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Advanced Packaging Market: Global Opportunity Analysis and Industry Forecast, 2024-2032

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    Report

  • 250 Pages
  • January 2025
  • Region: Global
  • Allied Market Research
  • ID: 6119864
Description Jump to:
The advanced packaging market was valued at $48.5 billion in 2023 and is projected to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.

Advanced packaging refers to a collection of ingenious techniques that mutually connect and protect multiple semiconductor wafers. This is an innovative approach to enhance the potential of semiconductors while reducing costs and power consumption. The commonly used techniques in advanced packaging are 3D-IC, 2.5D, heterogeneous integration, system-in-package, and fan-out wafer-level packaging. This approach finds applications in diverse industries, including automotive, consumer electronics, and Internet of Things-based devices.

Increase in the popularity of miniature devices is a significant driver of the advanced packaging market. In addition, surge in the adoption of portable healthcare equipment & wearables is boosting the demand for advanced packaging solutions and augmenting the market development. Moreover, adoption of high-speed connectivity solutions across residential & commercial settings propels the market growth due to boost in demand for semiconductor packaging solutions that reduce latency and regulate high-frequency signals. To enhance the capabilities of packaging, the collaboration of generative AI and ML is trending in the market. AI is facilitating the automation of layout & floor planning, thereby simplifying chip production and packaging.

However, the usage of ingenious techniques elevates the cost of semiconductor packaging, deterring several small-scale companies from investing. Hence, the high expenses restrain the growth of the advanced packaging market. Furthermore, rise in concerns regarding the environmental impacts associated with advanced packaging solutions hampers the development of the market. On the contrary, innovations in the value chain of advanced packaging are projected to present lucrative opportunities for the market. According to BCG, the current 8% share of advanced packaging approach in the entire semiconductor industry is anticipated to double by 2030, rising to a value of more than $96 billion. This is attributed to the transformation of value chain of packaging solutions in the market.

Segment Review

The advanced packaging market is segmented into type, end user, and region. On the basis of type, the market is divided into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. As per end user, it is classified into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Region wise, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

Key Findings

  • On the basis of type, the flip-chip ball grid array segment dominated the market in 2023.
  • As per end user, the consumer electronics segment acquired a high stake in the market in 2023.
  • Region wise, Asia-Pacific was the highest revenue generator in 2023.

Competition Analysis

The leading players operating in the global advanced packaging market include Amkor Technology Inc., Intel Corporation., Qualcomm Technologies Inc., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, IBM Corporation, microchip technology, Renesas Electronics Corporation, Texas Instruments Inc., and Analog devices. These major players have adopted various key development strategies such as business expansion, new product launches, and partnerships, to strengthen their foothold in the competitive market.

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Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

  • Product Life Cycles
  • Market share analysis of players by products/segments
  • Additional company profiles with specific to client's interest
  • Additional country or region analysis- market size and forecast
  • Key player details (including location, contact details, supplier/vendor network etc. in excel format)
  • Market share analysis of players at global/region/country level
  • SWOT Analysis

Key Market Segments

By Type

  • Flip chip CSP
  • Flip-chip ball grid array
  • Wafer level CSP
  • 2.5D/3D
  • Fan-out WLP
  • Others

By End User

  • Consumer electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace defense
  • Others

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • France
  • Germany
  • Italy
  • Spain
  • UK
  • Rest of Europe
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players

  • Amkor Technology Inc.
  • Intel Corporation.
  • Qualcomm Technologies Inc.
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • IBM Corporation
  • microchip technology
  • Renesas Electronics Corporation
  • Texas Instruments Inc.
  • Analog devices

