The thermal management for fifth generation (5g) market size is expected to see strong growth in the next few years. It will grow to $19.82 billion in 2030 at a compound annual growth rate (CAGR) of 8.6%. The growth in the forecast period can be attributed to deployment of standalone 5g networks, proliferation of edge computing, increasing adoption of small cells, demand for energy-efficient networks, advancements in thermal interface materials. Major trends in the forecast period include advanced thermal materials adoption, compact and lightweight cooling architectures, hybrid cooling system integration, real-time thermal monitoring solutions, high-density component heat dissipation.
The growing demand for high-speed data transmission is expected to drive the expansion of the thermal management for 5G market in the coming years. High-speed data transmission involves the rapid transfer of large volumes of data across communication networks, which is critical for applications such as streaming, gaming, and cloud computing. This demand is rising due to the proliferation of data-intensive applications and services that require faster and more reliable network connections. Thermal management for 5G ensures effective cooling and temperature regulation of 5G network equipment, preventing overheating, maintaining consistent performance, and enabling reliable high-speed data transfer for data-intensive applications and seamless connectivity in densely populated networks. For example, in April 2024, the International Telecommunication Union (ITU), a Switzerland-based United Nations agency, reported that global mobile broadband traffic reached 1 zettabyte in 2023 for the first time and is projected to increase to 1.3 zettabytes in 2024, while fixed broadband traffic is expected to grow from 5.1 to 6 zettabytes during the same period. Consequently, the rising demand for high-speed data transmission is fueling the growth of the thermal management for 5G market.
Companies in the thermal management for 5G market are developing innovative solutions, such as high thermal conductivity materials, to improve heat dissipation and support high-speed performance in 5G equipment. High thermal conductivity materials are substances capable of rapidly transferring heat, which helps disperse excess heat from electronic components, ensuring device reliability and extending product lifespans. In June 2025, U-MAP Co., Ltd., a Japan-based technology company specializing in high-efficiency materials, introduced Thermalnite, a fibrous ceramic material with high thermal conductivity. This material is designed to enhance heat dissipation, improve mechanical strength, and meet the demanding thermal management needs of advanced electronics, including 5G systems. By incorporating small amounts of Thermalnite into composite materials, manufacturers can achieve up to a tenfold increase in thermal conductivity while maintaining flexibility and minimizing weight. This innovation allows for new applications in structural design, injection molding, and other manufacturing methods, making it a strategic solution for next-generation telecommunications infrastructure.
In June 2023, DuPont de Nemours, Inc., a U.S.-based provider of thermal management solutions for 5G technologies, entered into a collaboration with JetCool Technologies Inc. to advance high-performance cooling solutions. The partnership focuses on delivering efficient and sustainable liquid cooling systems to semiconductor manufacturers, helping improve device performance while lowering power consumption in data centers and high-performance computing. JetCool Technologies Inc., also based in the U.S., develops and supplies microconvective liquid cooling technology for high-power electronics.
Major companies operating in the thermal management for fifth generation (5g) market are The Dow Chemical Company, Honeywell International Inc., 3M Company, Henkel AG & Co. KGaA, Parker-Hannifin Corporation, TDK Corporation, Kyocera Corporation, Delta Electronics Inc., Vertiv Holdings Co., H.B. Fuller Company, Boyd Corporation, Autoneum Holding AG, Syensqo, Mersen SA, Momentive Performance Materials Inc., Malico Inc., Zaward Corporation, Advanced Thermal Solutions Inc., Advanced Cooling Technologies Inc., European Thermodynamics Ltd.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs have impacted the thermal management for fifth-generation (5g) market by increasing costs of imported thermal materials, cooling hardware systems, and manufacturing equipment, disrupting global supply chains. these effects are most pronounced in 5g infrastructure and device segments, particularly across asia-pacific and north america where large-scale manufacturing and deployment activities are concentrated. higher tariffs have slowed procurement cycles and raised deployment costs for telecom operators and equipment manufacturers. however, tariffs have also encouraged local manufacturing, supplier diversification, and innovation in cost-effective thermal solutions, supporting long-term market resilience.
