The ultra-short reach optical interconnect market size is expected to see rapid growth in the next few years. It will grow to $4.86 billion in 2030 at a compound annual growth rate (CAGR) of 18.7%. The growth in the forecast period can be attributed to growth of HPC and AI workloads, increasing bandwidth requirements beyond 100 GBPS, expansion of co-packaged optics solutions, adoption of silicon photonics interposers, demand for energy-efficient ultra-short reach interconnects. Major trends in the forecast period include integration of silicon photonics (SiPh) for high-speed board-to-board interconnects, adoption of VCSEL and µ-LED based ultra-short reach optical links, implementation of co-packaged optics for reduced latency and power consumption, deployment of high-density fiber connectors in rack-to-rack applications, expansion of optical interconnects in data center and HPC environments.
Rising high-bandwidth connectivity is expected to drive the growth of the ultra-short reach optical interconnect market going forward. High-bandwidth connectivity refers to communication links or networks that support the transmission of large amounts of data at very high speeds, enabling efficient and seamless data transfer between devices or systems. This rise is driven by the growing adoption of cloud computing, which requires faster and more reliable data transmission to support large-scale data storage, real-time processing, and seamless access to cloud-based applications. Ultra-short reach optical interconnect enhances high-bandwidth connectivity by enabling faster, energy-efficient, and low-latency data transmission between chips and devices within data centers and high-performance computing systems. For instance, in November 2024, according to the UK Parliament’s House of Commons Library, a UK government body, 78 percent of UK premises had access to gigabit-capable broadband as of January 2024, up from 72 percent in January 2023 and 64 percent in January 2022. Therefore, rising high-bandwidth connectivity is driving the growth of the ultra-short reach optical interconnect market.
Primary companies operating in the ultra-short reach optical interconnect market are focusing on developing innovative solutions such as high-density, low-power optical interconnect technologies to enhance data transfer efficiency in AI and data center infrastructures. High-density, low-power optical interconnect technologies are advanced data transmission systems that enable faster, energy-efficient communication between closely packed computing components within AI and data center environments. For example, in October 2025, Semtech Limited, a US-based technology company, launched 1.6T multimode optical chipsets tailored for AI infrastructure in data centers. The launch included sampling of key physical medium dependent (PMD) components such as the FiberEdge GN1878 200G-per-channel vertical-cavity surface-emitting laser (VCSEL) driver and the GN1836 200G-per-channel transimpedance amplifier (TIA). These advanced components power ultra-short reach optical interconnects capable of delivering up to 1.6 terabits per second of aggregate bandwidth, meeting the growing data transmission demands of AI and machine learning workloads. With a multimode design that optimizes power efficiency and reduces cost per bit, the solution is ideal for high-density AI cluster environments. This development strengthens Semtech’s leadership in optical connectivity and lays the foundation for future scalability toward 3.2T solutions in next-generation data centers.
In October 2025, Ciena Corporation, a US-based technology company, acquired Nubis Communications for $270 million. Through this acquisition, Ciena aims to strengthen its data center connectivity offerings by integrating high-performance, low-power interconnect technologies tailored for AI workloads. Nubis Communications Inc. is a US-based company providing ultra-short reach optical interconnect solutions.
Major companies operating in the ultra-short reach optical interconnect market are Cisco Systems Inc., Intel Corporation, Broadcom Inc., Mitsubishi Electric Corporation, Sumitomo Electric Industries Ltd., NVIDIA Corporation, Fujitsu Limited, NEC Corporation, Corning Incorporated, Amphenol Corporation, Molex LLC, Marvell Technology Inc., Ciena Corporation, Lumentum Holdings Inc., Ayar Labs Incorporated, Huawei Technologies Co. Ltd., Celestial AI Incorporated, Skorpios Technologies Incorporated, OpenLight Incorporated, Ranovus Incorporated.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs have influenced the ultra-short reach optical interconnect market by increasing the cost of imported lasers, silicon photonics modules, and optical transceivers, particularly affecting board-to-board and rack-to-rack components. Data center operators in North America and Europe are most impacted due to their reliance on imported high-speed modules. However, tariffs have also encouraged localized manufacturing and sourcing of optical components, promoting cost optimization and innovation in energy-efficient, high-performance interconnect solutions.