Table of Contents

CHAPTER 1: INTRODUCTION
1.1. Report Description
1.2. Key Market Segments
1.3. Key Benefits
1.4. Research Methodology
1.4.1. Primary Research
1.4.2. Secondary Research
1.4.3. Analyst Tools and Models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET LANDSCAPE
3.1. Market Definition and Scope
3.2. Key Findings
3.2.1. Top Investment Pockets
3.2.2. Top Winning Strategies
3.3. Porter's Five Forces Analysis
3.3.1. Bargaining Power of Suppliers
3.3.2. Threat of New Entrants
3.3.3. Threat of Substitutes
3.3.4. Competitive Rivalry
3.3.5. Bargaining Power among Buyers
3.4. Market Dynamics
3.4.1. Drivers
3.4.2. Restraints
3.4.3. Opportunities
CHAPTER 4: ADVANCED PACKAGING MARKET, BY TYPE
4.1. Market Overview
4.1.1 Market Size and Forecast, By Type
4.2. Flip Chip CSP
4.2.1. Key Market Trends, Growth Factors and Opportunities
4.2.2. Market Size and Forecast, By Region
4.2.3. Market Share Analysis, By Country
4.3. Flip-chip Ball Grid Array
4.3.1. Key Market Trends, Growth Factors and Opportunities
4.3.2. Market Size and Forecast, By Region
4.3.3. Market Share Analysis, By Country
4.4. Wafer Level CSP
4.4.1. Key Market Trends, Growth Factors and Opportunities
4.4.2. Market Size and Forecast, By Region
4.4.3. Market Share Analysis, By Country
4.5. 2.5D/3D
4.5.1. Key Market Trends, Growth Factors and Opportunities
4.5.2. Market Size and Forecast, By Region
4.5.3. Market Share Analysis, By Country
4.6. Fan-out WLP
4.6.1. Key Market Trends, Growth Factors and Opportunities
4.6.2. Market Size and Forecast, By Region
4.6.3. Market Share Analysis, By Country
4.7. Others
4.7.1. Key Market Trends, Growth Factors and Opportunities
4.7.2. Market Size and Forecast, By Region
4.7.3. Market Share Analysis, By Country
CHAPTER 5: ADVANCED PACKAGING MARKET, BY END USER
5.1. Market Overview
5.1.1 Market Size and Forecast, By End User
5.2. Consumer Electronics
5.2.1. Key Market Trends, Growth Factors and Opportunities
5.2.2. Market Size and Forecast, By Region
5.2.3. Market Share Analysis, By Country
5.3. Automotive
5.3.1. Key Market Trends, Growth Factors and Opportunities
5.3.2. Market Size and Forecast, By Region
5.3.3. Market Share Analysis, By Country
5.4. Industrial
5.4.1. Key Market Trends, Growth Factors and Opportunities
5.4.2. Market Size and Forecast, By Region
5.4.3. Market Share Analysis, By Country
5.5. Healthcare
5.5.1. Key Market Trends, Growth Factors and Opportunities
5.5.2. Market Size and Forecast, By Region
5.5.3. Market Share Analysis, By Country
5.6. Aerospace Defense
5.6.1. Key Market Trends, Growth Factors and Opportunities
5.6.2. Market Size and Forecast, By Region
5.6.3. Market Share Analysis, By Country
5.7. Others
5.7.1. Key Market Trends, Growth Factors and Opportunities
5.7.2. Market Size and Forecast, By Region
5.7.3. Market Share Analysis, By Country
CHAPTER 6: ADVANCED PACKAGING MARKET, BY REGION
6.1. Market Overview
6.1.1 Market Size and Forecast, By Region
6.2. North America
6.2.1. Key Market Trends and Opportunities
6.2.2. Market Size and Forecast, By Type
6.2.3. Market Size and Forecast, By End User
6.2.4. Market Size and Forecast, By Country
6.2.5. U.S. Advanced Packaging Market
6.2.5.1. Market Size and Forecast, By Type
6.2.5.2. Market Size and Forecast, By End User
6.2.6. Canada Advanced Packaging Market
6.2.6.1. Market Size and Forecast, By Type
6.2.6.2. Market Size and Forecast, By End User
6.2.7. Mexico Advanced Packaging Market
6.2.7.1. Market Size and Forecast, By Type
6.2.7.2. Market Size and Forecast, By End User
6.3. Europe
6.3.1. Key Market Trends and Opportunities
6.3.2. Market Size and Forecast, By Type
6.3.3. Market Size and Forecast, By End User
6.3.4. Market Size and Forecast, By Country
6.3.5. France Advanced Packaging Market
6.3.5.1. Market Size and Forecast, By Type
6.3.5.2. Market Size and Forecast, By End User
6.3.6. Germany Advanced Packaging Market
6.3.6.1. Market Size and Forecast, By Type
6.3.6.2. Market Size and Forecast, By End User
6.3.7. Italy Advanced Packaging Market
6.3.7.1. Market Size and Forecast, By Type
6.3.7.2. Market Size and Forecast, By End User