The thermal management for fifth generation (5G) market research report is one of a series of new reports that provides thermal management for fifth generation (5G) market statistics, including thermal management for fifth generation (5G) industry global market size, regional shares, competitors with the thermal management for fifth generation (5G) market share, thermal management for fifth generation (5G) market segments, market trends, and opportunities, and any further data you may need to thrive in the thermal management for fifth generation (5G) industry. This thermal management for fifth generation (5G) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
Thermal management for fifth-generation (5G) refers to the technologies, methods, and systems developed to control and dissipate heat generated by 5G devices, components, and network infrastructure. Its primary purpose is to maintain stable operating temperatures, prevent overheating, and ensure the efficiency, reliability, and longevity of 5G networks. Effective thermal management enhances performance, supports high-speed data transmission, and enables devices to function seamlessly even under heavy workloads.
The main solution types for thermal management in 5G technology include materials, hardware systems, and services. Materials are designed to efficiently transfer and dissipate heat from electronic components, preventing overheating and ensuring consistent device performance. Thermal management solutions employ various cooling approaches, such as passive, active (air-based), or hybrid methods, and are applied across multiple areas, including 5G infrastructure, 5G devices, and power and supporting systems.Asia-Pacific was the largest region in the thermal management for fifth generation (5G) market in 2025. North America is expected to be the fastest-growing region in the forecast period. The regions covered in the thermal management for fifth generation (5g) market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the thermal management for fifth generation (5g) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The thermal management for fifth generation (5G) market consists of revenues earned by entities by providing services such as designing, developing, and supplying cooling solutions, consulting and engineering, after-sales support, and temperature monitoring services. The market value includes the value of related goods sold by the service provider or included within the service offering. The thermal management for fifth generation (5G) market also includes sales of heat sinks, heat pipes, thermal interface materials, fans, liquid cooling systems, cold plates, and vapor chambers. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Thermal Management For Fifth Generation (5G) Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses thermal management for fifth generation (5g) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for thermal management for fifth generation (5g)? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The thermal management for fifth generation (5g) market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Solution Type: Materials; Hardware Systems; Services2) By Cooling Method: Passive; Active (Air); Hybrid
3) By Application: Fifth Generation (5G) Infrastructure; Fifth Generation (5G) Devices; Power And Supporting Systems
Subsegments:
1) By Materials: Thermal Interface Materials; Adhesives; Graphite; Graphene; Ceramics; Die Attach2) By Hardware Systems: Heat Sinks; Vapor Chambers; Heat Pipes; Fans; Liquid Cooling; Immersion Cooling
3) By Services: Thermal Monitoring; Thermal Control; Thermal Design; Thermal Integration
Companies Mentioned: The Dow Chemical Company; Honeywell International Inc.; 3M Company; Henkel AG & Co. KGaA; Parker-Hannifin Corporation; TDK Corporation; Kyocera Corporation; Delta Electronics Inc.; Vertiv Holdings Co.; H.B. Fuller Company; Boyd Corporation; Autoneum Holding AG; Syensqo; Mersen SA; Momentive Performance Materials Inc.; Malico Inc.; Zaward Corporation; Advanced Thermal Solutions Inc.; Advanced Cooling Technologies Inc.; European Thermodynamics Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Thermal Management for Fifth Generation (5G) market report include:- The Dow Chemical Company
- Honeywell International Inc.
- 3M Company
- Henkel AG & Co. KGaA
- Parker-Hannifin Corporation
- TDK Corporation
- Kyocera Corporation
- Delta Electronics Inc.
- Vertiv Holdings Co.
- H.B. Fuller Company
- Boyd Corporation
- Autoneum Holding AG
- Syensqo
- Mersen SA
- Momentive Performance Materials Inc.
- Malico Inc.
- Zaward Corporation
- Advanced Thermal Solutions Inc.
- Advanced Cooling Technologies Inc.
- European Thermodynamics Ltd.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 14.24 Billion |
| Forecasted Market Value ( USD | $ 19.82 Billion |
| Compound Annual Growth Rate | 8.6% |
| Regions Covered | Global |
| No. of Companies Mentioned | 21 |


