The dual interface central processing unit (CPU) card chips market size is expected to see rapid growth in the next few years. It will grow to $7.95 billion in 2029 at a compound annual growth rate (CAGR) of 10.4%. In the forecast period, growth is expected to be driven by the rising use of biometric authentication in smart cards, increased demand for secure healthcare ID solutions, wider adoption of IoT-enabled payment systems, expanding deployment of digital wallets and tap-to-pay features, and heightened focus on post-quantum cryptography for payment security. Key trends include advancements in biometric-enabled dual interface cards, development of eco-friendly and recyclable smart cards, innovations in multi-application chip technologies, improvements in encryption and data protection, and the creation of thinner, flexible chip card designs.
The increasing demand for secure and contactless payment solutions is anticipated to drive the growth of the dual-interface central processing unit (CPU) card chips market in the coming years. Contactless payment methods enable users to complete transactions by simply tapping a card or device near a reader without physical contact. This demand is rising due to heightened concerns over data security and fraud, with consumers favoring secure contactless options that safeguard their sensitive information during payments. Dual-interface CPU card chips support these payment solutions by allowing smart cards to perform both contact and contactless transactions with enhanced data protection. For example, in September 2023, UK Finance, a UK-based financial services trade association, reported that contactless payments using debit and credit cards reached 17 billion in 2022, up 30% from 13.1 billion transactions in 2021. The average contactless payment value also increased to about $19.1 (£15.10) in 2022 from around $16.0 (£12.66) the previous year. Consequently, the growing demand for secure and contactless payment solutions is fueling the expansion of the dual-interface CPU card chips market.
The increasing prevalence of Internet of Things (IoT) payment devices is expected to significantly boost the growth of the dual-interface central processing unit (CPU) card chips market. IoT payment devices include smart gadgets such as wearables and connected appliances that facilitate secure, contactless financial transactions using wireless technologies such as NFC or Bluetooth. This growth is fueled by consumers’ rising demand for faster, more convenient, and hands-free payment options during everyday activities such as commuting, shopping, and fitness. Dual-interface CPU card chips enable these IoT devices to carry out secure contact and contactless transactions, ensuring quick and seamless payments via technologies such as NFC. For example, in March 2025, Visa Inc., a US-based payment card services company, reported that tap-to-phone technology - which allows smartphones to act as point-of-sale (POS) devices - saw a 200% increase in global adoption throughout 2024. Hence, the growth of IoT payment devices is driving the expansion of the dual-interface CPU card chips market.
Leading companies in the dual-interface CPU card chips market are focusing on introducing next-generation CPU architectures, such as high-performance CPU superchips, to meet the rising need for advanced data processing in artificial intelligence (AI), cloud computing, and edge devices. These high-performance CPU superchips integrate multiple high-speed cores or chip lets into a single package, delivering exceptional computing power, efficiency, and scalability for demanding workloads such as AI, high-performance computing (HPC), and large-scale data processing. For example, in March 2022, NVIDIA Corporation, a US-based technology firm, launched the Grace CPU Superchip, an advanced processor designed to provide unprecedented performance for AI, HPC, and hyperscale data centers. The chip combines two Grace CPUs connected via NVIDIA’s NVLink Chip-2-Chip interconnect, offering up to 144 Arm Neoverse cores and 1 TB/s memory bandwidth. Manufactured using TSMC’s 4nm process, it delivers outstanding energy efficiency and is optimized for tasks such as large-scale simulations, data analytics, and AI model training, representing a significant advancement over traditional CPU architectures.
Major players in the dual interface central processing unit (CPU) card chips market are STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Renesas Electronics Corporation, ON Semiconductor Corporation, Microchip Technology Incorporated, Giesecke+Devrient GmbH, HID Global Corporation, Giantec Semiconductor Corporation, CPI Card Group Inc., Fudan Microelectronics Group Co. Ltd, Goldpac Group Limited, EM Microelectronic Marin SA, Feitian Technologies Co. Ltd., SEALSQ Semiconductors, Watchdata Technologies Pte Ltd, CardLogix Corporation, Ellipse World Inc., IDEX Biometrics ASA, Paragon Group, and SmartTech Production.
