The data center chip market size is expected to see rapid growth in the next few years. It will grow to $431.78 billion in 2030 at a compound annual growth rate (CAGR) of 14.7%. The growth in the forecast period can be attributed to the rapid increase in AI and machine learning workloads, growing demand for energy-efficient data center processors, increasing adoption of custom silicon by cloud service providers, expansion of edge-to-cloud data processing, and continued advancements in sub-5 nm semiconductor manufacturing technologies. Major trends in the forecast period include increasing adoption of chiplet-based processor architectures, greater integration of heterogeneous computing technologies, expansion of advanced semiconductor packaging solutions, continued localization and diversification of semiconductor supply chains, and increasing emphasis on reliability and uptime optimization for hyperscale data center operations.
The increasing use of cloud services is expected to drive the growth of the data center chip market in the coming years. Cloud services consist of computing resources, applications, and other digital capabilities delivered through the internet that users can access on demand without having to own physical infrastructure. The adoption of cloud services is increasing because they provide scalability, enabling businesses to adjust computing resources according to requirements without making substantial investments in physical hardware. Data center chips support cloud services by delivering high-performance computing capabilities and efficient data processing, allowing servers to manage large workloads, process extensive datasets, and provide fast and dependable cloud-based applications. For instance, in June 2024, according to AAG IT Services, a UK-based non-government organization, approximately 63% of small and medium-sized business workloads and 62% of small and medium-sized business data were expected to be hosted in public clouds in 2023, compared with 57% and 56%, respectively, in 2022. Therefore, the growing adoption of cloud services is contributing to the expansion of the data center chip market.
Leading companies operating in the data center chip market are focusing on developing technological advancements such as custom-designed data center infrastructure chips to enhance server performance, improve energy efficiency, and support increasingly complex cloud and AI workloads. Custom-designed data center infrastructure chips refer to semiconductor components specifically engineered for data center operations and optimized for tasks such as high-performance computing, data storage, networking, and AI processing, rather than general-purpose computing. For example, in November 2024, Microsoft Corporation, a US-based technology company, launched Azure Integrated HSM (Hardware Security Module) and Azure Boost DPU (Data Processing Unit) to enhance cloud security and accelerate data-intensive workloads. Azure Integrated HSM secures encryption keys within dedicated hardware to enable faster and safer cryptographic operations in the cloud. Azure Boost DPU offloads network and storage workloads from CPUs, improving data center speed and efficiency for demanding AI applications.
In June 2025, Qualcomm Inc., a US-based semiconductor and technology company, acquired Alphawave IP Group plc for $2.4 billion. Through this acquisition, Qualcomm aimed to strengthen its presence in the data center chip market by complementing its custom CPU and NPU products with Alphawave Semi’s advanced connectivity technologies, allowing the company to provide more integrated, high-performance, and energy-efficient computing platforms designed to support AI inferencing and the evolving requirements of data centers. Alphawave Semi is a UK-based semiconductor company that develops connectivity and data center chip solutions.
Major companies operating in the data center chip market are Google LLC, Samsung Electronics Co. Ltd., Huawei Technologies Co. Ltd., Intel Corporation, IBM Corporation, Cisco Systems Inc., Oracle Corporation, Qualcomm Technologies Inc., Sk Hynix Inc., Broadcom Inc., Hewlett Packard Enterprise, Fujitsu Limited, NVIDIA Corporation, Advanced Micro Devices Inc., Texas Instruments Incorporated, STMicroelectronics N.V., Marvell Technology Group Ltd., Arm Holdings Plc, Monolithic Power Systems Inc., Ampere Computing LLC.
North America was the largest region in the data center chip market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the data center chip market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
The countries covered in the data center chip market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
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Table of Contents
Executive Summary
Data Center Chip Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses data center chip market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for data center chip? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The data center chip market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Chip Type: Central Processing Units (Cpus); Graphics Processing Units (Gpus); Application-Specific Integrated Circuits (Asics); Field-Programmable Gate Arrays (Fpgas); Neural Processing Units (Npus)2) By Technology: 25 Nanometer (NM) And Below; 26 Nanometer (NM) To 45 Nanometer (NM); 46 Nanometer (NM) To 65 Nanometer (NM); Above 65 Nanometer (NM)
3) By Data Center Size: Small And Medium Size; Large Size
4) By Application Area: Data Storage; Networking; High-Performance Computing (HPC); Artificial Intelligence (AI) And Machine Learning (Ml); Cloud Computing
5) By End-Use: Information Technology; Telecom; Healthcare; Banking, Financial Services, And Insurance (BFSI); Retail And E-Commerce; Entertainment And Media; Energy; Other End-Users
Subsegments:
1) By Central Processing Units: Server Central Processing Units (CPUs); High-Performance Central Processing Units (CPUs); Low-Power Central Processing Units (CPUs)2) By Graphics Processing Units: Discrete Graphics Processing Units (GPUs); Integrated Graphics Processing Units (GPUs); Artificial Intelligence Or Machine Learning Accelerators; High-Performance Computing Graphics Processing Units
3) By Application-Specific Integrated Circuits: Networking Application-Specific Integrated Circuits (ASICs); Storage Application-Specific Integrated Circuits (ASICs); Security Application-Specific Integrated Circuits (ASICs); Artificial Intelligence or Machine Learning Application-Specific Integrated Circuits (ASICs); Custom Application-Specific Integrated Circuits (ASICs)
4) By Field-Programmable Gate Arrays: High-End Field-Programmable Gate Arrays (Fpgas); Mid-Range Field-Programmable Gate Arrays (Fpgas); Low-End Field-Programmable Gate Arrays (Fpgas); Embedded Field-Programmable Gate Arrays (Fpgas)
5) By Neural Processing Units: Edge Neural Processing Units (NPUs); Cloud Neural Processing Units (NPUs); Artificial Intelligence Inference Neural Processing Units (NPUs); Artificial Intelligence Training Neural Processing Units (NPUs)
Companies Mentioned: Google LLC; Samsung Electronics Co. Ltd.; Huawei Technologies Co. Ltd.; Intel Corporation; IBM Corporation; Cisco Systems Inc.; Oracle Corporation; Qualcomm Technologies Inc.; Sk Hynix Inc.; Broadcom Inc.; Hewlett Packard Enterprise; Fujitsu Limited; NVIDIA Corporation; Advanced Micro Devices Inc.; Texas Instruments Incorporated; STMicroelectronics N.V.; Marvell Technology Group Ltd.; Arm Holdings Plc; Monolithic Power Systems Inc.; Ampere Computing LLC
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentations: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
- Google LLC
- Samsung Electronics Co. Ltd.
- Huawei Technologies Co. Ltd.
- Intel Corporation
- IBM Corporation
- Cisco Systems Inc.
- Oracle Corporation
- Qualcomm Technologies Inc.
- Sk Hynix Inc.
- Broadcom Inc.
- Hewlett Packard Enterprise
- Fujitsu Limited
- NVIDIA Corporation
- Advanced Micro Devices Inc.
- Texas Instruments Incorporated
- STMicroelectronics N.V.
- Marvell Technology Group Ltd.
- Arm Holdings Plc
- Monolithic Power Systems Inc.
- Ampere Computing LLC

