Die Attach Film Global Market Report 2025

The die attach film market size has grown strongly in recent years. It will grow from $1.12 billion in 2024 to $1.22 billion in 2025 at a compound annual growth rate (CAGR) of 9.1%. The growth in the historic period can be attributed to the expansion of automotive electronics, the enforcement of stringent quality and reliability standards, the growth of semiconductor fabrication and packaging facilities, increasing demand for high-speed and high-frequency devices, and advancements in processability and automation technologies.

The die attach film market size is expected to see strong growth in the next few years. It will grow to $1.71 billion in 2029 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period can be attributed to the rising demand for electric and hybrid vehicles, increasing need for high-performance consumer electronics, growing adoption of Internet of Things (IoT) and wearable devices, expanding use of power management components, and increasing production of high-density memory chips. Major trends in the forecast period include advancements in material science, innovations in ultra-thin films for compact semiconductor packaging, integration of die attach films with wafer-level packaging (WLP) technologies, adoption of artificial intelligence in manufacturing processes, and the development of customized die attach film solutions.

The increasing demand for consumer electronics is expected to drive the growth of the die attach film market going forward. Consumer electronics refer to electronic devices designed for everyday personal or household use, including smartphones, computers, televisions, and audio systems. The rise in consumer electronics demand is attributed to growing internet penetration, which enables more individuals to access online shopping and digital services, thereby fueling the need for electronic devices. Die attach film supports consumer electronics by offering high-performance materials that improve efficiency, reliability, and thermal management of electronic components. For instance, in February 2023, according to a report published by Uswitch Limited, a United Kingdom-based online and telephone comparison and switching service provider, there were 71.8 million active mobile connections in 2022, and by 2025, it is projected that 95% of the 68.3 million people in the United Kingdom will own smartphones. Therefore, the increasing demand for consumer electronics is driving the growth of the die attach film market.

Key companies operating in the die attach film market are focusing on expanding their production capacities to minimize manufacturing bottlenecks and ensure timely product delivery in response to growing customer demand. Expanding manufacturing capabilities enables companies to meet the increasing needs of the semiconductor and smartphone industries while maintaining a consistent material supply. For instance, in April 2023, Resonac Corporation, a Japan-based chemical company, announced a 60% increase in production capacity for its Dicing Die Bonding Film at the Goi Plant in Kashima, Ibaraki Prefecture, Japan. The expanded facilities are scheduled to begin operations in 2026. This initiative aims to address the growing demand for semiconductor memory, with a primary focus on supporting applications related to cloud computing, data centers, and metaverse technologies.

In October 2023, Sumitomo Bakelite Co. Ltd., a Japan-based manufacturer of resin products, acquired 90% of the film business of Asahi Kasei Pax Corporation for an undisclosed amount. Through this acquisition, Sumitomo Bakelite strengthened its quality of life business, particularly the films and sheets division that serves pharmaceutical, industrial, and food packaging markets. The company also leveraged Asahi Kasei Pax’s processing expertise to ensure a more stable supply and enhanced service quality for pharmaceutical packaging films while expanding its overall film and sheet operations. Asahi Kasei Pax Corporation is a Japan-based manufacturer of die attach films.

Major players in the die attach film market are The Dow Chemical Company, LG Chem Limited, 3M Company, Henkel Aktiengesellschaft, Shin-Etsu Chemical Co. Ltd., Toray Industries, Kyocera Corporation, Resonac Corporation, Furukawa Electric Co. Ltd., Nitto Denko Corporation, LINTEC Corporation, Sumitomo Bakelite Co. Ltd., Dexerials Corporation, Lohmann GmbH & Co. KG., Momentive Performance Materials, Indium Corporation, Nagase & Co. Ltd., MacDermid Alpha Electronics Solutions LLC., Caplinq Europe BV, and American Fairfield Corporation.

Asia-Pacific was the largest region in the die attach film market in 2024, and it is expected to be the fastest-growing region in the forecast period. The regions covered in die attach film report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The intensifying U.S. tariffs and escalating trade tensions in spring 2025 are expected to have a significant impact on the chemicals sector, which is bearing a disproportionate burden, particularly from tariffs on petrochemicals and intermediates, where affordable domestic substitutes are often unavailable. Producers of specialty chemicals, heavily dependent on Chinese raw materials, are experiencing production disruptions. At the same time, fertilizer manufacturers are seeing profit margins eroded due to tariffs on phosphate imports. In response, companies are ramping up R&D into bio-based alternatives, forming procurement alliances to consolidate buying power, and shifting production to tariff-neutral nations such as Saudi Arabia.

The die attach film market research report is one of a series of new reports that provides die attach film market statistics, including die attach film industry global market size, regional shares, competitors with a die attach film market share, detailed die attach film market segments, market trends and opportunities, and any further data you may need to thrive in the die attach film industry. This die attach film market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

A die attach film is a pre-formed adhesive layer used in semiconductor packaging to bond a semiconductor die securely to a substrate or lead frame, ensuring precise alignment and uniform bond thickness. It provides excellent thermal conductivity, strong adhesion, and reliable mechanical stability, improving device performance and manufacturing efficiency compared to conventional paste adhesives.

The primary types of die attach films include epoxy die attach films, polyimide die attach films, and silicone die attach films. Epoxy die attach films are adhesive films made from epoxy resins that bond semiconductor components to substrates, offering superior mechanical strength, thermal stability, and electrical insulation. These films are available in different product forms such as sheet-form, roll-form, and pre-cut die attach films, with varying thicknesses including ultra-thin (< 10 microns), thin (10-50 microns), and standard (50-100 microns). They are widely used in consumer electronics, automotive electronics, telecommunications, industrial electronics, aerospace, and defense applications, serving key end-use industries such as semiconductor manufacturing, LED manufacturing, power electronics, and photovoltaics.

The countries covered in the die attach film market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The die attach film market consists of sales of thermally conductive adhesive films, non-conductive adhesive films, high-reliability bonding films, ultra-thin adhesive films, moisture-resistant adhesive films, and low-temperature curing adhesive films. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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