The ultra-short reach optical interconnect market research report is one of a series of new reports that provides ultra-short reach optical interconnect market statistics, including ultra-short reach optical interconnect industry global market size, regional shares, competitors with a ultra-short reach optical interconnect market share, detailed ultra-short reach optical interconnect market segments, market trends and opportunities, and any further data you may need to thrive in the ultra-short reach optical interconnect industry. This ultra-short reach optical interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
Ultra-short reach optical interconnect refers to high-speed data transmission technology designed for very short distances, typically within or between chips, servers, or data center racks. It enables faster communication, reduced latency, and lower power consumption compared to traditional electrical interconnects.
The primary products of ultra-short reach optical interconnects are board-to-board interconnects and rack-to-rack interconnects. Board-to-board interconnects are electrical or optical connectors that enable direct signal and power transmission between two or more printed circuit boards (PCBs) within an electronic system. These interconnects use various technologies such as vertical-cavity surface-emitting laser-based interconnects (VCSEL), silicon photonics (SiPh), and micro light-emitting diode-based links (µ-LED). They support data rates of less than 25 gigabits per second (GBPS), 25 to 50 GBPS, 50 to 100 GBPS, and more than 100 GBPS, and operate over distances of less than 1 meter, 1 to 5 meters, and more than 5 meters.North America was the largest region in the ultra-short reach optical interconnect market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the ultra-short reach optical interconnect market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the ultra-short reach optical interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The ultra-short reach optical interconnect market consists of revenues earned by entities by providing services such as high-speed data transmission services, optical component integration services, data center interconnect solutions, testing and maintenance services, and consulting and deployment services. The market value includes the value of related goods sold by the service provider or included within the service offering. The ultra-short reach optical interconnect market also includes sales of optical transceivers, active optical cables, optical connectors, silicon photonics modules, and optical engines. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Ultra-Short Reach Optical Interconnect Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses ultra-short reach optical interconnect market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for ultra-short reach optical interconnect? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The ultra-short reach optical interconnect market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Product: Board-To-Board Interconnects; Rack-To-Rack Interconnects2) By Technology: Vertical-Cavity Surface-Emitting Laser-Based Interconnects (VCSEL); Silicon Photonics (SiPh); Micro Light-Emitting Diode Based Links (µ-LED) Based Links
3) By Data Rate: Less Than 25 Gigabits Per Second (GBPS); 25 - 50 Gigabits Per Second (GBPS); 50 - 100 Gigabits Per Second (GBPS); More Than 100 Gigabits Per Second (GBPS)
4) By Distance: Less Than 1 Meter; 1 - 5 Meter; More Than 5 Meter
Subsegments:
1) By Board-To-Board Interconnects: Embedded Optical Modules; Optical Engine Connectors; Silicon Photonics Interposers; Optical Waveguide Assemblies; Fiber Array Interfaces2) By Rack-To-Rack Interconnects: Optical Transceiver Modules; Active Optical Cables; Co-Packaged Optics; Pluggable Optical Modules; High-Density Fiber Connectors
Companies Mentioned: Cisco Systems Inc.; Intel Corporation; Broadcom Inc.; Mitsubishi Electric Corporation; Sumitomo Electric Industries Ltd.; NVIDIA Corporation; Fujitsu Limited; NEC Corporation; Corning Incorporated; Amphenol Corporation; Molex LLC; Marvell Technology Inc.; Ciena Corporation; Lumentum Holdings Inc.; Ayar Labs Incorporated; Huawei Technologies Co. Ltd.; Celestial AI Incorporated; Skorpios Technologies Incorporated; OpenLight Incorporated; Ranovus Incorporated.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Ultra-Short Reach Optical Interconnect market report include:- Cisco Systems Inc.
- Intel Corporation
- Broadcom Inc.
- Mitsubishi Electric Corporation
- Sumitomo Electric Industries Ltd.
- NVIDIA Corporation
- Fujitsu Limited
- NEC Corporation
- Corning Incorporated
- Amphenol Corporation
- Molex LLC
- Marvell Technology Inc.
- Ciena Corporation
- Lumentum Holdings Inc.
- Ayar Labs Incorporated
- Huawei Technologies Co. Ltd.
- Celestial AI Incorporated
- Skorpios Technologies Incorporated
- OpenLight Incorporated
- Ranovus Incorporated.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 2.45 Billion |
| Forecasted Market Value ( USD | $ 4.86 Billion |
| Compound Annual Growth Rate | 18.7% |
| Regions Covered | Global |
| No. of Companies Mentioned | 21 |


