The Global Market for Active, Passive and Solid-State Cooling 2026-2036

1.1 Market Overview
1.1.1 The global cooling market landscape - total addressable market and segmentation
1.1.2 Key materials and technologies in passive cooling
1.1.3 Global solid-state cooling market size and growth projections 2025-2046
1.1.4 Emerging technologies cooling market opportunity assessment - addressable market by technology, TRL, and time to commercialization
1.2 Market Drivers
1.2.1 Electrification and energy efficiency mandates - regulatory frameworks (EU Energy Efficiency Directive, US DOE standards, China GB standards)
1.2.2 Global warming and climate change - rising cooling degree days, HFC phase-down (Kigali Amendment), urban heat island intensity projections
1.2.3 AI data centers and high-performance computing - power density escalation (from 10 kW to >100 kW per rack), liquid cooling adoption curves
1.2.4 Electric vehicles and zero-emission transportation - battery thermal management requirements, power electronics heat flux trends, cabin comfort without waste heat
1.2.5 6G communications infrastructure - THz-frequency thermal challenges, base station power densities, massive MIMO heat loads
1.2.6 Quantum computing growth - qubit scaling roadmaps, cryogenic infrastructure per system, He-3 supply constraints
1.3 Emerging Materials Overview
1.3.1 Types and formats of emerging carbon materials for thermal cooling (graphene sheets, graphene foams, CNT arrays, buckypapers, fullerenes, nanodiamonds)
1.3.2 Types and formats of emerging inorganic compounds (MOFs, molecular solids, silicon carbide, boron carbide, boron nitride)
1.3.3 Emerging polymer and hybrid materials (benzocyclobutene, Schiff bases, polyimide composites)
1.4 Passive Versus Active Cooling
1.4.1 Definitions, operating principles and energy requirements
1.4.2 Comparative performance: cost per watt of cooling, reliability, noise, scalability
1.4.3 Cooling people versus cooling things - different thermal comfort targets
1.4.4 The cooling toolkit: when to use passive, active, or hybrid approaches
1.5 Technology Landscape
1.5.1 Established versus emerging solid-state cooling technologies - physical principle, TRL, efficiency vs. Carnot, temperature range, commercial status
1.5.2 Cooling toolkit and potential winners - application suitability mapping (current, 2030, 2036)
1.5.3 Technology readiness levels and commercialization timelines across all segments
1.5.4 LED-based thermophotonic cooling performance benchmarks and advantages
1.5.5 Quantum cryogenic cooling requirements and market applications
1.6 Applications Roadmap 2025-2046
1.6.1 Near-term applications (2025-2030) - thermoelectric dominance, early magnetocaloric pilot products
1.6.2 Medium-term applications (2030-2036) - caloric technology commercialization, 6G infrastructure deployment
1.6.3 Long-term applications (2036-2046) - phononic and advanced thermionic potential, solid-state HVAC replacement
1.7 Primary Conclusions
1.7.1 Winning materials and principles for solid-state cooling
1.7.2 Potential for replacing vapor compression cooling - timeline, barriers, market conditions
1.7.3 Potential for cooling solar panels, 6G infrastructure, and self-cooling lasers
1.7.4 Market growth
1.7.5 Technology diversification
1.8 Market Forecasts 2025-2046
1.8.1 Passive vs. active cooling market
1.8.2 Cooling module global market
1.8.3 Air conditioner, refrigerator and freezer value markets ($ billion)
1.8.4 Thermoelectric value market: materials, modules, host equipment ($ billion)
1.8.5 Caloric cooling market: materials, modules, host equipment
1.8.6 Cryogenic equipment market - TAM, SAM, SOM by component category
1.8.7 6G communications thermal materials market
1.8.8 Smartphone thermal materials market
1.9 Technology Roadmaps
1.9.1 Passive cooling roadmap by market and by technology
1.9.2 Active cooling and thermal management roadmap
1.9.3 Solid-state cooling roadmap 2025-2046

2.1 Principles Employed for Cooling or Prevention of Heating
2.1.1 Conduction - heat sinks (metal fins/plates), heat pipes (copper/aluminum tubes with internal liquid), diamond coatings (high thermal conductivity spreading)
2.1.2 Convection - forced air movement (fans), liquid-cooled heat exchangers
2.1.3 Radiation - reflective coatings (solar reflection), radiative cooling paints (IR emission to sky)
2.1.4 Evaporation - water spray cooling, wicking fabrics (evaporative moisture removal)
2.1.5 Insulation - wool/mineral fibers (trapped air pockets), aerogels/foams (high porosity, inhibits convection/conduction)
2.1.6 Phase change - PCMs (latent heat absorption during transition), vapor compression (liquid-vapor transition heat removal)
2.2 Thermal Interface Materials (TIMs)
2.2.1 What are TIMs
2.2.2 Types of TIMs - classification by form factor (greases, pads, gap fillers, adhesives, metal-based)
2.2.3 Thermal conductivity - values by TIM type, comparison with air, ranking of filler materials
2.2.4 Comparative properties of TIMs - thermal resistance, bondline thickness, conformability, reworkability
2.2.5 Advantages and disadvantages of TIMs, by type - detailed assessment of greases, pads, gap fillers, adhesives, metal TIMs
2.2.6 TIM materials by thermal, mechanical, and application properties
