The thermal management for the fifth generation (5G) market size is expected to see strong growth in the next few years. It will grow to $18.27 billion in 2029 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period can be attributed to the rising adoption of smart devices, increasing deployment of small cell networks, growing use of liquid cooling systems, rising demand for passive cooling materials, and increasing focus on energy-efficient thermal solutions. Major trends in the forecast period include the development of microchannel coolers, integration of graphene-based materials, advancements in semiconductors, innovations in cooling technologies, and the emergence of eco-friendly thermal management solutions.
The growing demand for high-speed data transmission is expected to drive the expansion of the thermal management for 5G market in the coming years. High-speed data transmission refers to the rapid transfer of large amounts of data across communication networks, which is critical for applications such as streaming, gaming, and cloud computing. This demand is increasing due to the rising use of data-intensive applications and services that require faster and more reliable network connections to operate efficiently. Thermal management for 5G plays a key role in ensuring effective cooling and temperature regulation of 5G network equipment, preventing overheating, maintaining stable performance, and enabling dependable high-speed data transfer for intensive applications while supporting seamless connectivity in densely populated areas. For example, in December 2022, the Office of Communications (Ofcom), a government agency in the UK, reported that average broadband download speeds in Northern Ireland rose by 40%, reaching 115 Mbit/s compared to 82 Mbit/s in 2021. This reflects the broader expansion and adoption of faster internet services. These developments highlight how increasing demand for high-speed data transmission is fueling growth in the thermal management for 5G market.
Companies in the thermal management for 5G market are developing innovative solutions, such as high thermal conductivity materials, to improve heat dissipation and support high-speed performance in 5G equipment. High thermal conductivity materials are substances capable of rapidly transferring heat, which helps disperse excess heat from electronic components, ensuring device reliability and extending product lifespans. In June 2025, U-MAP Co., Ltd., a Japan-based technology company specializing in high-efficiency materials, introduced Thermalnite, a fibrous ceramic material with high thermal conductivity. This material is designed to enhance heat dissipation, improve mechanical strength, and meet the demanding thermal management needs of advanced electronics, including 5G systems. By incorporating small amounts of Thermalnite into composite materials, manufacturers can achieve up to a tenfold increase in thermal conductivity while maintaining flexibility and minimizing weight. This innovation allows for new applications in structural design, injection molding, and other manufacturing methods, making it a strategic solution for next-generation telecommunications infrastructure.
In June 2023, DuPont de Nemours, Inc., a U.S.-based provider of thermal management solutions for 5G technologies, entered into a collaboration with JetCool Technologies Inc. to advance high-performance cooling solutions. The partnership focuses on delivering efficient and sustainable liquid cooling systems to semiconductor manufacturers, helping improve device performance while lowering power consumption in data centers and high-performance computing. JetCool Technologies Inc., also based in the U.S., develops and supplies microconvective liquid cooling technology for high-power electronics.
Major players in the thermal management for fifth generation (5g) market are The Dow Chemical Company, Honeywell International Inc., 3M Company, Henkel AG & Co. KGaA, Parker-Hannifin Corporation, TDK Corporation, Kyocera Corporation, Delta Electronics Inc., Vertiv Holdings Co., H.B. Fuller Company, Boyd Corporation, Autoneum Holding AG, Syensqo, Mersen SA, Momentive Performance Materials Inc., Malico Inc., Zaward Corporation, Advanced Thermal Solutions Inc., Advanced Cooling Technologies Inc., European Thermodynamics Ltd.
Asia-Pacific was the largest region in the thermal management for fifth generation (5G) market in 2024. North America is expected to be the fastest-growing region in the forecast period. The regions covered in this report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa. The countries covered in the thermal management for fifth generation (5G) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
The rapid rise in U.S. tariffs and the subsequent trade frictions in spring 2025 are having a major impact on the electrical and electronics sector, with semiconductors, display panels, and rare-earth metals (essential for batteries and motors) subject to steep duties. Consumer electronics brands face profit erosion, as competitive markets limit their ability to pass costs to buyers. Industrial electronics manufacturers, meanwhile, grapple with delayed projects due to shortages of tariff-impacted components like printed circuit boards. Companies are responding by relocating assembly to tariff-exempt countries, increasing inventory buffers, and redesigning products to reduce dependency on restricted materials.
