temperatures of 150°C. Its high impact strength and flexibility also accommodate materials with varying thermal expansion coefficients.

In September 2024, IPS Adhesives (IPSA), a US-based adhesives company, acquired acrylate and methyl methacrylate (MMA) adhesive technology from L&L Products for an undisclosed amount. This acquisition enables IPSA to enhance its MMA-based product portfolio, facilitating innovative solutions for lightweight bonding and the bonding of dissimilar materials across industries such as transportation, construction, automotive, and marine. L&L Products is a US-based company specializing in high-strength structural adhesives, including acrylic-based systems.

Major companies operating in the high-strength epoxy adhesives market are 3M Company, Henkel AG & Co. KGaA, Illinois Tool Works Inc., Sika AG, Huntsman Corporation, H.B. Fuller Company, Ashland Global Holdings Inc., ThreeBond Holdings Co., Ltd., DELO Industrial Adhesives GmbH & Co. KGaA, Shanghai Kangda New Materials Co., Ltd., Panacol-Elosol GmbH, Adhesives Technology Corporation, Permabond LLC, Weicon GmbH & Co. KG, Master Bond Inc., ResinLab Inc., Bondline Electronic Adhesives Inc., Dow Inc., LORD Corporation, ITW Performance Polymers LLC, Bostik SA.

North America was the largest region in the high-strength epoxy adhesives market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the high-strength epoxy adhesives market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the high-strength epoxy adhesives market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The high-strength epoxy adhesives market consists of sales of structural adhesives, medical-grade adhesives, electronics adhesives, renewable energy adhesives, and packaging adhesives. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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