2.2.7 Thermal greases and pastes - silicone-based vs. non-silicone, dispensing methods, pump-out and dry-out failure modes, key suppliers
2.2.8 Thermal gap pads - compressible conformable pads, thickness tolerance, low-stress mounting, key suppliers
2.2.9 Thermal gap fillers - dispensable two-part materials, automated application for high-volume manufacturing
2.2.10 Thermal adhesives and potting compounds - structural bonding heat transfer, thermally conductive epoxies, urethanes, silicones
2.2.11 Metal-based TIMs
2.2.11.1 Solders and low melting temperature alloy TIMs
2.2.11.2 Liquid metals
2.2.11.3 Solid-liquid hybrid (SLH) metals
2.2.11.4 Hybrid liquid metal pastes
2.2.11.5 SLH created during chip assembly (m2TIMs)
2.2.12 TIM fillers: trends, thermal conductivity, alumina, boron nitride, diamond
2.2.13 TIM chemistry and emerging formulations
2.2.14 Prices and supply chain - pricing by TIM type ($/kg and $/unit), value chain from raw material to OEM
2.3 Phase Change Materials (PCMs)
2.3.1 Key properties - latent heat capacity, melting temperature, thermal conductivity in solid/liquid phases, cycling stability, supercooling behavior
2.3.2 Phase change cooling modes - sensible heat, latent heat, solid-solid transitions
2.3.3 Organic PCMs
2.3.3.1 Paraffin wax - n-alkane chain length vs. melting point, commercial availability, fire retardancy
2.3.3.2 Non-paraffin organic PCMs - fatty acids, esters, alcohols, glycols, polyethylene glycol
2.3.4 Bio-based PCMs
2.3.5 Inorganic PCMs
2.3.5.1 Salt hydrates
2.3.5.2 Metal and metal alloy PCMs
2.3.6 Eutectic PCMs
2.3.7 Encapsulation of PCMs
2.3.7.1 Macroencapsulation
2.3.7.2 Microencapsulation and nanoencapsulation
2.3.7.3 Shape-stabilized PCMs
2.3.7.4 Self-assembly encapsulation techniques
2.3.8 Nanomaterial-enhanced phase change materials
2.4 Carbon Materials
2.4.1 Comparison of silicone vs. carbon-based polymers for passive cooling
2.4.2 Graphene
2.4.2.1 Properties
2.4.2.2 Graphene as TIM fillers
2.4.2.3 Graphene foam and aerogel
2.4.2.4 Graphene films and laminates
2.4.3 Carbon nanotubes (CNTs)
2.4.3.1 Properties
2.4.3.2 CNT arrays
2.4.3.3 CNT buckypapers and composites
2.4.4 Fullerenes
2.4.5 Nanodiamond
2.4.5.1 Properties
2.4.5.2 Nanodiamond thermal paste
2.5 Metal Organic Frameworks (MOFs)
2.5.1 Structure and tuneable porosity
2.5.2 Water adsorption/desorption for evaporative cooling
2.5.3 MOF-based solid-state air conditioning (Transaera approach)
2.6 Heat Pipes
2.6.1 Technology description and operation
2.6.2 Loop heat pipes - operating principle, long-distance heat transport, commercial examples (Fujitsu loop heat pipe)
2.6.3 Vapor chambers
2.6.4 Flat plate heat pipes and derivatives
2.6.5 Emerging heat pipe designs
2.6.5.1 Bi-porous wick heat pipes
2.6.5.2 Graphene-enhanced heat pipes
2.6.5.3 Microscale heat pipes for chip cooling
2.7 Radiative Cooling
2.7.1 Heat sinks
2.7.1.1 Conventional convective heat sinks
2.7.1.2 Advanced heat sinks
2.7.1.3 PCM-enhanced latent heat sinks
2.7.2 Traditional radiative cooling
2.7.3 Radiative cooling of buildings
2.7.4 Passive Daytime Radiative Cooling (PDRC)
2.7.4.1 Overview and physical mechanism
2.7.4.2 New materials innovations
2.7.4.3 Achieving commercialization requirements
2.7.5 Anti-Stokes fluorescence cooling
2.8 Hydrogels
2.8.1 Structure
2.8.2 Classification - by polymer source (natural, synthetic, hybrid), by crosslink type, by responsive stimulus (temperature, pH, electric field, light)
2.8.3 Common formulations and benefits
2.8.4 Hydrogels for cooling systems
2.8.4.1 Evaporative cooling hydrogels
2.8.4.2 Hydroceramic hydrogel cooling architectural structures
2.8.4.3 Cooling solar panels and gathering water
2.8.4.4 Cooling electronics, power electronics, and data centers
2.8.4.5 Moisture thermal battery for future CPU, antennas, power transistors, 6G base stations
2.8.4.6 Smart windows and self-cooling actuators
2.8.4.7 Aerogel and hydrogel
2.9 Passive Cooling Paints and Coatings
2.9.1 Super-white radiative cooling paints
2.9.2 Metamaterial-enhanced cooling coatings
2.9.3 Self-cleaning and durable outdoor formulations
2.9.4 Application markets - buildings, vehicles, industrial tanks, data center roofs
2.10 Aerogels
2.10.1 Silica aerogels
2.10.1.1 Properties
2.10.2 Chemical precursors
2.10.2.1 Product forms - monoliths, powder, granules, blankets/composites
2.10.3 SWOT analysis for aerogel products

3.1 Metamaterial and Metasurface Fundamentals
3.1.1 Definition, types, and engineered properties
3.1.2 Optical metamaterials
3.1.2.1 Photonic metamaterials
3.1.2.2 Tunable optical metamaterials - phase-change (VO2, GST), electro-optic, thermo-optic tuning
3.1.2.3 Frequency selective surfaces (FSS)
3.1.2.4 Plasmonic metamaterials
3.1.2.5 Metamaterial cloaks and invisibility devices
3.1.2.6 Perfect absorbers and emitters
3.1.2.7 Metalenses
3.1.3 Electromagnetic metamaterials
3.1.4 Terahertz metamaterials
3.1.5 Acoustic metamaterials
3.1.6 Tunable, nonlinear, self-transforming, and topological metamaterials
3.1.6.1 Tunable metamaterials
3.1.6.2 Nonlinear metamaterials
3.1.6.3 Self-transforming metamaterials
3.1.6.4 Topological metamaterials
3.1.7 Materials used with metamaterials
3.2 Thermal Metamaterials
3.2.1 Overview
3.2.2 Types of thermal management metamaterials by function
3.2.3 Cooling films and optical solar reflection coatings