Thermal management for fifth-generation (5G) refers to the technologies, methods, and systems developed to control and dissipate heat generated by 5G devices, components, and network infrastructure. Its primary purpose is to maintain stable operating temperatures, prevent overheating, and ensure the efficiency, reliability, and longevity of 5G networks. Effective thermal management enhances performance, supports high-speed data transmission, and enables devices to function seamlessly even under heavy workloads.
The main solution types for thermal management in 5G technology include materials, hardware systems, and services. Materials are designed to efficiently transfer and dissipate heat from electronic components, preventing overheating and ensuring consistent device performance. Thermal management solutions employ various cooling approaches, such as passive, active (air-based), or hybrid methods, and are applied across multiple areas, including 5G infrastructure, 5G devices, and power and supporting systems.
The thermal management for fifth generation (5G) market research report is one of a series of new reports that provides thermal management for fifth generation (5G) market statistics, including thermal management for fifth generation (5G) industry global market size, regional shares, competitors with the thermal management for fifth generation (5G) market share, thermal management for fifth generation (5G) market segments, market trends, and opportunities, and any further data you may need to thrive in the thermal management for fifth generation (5G) industry. This thermal management for fifth generation (5G) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The thermal management for fifth generation (5G) market consists of revenues earned by entities by providing services such as designing, developing, and supplying cooling solutions, consulting and engineering, after-sales support, and temperature monitoring services. The market value includes the value of related goods sold by the service provider or included within the service offering. The thermal management for fifth generation (5G) market also includes sales of heat sinks, heat pipes, thermal interface materials, fans, liquid cooling systems, cold plates, and vapor chambers. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Thermal Management for Fifth Generation (5G) Global Market Report 2025 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on thermal management for fifth generation (5g) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for thermal management for fifth generation (5g)? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The thermal management for fifth generation (5g) market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include: the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Report Scope
Markets Covered:
1) By Solution Type: Materials; Hardware Systems; Services2) By Cooling Method: Passive; Active (Air); Hybrid
3) By Application: Fifth Generation (5G) Infrastructure; Fifth Generation (5G) Devices; Power and Supporting Systems
Subsegments:
1) By Materials: Thermal Interface Materials; Adhesives; Graphite; Graphene; Ceramics; Die Attach2) By Hardware Systems: Heat Sinks; Vapor Chambers; Heat Pipes; Fans; Liquid Cooling; Immersion Cooling
3) By Services: Thermal Monitoring; Thermal Control; Thermal Design; Thermal Integration
Companies Mentioned: the Dow Chemical Company; Honeywell International Inc.; 3M Company; Henkel AG & Co. KGaA; Parker-Hannifin Corporation; TDK Corporation; Kyocera Corporation; Delta Electronics Inc.; Vertiv Holdings Co.; H.B. Fuller Company; Boyd Corporation; Autoneum Holding AG; Syensqo; Mersen SA; Momentive Performance Materials Inc.; Malico Inc.; Zaward Corporation; Advanced Thermal Solutions Inc.; Advanced Cooling Technologies Inc.; European Thermodynamics Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned
The companies featured in this Thermal Management for Fifth Generation (5G) market report include:- The Dow Chemical Company
- Honeywell International Inc.
- 3M Company
- Henkel AG & Co. KGaA
- Parker-Hannifin Corporation
- TDK Corporation
- Kyocera Corporation
- Delta Electronics Inc.
- Vertiv Holdings Co.
- H.B. Fuller Company
- Boyd Corporation
- Autoneum Holding AG
- Syensqo
- Mersen SA
- Momentive Performance Materials Inc.
- Malico Inc.
- Zaward Corporation
- Advanced Thermal Solutions Inc.
- Advanced Cooling Technologies Inc.
- European Thermodynamics Ltd.
Table Information
Report Attribute | Details |
---|---|
No. of Pages | 250 |
Published | October 2025 |
Forecast Period | 2025 - 2029 |
Estimated Market Value ( USD | $ 13.08 Billion |
Forecasted Market Value ( USD | $ 18.27 Billion |
Compound Annual Growth Rate | 8.7% |
Regions Covered | Global |
No. of Companies Mentioned | 21 |