North America was the largest region in the dual interface central processing unit (CPU) card chips market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in dual interface central processing unit (CPU) card chips report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The countries covered in the dual interface central processing unit (CPU) card chips market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s recommendations and conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
The rapid rise in U.S. tariffs and the subsequent trade frictions in spring 2025 are having a major impact on the electrical and electronics sector, with semiconductors, display panels, and rare-earth metals (essential for batteries and motors) subject to steep duties. Consumer electronics brands face profit erosion, as competitive markets limit their ability to pass costs to buyers. Industrial electronics manufacturers, meanwhile, grapple with delayed projects due to shortages of tariff-impacted components like printed circuit boards. Companies are responding by relocating assembly to tariff-exempt countries, increasing inventory buffers, and redesigning products to reduce dependency on restricted materials.
Dual interface central processing unit (CPU) card chips are sophisticated smart card components equipped with a built-in microprocessor that securely processes and stores data while supporting both contact and contactless communication methods. This dual functionality enables the chip to connect with readers either through physical contact via metal pads or wirelessly using radio frequency technology, providing greater operational flexibility and convenience for users.
The main categories of dual interface CPU card chips include contact, contactless, and dual interface types. Contact dual-interface CPU card chips are secure microcontrollers embedded in smart cards that support both contact-based and contactless communication with card readers. These chips are utilized in various applications such as banking, government, transportation, healthcare, and more, serving a broad range of end users including financial institutions, government bodies, transportation agencies, healthcare providers, and others.
The dual interface central processing unit (CPU) card chips market research report is one of a series of new reports that provides dual interface central processing unit (CPU) card chips market statistics, including dual interface central processing unit (CPU) card chips industry global market size, regional shares, competitors with a dual interface central processing unit (CPU) card chips market share, detailed dual interface central processing unit (CPU) card chips market segments, market trends and opportunities, and any further data you may need to thrive in the dual interface central processing unit (CPU) card chips industry. This dual interface central processing unit (CPU) card chips market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The dual interface central processing unit (CPU) card chips market consists of sales of products including contactless smart card chips, secure microcontrollers, Europay, Mastercard, And Visa (EMV) payment chips, near field communication-enabled processors, and cryptographic co-processors. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Dual Interface Central Processing Unit (CPU) Card Chips Global Market Report 2025 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on dual interface central processing unit (cpu) card chips market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for dual interface central processing unit (cpu) card chips? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The dual interface central processing unit (cpu) card chips market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include: the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:
1) By Type: Contact; Contactless; Dual Interface2) By Application: Banking; Government; Transportation; Healthcare; Other Applications
3) By End-User: Financial Institutions; Government Agencies; Transportation Authorities; Healthcare Providers; Other End-Users
Subsegments:
1) By Contact: Smart Card Integrated Circuits; Secure Microcontrollers; Memory Chips2) By Contactless: Near Field Communication Chips; Radio-Frequency Identification Chips; Wireless Secure Elements
3) By Dual Interface: Europay, Mastercard, and Visa (EMV) Chips; Banking Smart Cards; Multi-Application Secure Chips
Companies Mentioned: STMicroelectronics N.V.; Infineon Technologies AG; NXP Semiconductors N.V.; Renesas Electronics Corporation; oN Semiconductor Corporation; Microchip Technology Incorporated; Giesecke+Devrient GmbH; HID Global Corporation; Giantec Semiconductor Corporation; CPI Card Group Inc.; Fudan Microelectronics Group Co. Ltd; Goldpac Group Limited; EM Microelectronic‑Marin SA; Feitian Technologies Co. Ltd.; SEALSQ Semiconductors; Watchdata Technologies Pte Ltd; CardLogix Corporation; Ellipse World Inc.; IDEX Biometrics ASA; Paragon Group; SmartTech Production.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned
The companies featured in this Dual Interface Central Processing Unit (CPU) Card Chips market report include:- STMicroelectronics N.V.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Renesas Electronics Corporation
- ON Semiconductor Corporation
- Microchip Technology Incorporated
- Giesecke+Devrient GmbH
- HID Global Corporation
- Giantec Semiconductor Corporation
- CPI Card Group Inc.
- Fudan Microelectronics Group Co. Ltd
- Goldpac Group Limited
- EM Microelectronic‑Marin SA
- Feitian Technologies Co. Ltd.
- SEALSQ Semiconductors
- Watchdata Technologies Pte Ltd
- CardLogix Corporation
- Ellipse World Inc.
- IDEX Biometrics ASA
- Paragon Group
- SmartTech Production.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | September 2025 |
| Forecast Period | 2025 - 2029 |
| Estimated Market Value ( USD | $ 5.35 Billion |
| Forecasted Market Value ( USD | $ 7.95 Billion |
| Compound Annual Growth Rate | 10.4% |
| Regions Covered | Global |
| No. of Companies Mentioned | 21 |