3.2.4 Thermal cloaks, camouflage, concentrators, diodes, expanders, rotators
3.2.5 Active, dynamic and tunable thermal metamaterials
3.2.6 Manufacturing technologies for thermal metamaterials
3.2.6.1 3D printing / additive manufacturing
3.2.6.2 Reel-to-reel processing
3.2.6.3 Nanoimprint lithography and other nanoscale patterning
3.3 Applications of Thermal Metamaterials
3.3.1 Greenhouses and windows
3.3.2 Microchip cooling
3.3.3 Photovoltaics cooling
3.3.4 Thermal packaging of electronics
3.3.5 Advanced cooling textiles
3.3.6 Vehicle cooling paint
3.3.7 Satellite thermal control
3.4 Passive Daytime Radiative Cooling (PDRC) Using Metamaterials
3.4.1 PDRC fundamentals
3.4.2 SWOT appraisal for metamaterial PDRC
3.4.3 Transparent PDRC for facades, solar panels and windows
3.4.4 Wearable PDRC meta-fabrics
3.4.5 Commercialization status - company-by-company assessment
3.5 Global Metamaterial Market Revenues
3.5.1 Global revenues for metamaterials, by type, 2020-2036
3.5.2 Global revenues for metamaterials, by market, 2020-2036

4.1 Advantages of Solid-State Cooling
4.1.1 No refrigerants
4.1.2 Compact form factor and scalability
4.1.3 Silent operation
4.1.4 Precise temperature control
4.1.5 Long operational lifetime
4.2 Thermoelectric (Peltier) Cooling
4.2.1 Operation and thermoelectric effects
4.2.2 Technology maturity and market penetration
4.2.3 Performance characteristics and limitations
4.2.4 Thermoelectric materials
4.2.4.1 Bismuth telluride (Bi2Te3)
4.2.4.2 Requirements and useful vs. misleading metrics
4.2.4.3 Quest for better zT performance
4.2.4.4 Alternatives to bismuth telluride
4.2.4.5 Non-toxic and less toxic thermoelectric materials
4.2.4.6 Ferron and spin-driven thermoelectrics
4.2.5 Wide area and flexible thermoelectric cooling
4.2.5.1 The need and general approaches
4.2.5.2 Advances in flexible and wide-area thermoelectric cooling
4.2.5.3 Examples of wide-area or flexible TEG research that may lead to similar TEC
4.2.6 Radiation cooling of buildings: multifunctional with thermoelectric harvesting
4.2.7 The heat removal problem of TEC and TEG
4.2.8 Emerging applications
4.2.9 Market size and forecast
4.3 Caloric Cooling by Ferroic Phase Change
4.3.1 Operating principles
4.3.2 Caloric compared to thermoelectric cooling
4.3.3 Electrocaloric cooling
4.3.3.1 Overview - electric field-induced temperature change in polar dielectrics
4.3.3.2 SWOT appraisal
4.3.3.3 Operating principles, device construction, successful materials and form factors
4.3.3.4 Electrocaloric material popularity in latest research
4.3.3.5 Giant electrocaloric effect
4.3.3.6 Issues to address
4.3.3.7 Current development stage and commercialization timeline
4.3.3.8 Market forecast
4.3.4 Magnetocaloric cooling
4.3.4.1 Technology principles - magnetocaloric effect in gadolinium and related alloys, magnetic entropy change, active magnetic regenerator (AMR) cycle
4.3.4.2 Development status
4.3.4.3 Commercial applications
4.3.4.4 Performance advantages
4.3.4.5 Challenges
4.3.4.6 Market forecast
4.3.5 Mechanocaloric cooling
4.3.5.1 Elastocaloric cooling
4.3.5.2 Market forecasts
4.3.6 Ionocaloric and electrochemical cooling
4.3.7 Multicaloric cooling advances
4.4 LED-Based Thermophotonic Cooling
4.4.1 Operating principle
4.4.2 Performance benchmarks
4.4.3 Temperature range capabilities
4.4.4 Challenges
4.4.5 Market forecast
4.5 Phononic Cooling Systems
4.5.1 Solid-state phonon manipulation principles
4.5.2 Technology approach and development status
4.5.3 Market positioning and commercial potential
4.5.4 SWOT analysis
4.6 Quantum Dot Cooling Technologies
4.6.1 Quantum confinement effects in cooling applications
4.6.2 Research developments and commercial prospects
4.6.3 Integration with quantum computing systems
4.7 Photonic Crystal Cooling
4.7.1 Technology principles and wavelength selectivity
4.7.2 Market readiness and manufacturing challenges
4.8 Advanced Thermionic Cooling
4.8.1 Introduction
4.8.2 Recent breakthroughs and commercialization timeline
4.8.3 High-temperature operation potential
4.9 Ionic Wind and Plasma Cooling
4.9.1 Corona discharge and electrohydrodynamic (EHD) wind generation
4.9.2 Advantages
4.10 Self-Adaptive, Switchable, Tuned, Janus and Anti-Stokes Solid-State Cooling
4.10.1 Self-adaptive systems
4.10.2 Janus materials
4.10.3 Anti-Stokes cooling of solids
4.11 Solid-State Heat Pumps and Engines
4.11.1 Technology convergence opportunities
4.11.2 Hybrid cooling system architectures
4.12 Comparative Technology Analysis

5.1 Quantum Cryogenic Cooling Technologies
5.1.1 Adiabatic Demagnetization Refrigeration (ADR)
5.1.1.1 Operating principle
5.1.1.2 Single-stage and continuous ADR (cADR) systems
5.1.1.3 Paramagnetic salt cooling media
5.1.1.4 Applications in quantum computing and sensing
5.1.2 Dilution refrigeration alternatives and He-3 free solutions
5.1.2.1 Conventional dilution refrigeration
5.1.2.2 Helium-3 free cooling solutions
5.1.2.3 Magnetic refrigeration for millikelvin temperatures
5.1.3 Quantum device operation requirements
5.2 Superconducting Cooling Technologies
5.2.1 Josephson junction cooling applications
5.2.2 Trapped-ion quantum computer cooling
5.2.3 Superconducting qubit thermal management
5.3 Quantum Sensing and Communication Cooling
5.3.1 Single-photon detector cooling requirements
5.3.2 NV center and quantum sensor thermal management