6.3.8. Spain Advanced Packaging Market
6.3.8.1. Market Size and Forecast, By Type
6.3.8.2. Market Size and Forecast, By End User
6.3.9. UK Advanced Packaging Market
6.3.9.1. Market Size and Forecast, By Type
6.3.9.2. Market Size and Forecast, By End User
6.3.10. Rest Of Europe Advanced Packaging Market
6.3.10.1. Market Size and Forecast, By Type
6.3.10.2. Market Size and Forecast, By End User
6.4. Asia-Pacific
6.4.1. Key Market Trends and Opportunities
6.4.2. Market Size and Forecast, By Type
6.4.3. Market Size and Forecast, By End User
6.4.4. Market Size and Forecast, By Country
6.4.5. China Advanced Packaging Market
6.4.5.1. Market Size and Forecast, By Type
6.4.5.2. Market Size and Forecast, By End User
6.4.6. Japan Advanced Packaging Market
6.4.6.1. Market Size and Forecast, By Type
6.4.6.2. Market Size and Forecast, By End User
6.4.7. India Advanced Packaging Market
6.4.7.1. Market Size and Forecast, By Type
6.4.7.2. Market Size and Forecast, By End User
6.4.8. South Korea Advanced Packaging Market
6.4.8.1. Market Size and Forecast, By Type
6.4.8.2. Market Size and Forecast, By End User
6.4.9. Australia Advanced Packaging Market
6.4.9.1. Market Size and Forecast, By Type
6.4.9.2. Market Size and Forecast, By End User
6.4.10. Rest of Asia-Pacific Advanced Packaging Market
6.4.10.1. Market Size and Forecast, By Type
6.4.10.2. Market Size and Forecast, By End User
6.5. LAMEA
6.5.1. Key Market Trends and Opportunities
6.5.2. Market Size and Forecast, By Type
6.5.3. Market Size and Forecast, By End User
6.5.4. Market Size and Forecast, By Country
6.5.5. Latin America Advanced Packaging Market
6.5.5.1. Market Size and Forecast, By Type
6.5.5.2. Market Size and Forecast, By End User
6.5.6. Middle East Advanced Packaging Market
6.5.6.1. Market Size and Forecast, By Type
6.5.6.2. Market Size and Forecast, By End User
6.5.7. Africa Advanced Packaging Market
6.5.7.1. Market Size and Forecast, By Type
6.5.7.2. Market Size and Forecast, By End User
CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top Winning Strategies
7.3. Product Mapping Of Top 10 Player
7.4. Competitive Dashboard
7.5. Competitive Heatmap
7.6. Top Player Positioning, 2023
CHAPTER 8: COMPANY PROFILES
8.1. Amkor Technology Inc.
8.1.1. Company Overview
8.1.2. Key Executives
8.1.3. Company Snapshot
8.1.4. Operating Business Segments
8.1.5. Product Portfolio
8.1.6. Business Performance
8.1.7. Key Strategic Moves and Developments
8.2. Intel Corporation.
8.2.1. Company Overview
8.2.2. Key Executives
8.2.3. Company Snapshot
8.2.4. Operating Business Segments
8.2.5. Product Portfolio
8.2.6. Business Performance
8.2.7. Key Strategic Moves and Developments
8.3. Qualcomm Technologies Inc.
8.3.1. Company Overview
8.3.2. Key Executives
8.3.3. Company Snapshot
8.3.4. Operating Business Segments
8.3.5. Product Portfolio
8.3.6. Business Performance
8.3.7. Key Strategic Moves and Developments
8.4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8.4.1. Company Overview
8.4.2. Key Executives
8.4.3. Company Snapshot
8.4.4. Operating Business Segments
8.4.5. Product Portfolio
8.4.6. Business Performance
8.4.7. Key Strategic Moves and Developments
8.5. IBM Corporation
8.5.1. Company Overview
8.5.2. Key Executives
8.5.3. Company Snapshot
8.5.4. Operating Business Segments
8.5.5. Product Portfolio
8.5.6. Business Performance
8.5.7. Key Strategic Moves and Developments
8.6. Microchip Technology
8.6.1. Company Overview
8.6.2. Key Executives
8.6.3. Company Snapshot
8.6.4. Operating Business Segments
8.6.5. Product Portfolio
8.6.6. Business Performance
8.6.7. Key Strategic Moves and Developments
8.7. Renesas Electronics Corporation
8.7.1. Company Overview
8.7.2. Key Executives
8.7.3. Company Snapshot
8.7.4. Operating Business Segments
8.7.5. Product Portfolio
8.7.6. Business Performance
8.7.7. Key Strategic Moves and Developments
8.8. Texas Instruments Inc.
8.8.1. Company Overview
8.8.2. Key Executives
8.8.3. Company Snapshot
8.8.4. Operating Business Segments
8.8.5. Product Portfolio
8.8.6. Business Performance
8.8.7. Key Strategic Moves and Developments
