In recent years, the Taiwan molding compound market demonstrated robust growth, primarily driven by the escalating demand from the semiconductor, electronics, and automotive sectors. In 2024, the country witnessed an increase in semiconductor exports and a substantial growth in electronic component output. This surge is largely attributed to the rapid advancements in 5G, AI, and electric vehicles (EVs), each contributing significantly to the expansion of the market.
As the demand for cutting-edge electronic devices and systems intensifies, so does the need for high-performance molding compounds, particularly epoxy and phenolic resins, which are critical in semiconductor packaging, printed circuit board (PCB) insulation, and optoelectronics. The Taiwan Molding Compound Market is projected to grow at a CAGR of 8.9% from 2025 to 2031, supported by continued investments in AI infrastructure, the expansion of the electric vehicle market, and the rise of advanced packaging technologies. Taiwan's robust Electrical & Electronics (E&E) industry, which contributes to the nation’s GDP, remains the primary driver of this growth, with semiconductor packaging and automotive electronics leading the demand for high-performance molding compounds.
The electric vehicle sector, expected to experience growth by 2030, would be a key catalyst for increased demand for advanced molding compounds, particularly those offering high thermal stability and flame retardancy for use in battery systems and electronic components. Simultaneously, Taiwan’s strategic focus on AI infrastructure, including developments in silicon photonics and quantum computing, would further drive the adoption of bulk molding compounds (BMC) and sheet molding compounds (SMC), solidifying Taiwan’s position as a global leader in high-tech manufacturing.
As the demand for cutting-edge electronic devices and systems intensifies, so does the need for high-performance molding compounds, particularly epoxy and phenolic resins, which are critical in semiconductor packaging, printed circuit board (PCB) insulation, and optoelectronics. The Taiwan Molding Compound Market is projected to grow at a CAGR of 8.9% from 2025 to 2031, supported by continued investments in AI infrastructure, the expansion of the electric vehicle market, and the rise of advanced packaging technologies. Taiwan's robust Electrical & Electronics (E&E) industry, which contributes to the nation’s GDP, remains the primary driver of this growth, with semiconductor packaging and automotive electronics leading the demand for high-performance molding compounds.
The electric vehicle sector, expected to experience growth by 2030, would be a key catalyst for increased demand for advanced molding compounds, particularly those offering high thermal stability and flame retardancy for use in battery systems and electronic components. Simultaneously, Taiwan’s strategic focus on AI infrastructure, including developments in silicon photonics and quantum computing, would further drive the adoption of bulk molding compounds (BMC) and sheet molding compounds (SMC), solidifying Taiwan’s position as a global leader in high-tech manufacturing.
Market Segmentation by Type
Polyester molding compounds are projected to register the fastest growth rate, supported by rising adoption in automotive, industrial equipment, and renewable energy components, where their lightweight, corrosion-resistant, and dimensionally stable properties align with evolving design and performance requirements.Market Segmentation by Resin Type
Epoxy resins dominate Taiwan’s semiconductor packaging encapsulant materials market due to their low cost, high reliability, and compatibility with mainstream packaging formats, making them ideal for high-volume chip production. Their excellent thermal, mechanical, and moisture resistance further reinforces their preference over alternative resins.Market Segmentation by Application
Transfer/Compression Molding leads the Taiwan semiconductor packaging encapsulant materials market as it offers high throughput, cost efficiency, and uniform encapsulation quality, making it ideal for mass production. Its reliability in protecting chips from thermal, mechanical, and moisture stress further drives its dominance across mainstream packaging lines.Market Segmentation by End-User
The automotive segment is expected to witness the fastest growth, driven by the expansion of electric vehicle production, the shift toward lightweight materials, and the rising need for heat-resistant, high-performance components in both domestic manufacturing and export-oriented automotive parts industries.Key Attractiveness of the Report
- 10 Years Market Numbers.
- Historical Data Starting from 2021 to 2024.
- Base Year: 2024
- Forecast Data until 2031
- Key Performance Indicators Impacting the Market.
- Major Upcoming Developments and Projects.
Key Highlights of the Report:
- Taiwan Molding Compound Market Overview
- Taiwan Molding Compound Market Outlook
- Taiwan Molding Compound Market Forecast
- Historical Data and Forecast of Taiwan Molding Compound Market Revenues for the Period 2021-2031F
- Historical Data and Forecast of Taiwan Molding Compound Market Revenues, by Type, for the Period 2021-2031F
- Historical Data and Forecast of Taiwan Molding Compound Market Revenues, by End-User, for the Period 2021-2031F
- Industry Life Cycle
- Market Drivers
- Market Trends
- Key Performance Indicators
- Key Strategic Recommendation
- Taiwan Molding Compound Market Top Companies Revenue Ranking
- Market Scope and Segmentation
The report provides a detailed analysis of the following market segments:
By Type
- Epoxy (EMC)
- Phenolic
- Polyester (SMC/BMC)
- Melamine
- Others (Urea, Silicone, etc.)
By End-User
- Electronics & Electrical
- Automotive
- Consumer Appliances
- Industrial Equipment
- Others (Aerospace, Medical Devices, etc.)
By Resin Type
- Epoxy
- Silicone
- Polyurethane
- Others (Acrylate/UV, etc.)
By Application
- Transfer/Compression Molding (EMC)
- Underfills
- Liquid Encapsulation
- LED/Optical Encapsulation
Table of Contents
1. Executive Summary5. Taiwan Molding Compound Market Trends13. Key Strategic Recommendations
2. Introduction
3. Taiwan Molding Compound Market Overview
4. Taiwan Molding Compound Market Dynamics
6. Taiwan Molding Compound Market Overview, by Type
7. Taiwan Molding Compound Market Overview, by End-User
8. Taiwan Semiconductor Packaging Encapsulant Materials Market Overview
9. Taiwan Molding Compound Market Key Performance Indicators
10. Taiwan Molding Compound Market Opportunity Assessment
11. Taiwan Molding Compound Market Competitive Landscape
12. Company Profiles
List of Figures
List of Tables
Companies Mentioned
- Sumitomo Bakelite Co., Ltd.
- Chang Chun Group
- Hitachi Chemical Co., Ltd
- Hexion Inc.
- Panasonic Taiwan Co., Ltd. (PTW)
- Kyocera Chemical
- Shin-Etsu Chemical Co., Ltd.
- Hysol Huawei Electronics Co., Ltd.
- BASF SE
- Nan Ya Plastics Corporation