5.3.2.1 Nitrogen-vacancy centers in diamond
5.3.2.2 Room temperature to cryogenic operation
5.3.3 Optical quantum device cooling challenges
5.4 Cryogenic Infrastructure and Scaling Challenges
5.4.1 Wiring and signal delivery
5.4.2 Multi-stage temperature environment requirements
5.4.3 Electromagnetic performance specifications for cryogenic systems
5.4.4 Channel density scaling
5.4.5 Qubit scaling roadmap impact on component requirements
5.5 Cryogenic Component Market Analysis
5.5.1 TAM, SAM, SOM analysis
5.5.2 Market maturity assessment
5.5.3 Highest demand products
5.5.4 Most valued performance characteristics
5.5.5 Patent landscape and IP analysis
5.5.6 Pricing landscape

6.1 Advanced Semiconductor Packaging Overview
6.1.1 Evolution of semiconductor packaging
6.1.2 Thermal design power (TDP) trends for HPC chips
6.1.3 2.5D and 3D packaging in GPUs and AI accelerators
6.1.3.1 2.5D packaging architectures
6.1.3.2 3D IC integration -
6.1.4 Power delivery challenges
6.2 Thermal Management of High-Power Advanced Packages
6.2.1 Die-attach technology
6.2.2 TIM1 and TIM1.5 in 3D semiconductor packaging
6.2.2.1 TIM1 materials and requirements
6.2.2.2 TIM1.5 for 3D stacking
6.2.3 Diamond as substrate material
6.2.4 Liquid cooling technologies for HPC
6.2.4.1 Cold plate liquid cooling
6.2.4.2 Immersion cooling
6.2.4.3 Spray and jet impingement cooling
6.2.5 Hybrid cooling systems (air liquid)
6.3 Emerging Thermal Technologies for Semiconductor Packaging
6.3.1 Carbon nanotube thermal interface materials
6.3.2 Graphene solutions
6.3.2.1 Manufacturing methods for graphene TIMs - CVD growth, liquid exfoliation, reduction of graphene oxide
6.3.2.2 Graphene-polymer composites for TIM applications
6.3.2.3 Vertical graphene structures and graphene heat spreaders
6.3.3 Aerogel-based thermal solutions
6.3.4 Metamaterial heat spreaders
6.3.5 Bio-inspired thermal management approaches
6.4 Thermal Modelling and Simulation
6.4.1 Multi-physics simulation requirements
6.4.2 AI-enhanced thermal design optimization
6.4.3 Real-time thermal monitoring integration
6.5 Cooling Systems for Data Centers
6.5.1 Liquid cooling and immersion cooling
6.5.2 Chip-level cooling approaches
6.5.3 Thermoelectric cooling integration
6.5.4 Heat recovery and reuse systems
6.6 Market Forecasts for Semiconductor Thermal Management

7.1 TIM Market by End-Use
7.1.1 Consumer electronics
7.1.1.1 Smartphones and tablets - graphitic heat spreaders, vapor chambers, advanced TIMs, PCMs, liquid cooling, graphene-based solutions
7.1.1.2 Laptops and notebooks - heat pipe fan systems, TIM degradation over lifetime, high-performance gaming thermal solutions
7.1.1.3 Wearables - ultra-thin TIMs, biocompatibility requirements, miniaturized thermal management
7.1.1.4 Gaming consoles and peripherals - high sustained heat loads, enthusiast-grade thermal paste market
7.1.2 Electric vehicles
7.1.2.1 Battery thermal management - cell-to-cell TIMs, gap fillers for battery modules, thermal runaway propagation prevention
7.1.2.2 Power electronics - SiC/GaN MOSFET thermal management, inverter and converter cooling, wide-bandgap semiconductor TIM requirements
7.1.2.3 Charging stations - high-power cable cooling, connector thermal management
7.1.2.4 ADAS sensors - LiDAR, radar, camera thermal management in extreme environmental conditions
7.1.2.5 Antenna and antenna-in-package thermal management
7.1.2.6 Base band units
7.1.2.7 Small cell and macro base station cooling
7.1.3 Data centers
7.1.3.1 Servers - CPU/GPU thermal management, high TDP chip requirements, TIM selection for liquid cooling vs. air cooling
7.1.3.2 Switches and networking - ASIC thermal management, mid-range TIM requirements
7.1.3.3 Power supply units - capacitor and inductor cooling, potting compounds
7.1.3.4 Novel TIM technologies in data centers - liquid metal server-grade TIMs, phase-change metallic TIMs, CNT-based TIMs
7.1.4 Aerospace and defense - radiation-hardened TIMs, outgassing requirements (NASA/ESA standards), extreme temperature cycling, vacuum stability
7.1.5 Industrial electronics
7.1.6 Renewable energy and energy storage systems
7.1.7 Medical electronics
7.2 PCM Market Segments
7.2.1 PCMs in building and construction
7.2.2 PCMs in personal comfort
7.2.3 PCMs in cold chain logistics
7.2.4 PCMs in refrigeration systems
7.3 Global TIM Market Forecasts 2022-2036 by Type

8.1 Cooling Problems as Emerging Opportunities 2025-2046
8.2 Active Cooling Reinvented
8.2.1 Air conditioner alternatives
8.2.2 Powered windows and facades
8.2.2.1 Electrochromic smart windows
8.2.2.2 Switchable optofluidic windows
8.2.3 Fan cooling reinvented
8.2.3.1 Frore AirJet
8.2.3.2 xMEMS µCooling fan-on-a-chip
8.2.3.3 Smartphone cooling fans and accessories
8.2.3.4 Subway and public transport cooling innovations
8.3 Active Cooling for Large Batteries and Energy Storage
8.3.1 Battery thermal management opportunities
8.3.2 CAES thermal management
8.3.3 LAES thermal management
8.3.4 CO2 energy storage
8.4 Multi-Mode and Multipurpose Integrated Cooling
8.4.1 ICER passive cooling
8.4.2 Smart windows
8.4.3 Cooling paints and super-white paint
8.4.4 Integration of thermal materials in electronics

9.1 6G Thermal Management Challenges
9.1.1 Phase One (incremental) and Phase Two (disruptive) 6G
9.1.2 Severe new microchip cooling requirements