8.9. Analog Devices
8.9.1. Company Overview
8.9.2. Key Executives
8.9.3. Company Snapshot
8.9.4. Operating Business Segments
8.9.5. Product Portfolio
8.9.6. Business Performance
8.9.7. Key Strategic Moves and Developments
LIST OF TABLES
Table 1. Global Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 2. Advanced Packaging Market for Flip Chip Csp, by Region, 2024 - 2032 ($Billion)
Table 3. Advanced Packaging Market for Flip-Chip Ball Grid Array, by Region, 2024 - 2032 ($Billion)
Table 4. Advanced Packaging Market for Wafer Level Csp, by Region, 2024 - 2032 ($Billion)
Table 5. Advanced Packaging Market for 2.5D/3D, by Region, 2024 - 2032 ($Billion)
Table 6. Advanced Packaging Market for Fan-Out Wlp, by Region, 2024 - 2032 ($Billion)
Table 7. Advanced Packaging Market for Others, by Region, 2024 - 2032 ($Billion)
Table 8. Global Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 9. Advanced Packaging Market for Consumer Electronics, by Region, 2024 - 2032 ($Billion)
Table 10. Advanced Packaging Market for Automotive, by Region, 2024 - 2032 ($Billion)
Table 11. Advanced Packaging Market for Industrial, by Region, 2024 - 2032 ($Billion)
Table 12. Advanced Packaging Market for Healthcare, by Region, 2024 - 2032 ($Billion)
Table 13. Advanced Packaging Market for Aerospace Defense, by Region, 2024 - 2032 ($Billion)
Table 14. Advanced Packaging Market for Others, by Region, 2024 - 2032 ($Billion)
Table 15. Advanced Packaging Market, by Region, 2024 - 2032 ($Billion)
Table 16. North America Advanced Packaging Market, by Country, 2024 - 2032 ($Billion)
Table 17. North America Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 18. North America Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 19. U.S. Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 20. U.S. Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 21. Canada Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 22. Canada Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 23. Mexico Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 24. Mexico Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 25. Europe Advanced Packaging Market, by Country, 2024 - 2032 ($Billion)
Table 26. Europe Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 27. Europe Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 28. France Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 29. France Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 30. Germany Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 31. Germany Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 32. Italy Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 33. Italy Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 34. Spain Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 35. Spain Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 36. UK Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 37. UK Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 38. Rest of Europe Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 39. Rest of Europe Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 40. Asia-Pacific Advanced Packaging Market, by Country, 2024 - 2032 ($Billion)
Table 41. Asia-Pacific Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 42. Asia-Pacific Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 43. China Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 44. China Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 45. Japan Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 46. Japan Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 47. India Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 48. India Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 49. South Korea Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 50. South Korea Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 51. Australia Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 52. Australia Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 53. Rest of Asia-Pacific Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 54. Rest of Asia-Pacific Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 55. LAMEA Advanced Packaging Market, by Country, 2024 - 2032 ($Billion)
