Die Attach Film Market Report 2026

The die attach film market size has grown strongly in recent years. It will grow from $1.22 billion in 2025 to $1.33 billion in 2026 at a compound annual growth rate (CAGR) of 8.9%. The growth in the historic period can be attributed to semiconductor miniaturization, consumer electronics growth, led manufacturing expansion, traditional paste adhesive limitations, electronics assembly automation.

The die attach film market size is expected to see strong growth in the next few years. It will grow to $1.85 billion in 2030 at a compound annual growth rate (CAGR) of 8.6%. The growth in the forecast period can be attributed to electric vehicle electronics growth, 5g device deployment, advanced chip packaging demand, power electronics expansion, aerospace electronics adoption. Major trends in the forecast period include rising demand for advanced semiconductor packaging, growing use in automotive electronics, expansion of ultra thin die attach films, focus on thermal conductivity improvement, adoption of high reliability bonding materials.

The increasing demand for consumer electronics is expected to drive the growth of the die attach film market going forward. Consumer electronics refer to electronic devices designed for everyday personal or household use, including smartphones, computers, televisions, and audio systems. The rise in consumer electronics demand is attributed to growing internet penetration, which enables more individuals to access online shopping and digital services, thereby fueling the need for electronic devices. Die attach film supports consumer electronics by offering high-performance materials that improve efficiency, reliability, and thermal management of electronic components. For instance, in February 2023, according to a report published by Uswitch Limited, a United Kingdom-based online and telephone comparison and switching service provider, there were 71.8 million active mobile connections in 2022, and by 2025, it is projected that 95% of the 68.3 million people in the United Kingdom will own smartphones. Therefore, the increasing demand for consumer electronics is driving the growth of the die attach film market.

Key companies operating in the die attach film market are focusing on expanding their production capacities to minimize manufacturing bottlenecks and ensure timely product delivery in response to growing customer demand. Expanding manufacturing capabilities enables companies to meet the increasing needs of the semiconductor and smartphone industries while maintaining a consistent material supply. For instance, in April 2023, Resonac Corporation, a Japan-based chemical company, announced a 60% increase in production capacity for its Dicing Die Bonding Film at the Goi Plant in Kashima, Ibaraki Prefecture, Japan. The expanded facilities are scheduled to begin operations in 2026. This initiative aims to address the growing demand for semiconductor memory, with a primary focus on supporting applications related to cloud computing, data centers, and metaverse technologies.

In October 2023, Sumitomo Bakelite Co. Ltd., a Japan-based manufacturer of resin products, acquired 90% of the film business of Asahi Kasei Pax Corporation for an undisclosed amount. Through this acquisition, Sumitomo Bakelite strengthened its quality of life business, particularly the films and sheets division that serves pharmaceutical, industrial, and food packaging markets. The company also leveraged Asahi Kasei Pax’s processing expertise to ensure a more stable supply and enhanced service quality for pharmaceutical packaging films while expanding its overall film and sheet operations. Asahi Kasei Pax Corporation is a Japan-based manufacturer of die attach films.

Major companies operating in the die attach film market are Henkel Aktiengesellschaft, 3M Company, Shin-Etsu Chemical Co. Ltd., Nitto Denko Corporation, LINTEC Corporation, Sumitomo Bakelite Co. Ltd., Dexerials Corporation, Toray Industries, Kyocera Corporation, Resonac Corporation, Furukawa Electric Co. Ltd., Momentive Performance Materials, Indium Corporation, Nagase & Co. Ltd., MacDermid Alpha Electronics Solutions LLC, The Dow Chemical Company, LG Chem Limited, Lohmann GmbH & Co. KG, Toyo Ink SC Holdings Co. Ltd., Hitachi Chemical Co. Ltd.

Asia-Pacific was the largest region in the die attach film market in 2025, and it is expected to be the fastest-growing region in the forecast period. The regions covered in the die attach film market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the die attach film market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The die attach film market consists of sales of thermally conductive adhesive films, non-conductive adhesive films, high-reliability bonding films, ultra-thin adhesive films, moisture-resistant adhesive films, and low-temperature curing adhesive films. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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