9.1.3 Cooling 6G smartphones
9.1.4 Cooling 6G base stations
9.1.5 Cooling 6G infrastructure
9.2 PDRC for 6G Infrastructure
9.2.1 Application to outdoor base stations and small cells
9.2.2 Integration with antenna radomes
9.2.3 Building-integrated 6G antenna cooling
9.3 Phase Change and Caloric Cooling for 6G
9.3.1 PCM thermal buffering for burst-mode 6G transmission
9.3.2 Electrocaloric micro-coolers for 6G RF front-ends
9.3.3 Magnetocaloric systems for base station cabinets
9.4 Thermoelectric Cooling and Harvesting for 6G
9.4.1 Peltier hot spot cooling for 6G mmWave/sub-THz power amplifiers
9.4.2 Thermoelectric energy harvesting from 6G base station waste heat
9.4.3 Combined thermoelectric cooling-harvesting architectures
9.5 Evaporative, Heat Pipe and Hydrogel Cooling for 6G
9.5.1 Vapor chambers for 6G smartphones
9.5.2 Loop heat pipes for base station power amplifiers
9.5.3 Hydrogel moisture thermal battery
9.5.4 Aerogel hydrogel combined cooling approaches
9.6 TIMs and Conductive Cooling for 6G
9.6.1 Next-generation TIMs for 6G AiP (antenna-in-package)
9.6.2 Graphene and CNT TIMs for 6G chip packages
9.6.3 Liquid metal TIMs for 6G power amplifiers
9.7 Advanced Heat Shielding, Thermal Insulation and Ionogels for 6G
9.7.1 EMI-compatible thermal shielding
9.7.2 Ionogels
9.7.3 Aerogel thermal insulation for protecting temperature-sensitive 6G components
9.8 Thermal Metamaterials for 6G
9.8.1 Metamaterial thermal management for antenna arrays
9.8.2 Thermal cloaking for co-located 6G components
9.8.3 PDRC meta-coatings for 6G outdoor equipment

10.1 Total Advanced Cooling Market Overview
10.1.1 Combined global market sizing - all cooling types aggregated, 2025-2046
10.1.2 Market segmentation framework - passive, active, solid-state, cryogenic, metamaterial
10.1.3 Historical growth and inflection points (2018-2024)
10.1.4 Growth projections and market dynamics (5, 10, and 20-year outlooks)
10.2 Passive Cooling Materials Market
10.2.1 Overall passive cooling materials market - by material type (TIMs, PCMs, carbon materials, heat pipes/vapor chambers, aerogels, radiative cooling materials, hydrogels, cooling paints/coatings)
10.2.2 Passive cooling market by end-use sector (consumer electronics, EV/automotive, 5G/6G telecom, data centers, aerospace & defense, industrial, renewable energy, medical, building & construction)
10.2.3 Passive cooling market by region
10.3 Thermal Interface Materials Market
10.3.1 Global TIM market by type (thermal greases/pastes, gap pads, gap fillers, adhesives/potting, metal-based TIMs, phase-change TIMs, CNT/graphene TIMs)
10.3.2 Global TIM market by end-use (consumer electronics, EVs, 5G/6G, data centers, aerospace & defense, renewable energy, medical, industrial)
10.3.3 TIM pricing trends and competitive dynamics
10.4 Phase Change Materials Market
10.4.1 PCM market by type (organic, inorganic, bio-based, eutectic, encapsulated)
10.4.2 PCM market by application (building & construction, cold chain/packaging, electronics thermal buffering, personal comfort, refrigeration, energy storage)
10.5 Heat Pipe and Vapor Chamber Market
10.5.1 Market by product type (cylindrical heat pipes, flat/loop heat pipes, vapor chambers, emerging microscale designs)
10.5.2 Market by application (smartphones/tablets, laptops, data center servers, 5G/6G base stations, EV power electronics)
10.6 Radiative Cooling and PDRC Market
10.6.1 PDRC market by product type (metamaterial films, polymer films, cooling paints, photonic glass)
10.6.2 PDRC market by application (buildings/rooftops, solar panels, industrial, vehicles, textiles, 6G infrastructure)
10.7 Carbon Materials for Thermal Management Market
10.7.1 Market by material type (graphene films/sheets, graphene composites, CNTs, nanodiamond, graphite heat spreaders)
10.7.2 Market by application (smartphone heat spreaders, TIM fillers, heat sinks, battery thermal management)
10.8 Metamaterials for Thermal Management Market
10.8.1 Overall metamaterial market by type, 2020-2036
10.8.2 Thermal metamaterial-specific market - thermal cloaks, cooling films, PDRC metamaterials, electronic packaging metamaterials
10.8.3 Metamaterial market by end-use sector (communications, automotive, aerospace & defense, coatings/films, photovoltaics, medical, construction)
10.9 Solid-State Cooling Market
10.9.1 Overall market segmentation and sizing
10.9.2 Market by technology segment
10.9.3 Technology segment breakdown and market share
10.9.4 Solid-state cooling market by end-user
10.9.5 Regional market analysis
10.9.6 Key market drivers for solid-state cooling
10.10 Thermoelectric Market
10.10.1 Thermoelectric modules market - by module type (standard, micro, high-temperature, multi-stage)
10.10.2 Thermoelectric materials market - bismuth telluride, skutterudites, half-Heusler, others
10.10.3 Thermoelectric host equipment market - coolers, generators, temperature controllers
10.10.4 Market forecast
10.11 Caloric Cooling Market
10.11.1 Magnetocaloric market
10.11.2 Electrocaloric market
10.11.3 Elastocaloric market
10.11.4 LED/thermophotonic market
10.11.5 Other emerging (barocaloric, phononic, thermionic)
10.12 Quantum Computing Cryogenic Cooling Market
10.12.1 Total addressable market
10.12.2 Market by component category - quantum computing systems, dilution refrigerators, cryogenic components (cables, attenuators, filters), support & service