Table 56. LAMEA Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 57. LAMEA Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 58. Latin America Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 59. Latin America Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 60. Middle East Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 61. Middle East Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 62. Africa Advanced Packaging Market, by Type, 2024 - 2032 ($Billion)
Table 63. Africa Advanced Packaging Market, by End-user, 2024 - 2032 ($Billion)
Table 64. Amkor Technology Inc.: Key Executives
Table 65. Amkor Technology Inc.: Company Snapshot
Table 66. Amkor Technology Inc.: Operating Segments
Table 67. Amkor Technology Inc.: Product Portfolio
Table 68. Amkor Technology Inc.: Key Strategic Moves and Developments
Table 69. Intel Corporation.: Key Executives
Table 70. Intel Corporation.: Company Snapshot
Table 71. Intel Corporation.: Operating Segments
Table 72. Intel Corporation.: Product Portfolio
Table 73. Intel Corporation.: Key Strategic Moves and Developments
Table 74. Qualcomm Technologies Inc.: Key Executives
Table 75. Qualcomm Technologies Inc.: Company Snapshot
Table 76. Qualcomm Technologies Inc.: Operating Segments
Table 77. Qualcomm Technologies Inc.: Product Portfolio
Table 78. Qualcomm Technologies Inc.: Key Strategic Moves and Developments
Table 79. Taiwan Semiconductor Manufacturing Company Limited: Key Executives
Table 80. Taiwan Semiconductor Manufacturing Company Limited: Company Snapshot
Table 81. Taiwan Semiconductor Manufacturing Company Limited: Operating Segments
Table 82. Taiwan Semiconductor Manufacturing Company Limited: Product Portfolio
Table 83. Taiwan Semiconductor Manufacturing Company Limited: Key Strategic Moves and Developments
Table 84. IBM Corporation: Key Executives
Table 85. IBM Corporation: Company Snapshot
Table 86. IBM Corporation: Operating Segments
Table 87. IBM Corporation: Product Portfolio
Table 88. IBM Corporation: Key Strategic Moves and Developments
Table 89. Microchip Technology: Key Executives
Table 90. Microchip Technology: Company Snapshot
Table 91. Microchip Technology: Operating Segments
Table 92. Microchip Technology: Product Portfolio
Table 93. Microchip Technology: Key Strategic Moves and Developments
Table 94. Renesas Electronics Corporation: Key Executives
Table 95. Renesas Electronics Corporation: Company Snapshot
Table 96. Renesas Electronics Corporation: Operating Segments
Table 97. Renesas Electronics Corporation: Product Portfolio
Table 98. Renesas Electronics Corporation: Key Strategic Moves and Developments
Table 99. Texas Instruments Inc.: Key Executives
Table 100. Texas Instruments Inc.: Company Snapshot
Table 101. Texas Instruments Inc.: Operating Segments
Table 102. Texas Instruments Inc.: Product Portfolio
Table 103. Texas Instruments Inc.: Key Strategic Moves and Developments
Table 104. Analog Devices: Key Executives
Table 105. Analog Devices: Company Snapshot
Table 106. Analog Devices: Operating Segments
Table 107. Analog Devices: Product Portfolio
Table 108. Analog Devices: Key Strategic Moves and Developments
LIST OF FIGURES
Figure 1. Global Advanced Packaging Market, 2024 - 2032
Figure 2. Segmentation of Advanced Packaging Market, 2024 - 2032
Figure 3. Top Investment Pocket in Advanced Packaging Market
Figure 4. Moderate Bargaining Power of Buyers
Figure 5. Moderate Bargaining Power of Suppliers
Figure 6. Moderate Threat of New Entrants
Figure 7. Low Threat of Substitution
Figure 8. High Competitive Rivalry
Figure 9. Opportunities, Restraints and Drivers: Globaladvanced Packaging Market
Figure 10. Global Advanced Packaging Market Segmentation, by Type
Figure 11. Advanced Packaging Market for Flip Chip Csp, by Country, 2024 - 2032 ($Billion)
Figure 12. Advanced Packaging Market for Flip-Chip Ball Grid Array, by Country, 2024 - 2032 ($Billion)