10.12.3 Dilution refrigerator market
10.12.4 Cryogenic components market
10.12.5 Market by quantum computing modality
10.13 Semiconductor Packaging Thermal Management Market
10.13.1 TIM1 and TIM1.5 market by type - indium, liquid metal, sintered silver, polymer composite, CNT, graphene
10.13.2 TIM1 and TIM1.5 revenue forecast, 2026-2036
10.13.3 Advanced thermal materials for packaging - diamond substrates, metamaterial heat spreaders, aerogel isolation
10.13.4 Geographic market distribution
10.14 Data Center Cooling Market
10.14.1 Market by cooling technology
10.14.2 Market drivers
10.14.3 Liquid cooling market forecast
10.15 Electric Vehicle Thermal Management Market
10.15.1 Battery thermal management
10.15.2 Power electronics cooling
10.15.3 Cabin comfort
10.15.4 ADAS sensor thermal management
10.16 6G Communications Thermal Materials Market
10.16.1 Market by material/technology type - TIMs for 6G, vapor chambers, PDRC for infrastructure, thermoelectric cooling/harvesting, metamaterial thermal, hydrogel cooling
10.16.2 Market by application - smartphones, base stations/small cells, edge computing, backhaul/infrastructure
10.16.3 Phase One (incremental 6G) vs. Phase Two (disruptive 6G) market impact
10.17 Active Cooling and HVAC Alternatives Market
10.17.1 Air conditioner and refrigerator markets - conventional vs. solid-state alternatives
10.17.2 Smart window and powered facade market - electrochromic, optofluidic, thermochromic
10.17.3 MEMS and micro-fan cooling market - Frore AirJet, xMEMS, next-generation compact active cooling
10.17.4 Battery and energy storage thermal management - CAES, LAES, CO2 storage thermal systems
10.18 Application-Based Cross-Technology Analysis
10.18.1 Semiconductor sensor cooling
10.18.2 Scientific instrumentation
10.18.3 Medical devices and diagnostics
10.18.4 Defence and aerospace
10.18.5 Consumer electronics
10.18.6 Data center and IT cooling
10.18.7 Automotive thermal systems
10.18.8 Building and construction
10.18.9 Renewable energy (solar, wind, energy storage)
10.19 Technology Selection and Customer Needs Assessment
10.19.1 Performance requirements by application - cooling power, temperature precision, COP, size, weight, noise
10.19.2 Cost sensitivity and value drivers - price per watt of cooling by segment, total cost of ownership
10.19.3 Technology adoption criteria and decision factors
10.19.4 Passive vs. active cooling market split, 2025-2046

12.1 Research Methodology
12.1.1 Report scope and objectives
12.1.2 Markets and technologies covered
12.1.3 Research methodology
12.1.4 Definitions and terminology

Table 1. Key materials and technologies in passive cooling - material type, function, thermal conductivity, form factor, end-use examples
Table 2. Passive cooling market drivers - driver, impact level (high/medium/low), timeline, key affected segments
Table 3. Functions and materials format - function (heat absorption, heat dissipation, heat insulation, other), material, format examples
Table 4. Passive versus active cooling comparison - criterion (energy input, noise, complexity, maintenance, scalability, cost), passive rating, active rating
Table 5. Established vs. emerging solid-state cooling technologies - technology, physical principle, TRL (1-9), efficiency (% Carnot), temperature range (K), commercial status
Table 6. Application suitability mapping - application (chip hotspot, portable cooler, wine cooler, small HVAC, quantum computing, automotive), best technology current/2030/2036
Table 7. Technology readiness levels across all segments - technology, TRL, development stage, estimated commercial availability year
Table 8. LED-based thermophotonic cooling performance benchmarks - parameter (minimum temp demonstrated, cooling power density, efficiency, key advantage), value
Table 9. Quantum cryogenic cooling requirements - application (superconducting qubits, trapped ions, photonic QC, quantum sensors, astronomical detectors), temperature required, cooling power, stability, market size
Table 10. Global solid-state cooling market by technology segment, 2020-2036 ($ millions) - thermoelectric, magnetocaloric, electrocaloric, elastocaloric, LED/thermophotonic, quantum cryogenic, other emerging, total, with CAGR
Table 11. Cryogenic equipment TAM by category, 2024-2032 - quantum computing systems, dilution refrigerators, cryogenic components, support & service, total
Table 12. Thermal conductivities of common metallic, carbon, and ceramic fillers employed in TIMs - material (alumina, boron nitride, diamond, AlN, SiC, graphite, silver, copper), thermal conductivity (W/mK), particle form, cost range
Table 13. Commercial TIMs and their properties - product type, thermal conductivity range, thermal resistance, operating temperature range, typical applications
Table 14. Advantages and disadvantages of TIMs by type - type, advantages, disadvantages, best use case
Table 15. TIM materials by thermal, mechanical, and application properties - material, thermal conductivity, CTE, viscosity, hardness, target application
Table 16. Thermal interface materials prices - TIM type, price range (/kg),pricerange(/unit for standard sizes), major suppliers
Table 17. PCM types and properties - PCM category, melting range (°C), latent heat (kJ/kg), thermal conductivity (W/mK), density, cycling stability
Table 18. Advantages and disadvantages of paraffin wax PCMs
Table 19. Advantages and disadvantages of non-paraffins
Table 20. Advantages and disadvantages of bio-based PCMs
Table 21. Advantages and disadvantages of salt hydrates
Table 22. Advantages and disadvantages of low melting point metals
Table 23. Advantages and disadvantages of eutectics
Table 24. Comparison of silicone vs. carbon-based polymers for passive cooling - property (thermal conductivity, flexibility, cost, durability, temperature range), silicone performance, carbon-based performance
Table 25. Properties of graphene and competing materials - material (graphene, graphite, diamond, copper, aluminum), thermal conductivity, electrical conductivity, density, cost
Table 26. Properties of CNTs and comparable materials
Table 27. Properties of nanodiamonds - synthesis method, particle size, thermal conductivity, surface groups, cost
Table 28. Classification of hydrogels based on properties
Table 29. Common hydrogel formulations - polymer base, crosslinker, water content, key properties
Table 30. Benefits of hydrogels - benefit (tuneable properties, biocompatibility, stimulus-responsiveness, low cost, high water capacity), description
Table 31. Hydrogel panel applications - application, cooling mechanism, temperature reduction, key challenge
Table 32. Key properties of silica aerogels - property, typical range, comparison with conventional insulation
Table 33. Chemical precursors used to synthesize silica aerogels - precursor, process, product form, cost level
Table 34. Classification of metamaterials based on functionalities - electromagnetic, acoustic, mechanical, thermal, and overlapping domains
Table 35. Types of tunable optical metamaterials and tuning mechanisms - mechanism type, material, response time, tuning range, maturity
Table 36. Optical metamaterial applications - application, metamaterial type, key benefit, development stage
Table 37. Applications of radio frequency metamaterials - application, metamaterial design, frequency range, key benefit, companies
Table 38. Types of tunable terahertz metamaterials and tuning mechanisms
Table 39. Applications of acoustic metamaterials - sector (building, transportation, industrial, consumer electronics, healthcare, marine, energy), application, performance
Table 40. Markets and applications for tunable metamaterials - market, application, tuning mechanism, value proposition
Table 41. Types of self-transforming metamaterials and transformation mechanisms
Table 42. Key materials used with different types of metamaterials - metamaterial type, primary materials, fabrication method, cost implication
Table 43. Types of thermal management metamaterials by function - function type (thermal cloaking, concentrating, rotating, radiative cooling, directional transport), description, key mechanisms, example structures
Table 44. Passive vs. active metamaterials comparison - criterion (response speed, energy input, complexity, cost, durability, adaptability), passive, active
Table 45. Applications of thermal management metamaterials - application sector, metamaterial type, performance benefit, commercialization status
Table 46. PDRC radiative cooling technologies comparison - technology type (metamaterial PDRC, white paint, polymer films, photonic glass, hierarchical structures, nano-porous materials), cooling power (W/m²), solar reflectance, cost ($/m²), scalability, key advantages, limitations
Table 47. Global revenues for metamaterials, by type, 2020-2036 (millions USD)
Table 48. Global revenues for metamaterials, by market (acoustics, communications, automotive, aerospace & defence, coatings & films, photovoltaics, medical, other), 2020-2036 (millions USD)
Table 49. Caloric compared to thermoelectric cooling - criterion (efficiency, temperature range, compactness, reliability, refrigerant-free, cost, commercial status), thermoelectric, caloric
Table 50. Caloric effect comparison - effect (magnetocaloric, electrocaloric, barocaloric, elastocaloric), stimulus, typical ?T, example material, system complexity
Table 51. Engineering challenges by caloric type - challenge (actuation, material fatigue, system complexity, heat transfer), barocaloric, elastocaloric
Table 52. Cooling temperature range capabilities (sub-100K to 150K) - technology (LED, thermoelectric, magnetocaloric, electrocaloric), minimum temp, maximum temp, best operating range
Table 53. Solid-state cooling technology readiness levels - full comparison: technology, physical principle, TRL, efficiency (% Carnot), temperature range, power density (W/cm²), commercial status
Table 54. Quantum cooling requirements by application - application (superconducting qubits, trapped ions, photonic QC, quantum sensors, astronomical detectors), temperature required, cooling power, stability requirement, market size (2025)
Table 55. Multi-stage temperature environment requirements
Table 56. Electromagnetic performance specifications for cryogenic systems
Table 57. Quantum computing roadmap impact on component requirements - qubit count growth vs. cryogenic infrastructure demand
Table 58. Cryogenic market TAM by category, 2024-2032