Figure 13. Advanced Packaging Market for Wafer Level Csp, by Country, 2024 - 2032 ($Billion)
Figure 14. Advanced Packaging Market for 2.5D/3D, by Country, 2024 - 2032 ($Billion)
Figure 15. Advanced Packaging Market for Fan-Out Wlp, by Country, 2024 - 2032 ($Billion)
Figure 16. Advanced Packaging Market for Others, by Country, 2024 - 2032 ($Billion)
Figure 17. Global Advanced Packaging Market Segmentation, by End-user
Figure 18. Advanced Packaging Market for Consumer Electronics, by Country, 2024 - 2032 ($Billion)
Figure 19. Advanced Packaging Market for Automotive, by Country, 2024 - 2032 ($Billion)
Figure 20. Advanced Packaging Market for Industrial, by Country, 2024 - 2032 ($Billion)
Figure 21. Advanced Packaging Market for Healthcare, by Country, 2024 - 2032 ($Billion)
Figure 22. Advanced Packaging Market for Aerospace Defense, by Country, 2024 - 2032 ($Billion)
Figure 23. Advanced Packaging Market for Others, by Country, 2024 - 2032 ($Billion)
Figure 24. Top Winning Strategies, by Year, 2022-2024*
Figure 25. Top Winning Strategies, by Development, 2022-2024*
Figure 26. Top Winning Strategies, by Company, 2022-2024*
Figure 27. Product Mapping of Top 10 Players
Figure 28. Competitive Dashboard
Figure 29. Competitive Heatmap: Advanced Packaging Market
Figure 30. Top Player Positioning, 2023
Figure 31. Amkor Technology Inc.: Net Sales, 2022-2024 ($Billion)
Figure 32. Amkor Technology Inc.: Revenue Share, by Segment, 2023 (%)
Figure 33. Amkor Technology Inc.: Revenue Share, by Region, 2024 (%)
Figure 34. Intel Corporation.: Net Sales, 2022-2024 ($Billion)
Figure 35. Intel Corporation.: Revenue Share, by Segment, 2023 (%)
Figure 36. Intel Corporation.: Revenue Share, by Region, 2024 (%)
Figure 37. Qualcomm Technologies Inc.: Net Sales, 2022-2024 ($Billion)
Figure 38. Qualcomm Technologies Inc.: Revenue Share, by Segment, 2023 (%)
Figure 39. Qualcomm Technologies Inc.: Revenue Share, by Region, 2024 (%)
Figure 40. Taiwan Semiconductor Manufacturing Company Limited: Net Sales, 2022-2024 ($Billion)
Figure 41. Taiwan Semiconductor Manufacturing Company Limited: Revenue Share, by Segment, 2023 (%)
Figure 42. Taiwan Semiconductor Manufacturing Company Limited: Revenue Share, by Region, 2024 (%)
Figure 43. IBM Corporation: Net Sales, 2022-2024 ($Billion)
Figure 44. IBM Corporation: Revenue Share, by Segment, 2023 (%)
Figure 45. IBM Corporation: Revenue Share, by Region, 2024 (%)
Figure 46. Microchip Technology: Net Sales, 2022-2024 ($Billion)
Figure 47. Microchip Technology: Revenue Share, by Segment, 2023 (%)
Figure 48. Microchip Technology: Revenue Share, by Region, 2024 (%)
Figure 49. Renesas Electronics Corporation: Net Sales, 2022-2024 ($Billion)
Figure 50. Renesas Electronics Corporation: Revenue Share, by Segment, 2023 (%)
Figure 51. Renesas Electronics Corporation: Revenue Share, by Region, 2024 (%)
Figure 52. Texas Instruments Inc.: Net Sales, 2022-2024 ($Billion)
Figure 53. Texas Instruments Inc.: Revenue Share, by Segment, 2023 (%)
Figure 54. Texas Instruments Inc.: Revenue Share, by Region, 2024 (%)
Figure 55. Analog Devices: Net Sales, 2022-2024 ($Billion)
Figure 56. Analog Devices: Revenue Share, by Segment, 2023 (%)
Figure 57. Analog Devices: Revenue Share, by Region, 2024 (%)

Companies Mentioned

  • Amkor Technology Inc.
  • Intel Corporation.
  • Qualcomm Technologies Inc.
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • IBM Corporation
  • microchip technology
  • Renesas Electronics Corporation
  • Texas Instruments Inc.
  • Analog devices

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

  • Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic news articles and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.

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Table Information

Report AttributeDetails
No. of Pages250
PublishedJanuary 2025
Forecast Period2023 - 2032
Estimated Market Value ( USD ) in 2023 $ 48.5 billion
Forecasted Market Value ( USD ) by 2032 $ 119.4 billion
Compound Annual Growth Rate10.6%
Regions CoveredGlobal
No. of Companies Mentioned9

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