Table 59. Performance comparison matrix - cryogenic interconnects by type, thermal conductivity, signal attenuation, frequency range, channel density, cost
Table 60. Evolution of semiconductor packaging - generation, interconnect type, pitch, thermal challenge level, key example products
Table 61. TDP trends for HPC chips to 2025 and beyond
Table 62. Comparison of 2.5D and 3D IC integration in HPC chips
Table 63. Overview of power management components for HPC chips
Table 64. Thermal interface material selection for TIM1 - material type (indium, liquid metal, sintered silver, polymer composite, CNT, graphene), thermal conductivity, bondline thickness, reliability, cost
Table 65. Diamond as substrate materials - type (natural, CVD polycrystalline, CVD single crystal), thermal conductivity, size availability, cost, application
Table 66. Cooling technologies for HPC - technology (air cooling, rear-door heat exchangers, direct liquid cooling, immersion cooling, spray cooling), cooling capacity, PUE impact, cost range, adoption status
Table 67. Carbon nanotube thermal interface materials
Table 68. Graphene-polymer composites for TIM applications - polymer matrix, graphene type, loading (wt%), thermal conductivity achieved, enhancement factor
Table 69. Metamaterial heat spreaders
Table 70. Comparison of liquid cooling technologies - technology, heat removal capacity, PUE, water usage, capital cost, operating cost, facility requirements
Table 71. Market share forecast of TIM1 and TIM1.5, by type, 2026-2036 (%)
Table 72. TIM1 and TIM1.5 revenues forecast by type, 2026-2036 ($ millions)
Table 73. Liquid cooling for data center forecast, 2025-2036 ($ millions)
Table 74. Advanced thermal materials market forecast, 2026-2036 ($ millions)
Table 75. Geographic market distribution, 2026-2036 - region (North America, Europe, Asia-Pacific, RoW), revenue, share
Table 76. Smartphone/tablet thermal solutions comparison - material/solution, description, advantages, challenges
Table 77. Global market in consumer electronics, 2022-2036, by TIM type (millions USD)
Table 78. Global market in EVs, 2022-2036, by TIM type (millions USD)
Table 79. Global market in 5G/6G, 2022-2036, by TIM type (millions USD)
Table 80. Global market in data centers, 2022-2036, by TIM type (millions USD)
Table 81. Space satellite thermal management subsystem requirements - subsystem (electronics, optical, power, propulsion, communication, attitude control, instruments, structure), operational temp range, survival temp range, primary cooling method, TIM requirements
Table 82. Global market in aerospace and defense, 2022-2036, by TIM type (millions USD)
Table 83. Global market in renewable energy, 2022-2036 (millions USD)
Table 84. Global market in medical electronics, 2022-2036 (millions USD)
Table 85. Market assessment for PCMs in building and construction - market age, applications, key benefits, market drivers, challenges
Table 86. Commercially available PCM cooling vest products - manufacturer, product name, PCM type, activation temperature, weight, duration, price range
Table 87. PCMs used in cold chain applications - temperature range, PCM type, application, key suppliers
Table 88. Market assessment for PCMs in packaging and cold chain logistics
Table 89. Global revenues for passive cooling materials, 2018-2034, by market (billion USD)
Table 90. Global revenues for passive cooling materials, 2018-2034, by materials (billion USD)
Table 91. Global revenues for passive cooling materials, 2018-2034, by region (billion USD)
Table 92. Geographic market analysis - region, market size, growth rate, key drivers
Table 93. Total advanced cooling market by category (passive, active, solid-state, cryogenic, metamaterial thermal), 2024-2046 ($ billions)
Table 94. Global revenues for passive cooling materials, 2018-2034, by material type ($ billions)
Table 95. Global revenues for passive cooling materials, 2018-2034, by end-use market ($ billions)
Table 96. Global revenues for passive cooling materials, 2018-2034, by region ($ billions)
Table 97. Global TIM market by type, 2022-2036 ($ millions)
Table 98. Global TIM market by end-use, 2022-2036 ($ millions)
Table 99. Global PCM market by type, 2024-2036 ($ millions)
Table 100. Market assessment for PCMs in building and construction
Table 101. Market assessment for PCMs in packaging and cold chain logistics
Table 102. Commercially available PCM cooling vest products
Table 103. Global heat pipe and vapor chamber market by product type, 2024-2036 ($ millions)
Table 104. Global PDRC market by product type, 2024-2036 ($ millions)
Table 105. PDRC radiative cooling technologies comparison - technology type, cooling power, solar reflectance, cost ($/m²), scalability
Table 106. Global carbon thermal materials market by type, 2024-2036 ($ millions)
Table 107. Global revenues for metamaterials, by type, 2020-2036 ($ millions)
Table 108. Global revenues for metamaterials, by market sector, 2020-2036 ($ millions)
Table 109. Global solid-state cooling market by technology segment, 2020-2036 ($ millions) - with CAGR
Table 110. Global solid-state cooling market by end-user segment, 2020-2036 ($ millions) - with CAGR
Table 111. Solid-state cooling regional market distribution, 2022-2036 ($ millions)
Table 112. Regional market drivers - region, primary driver, secondary drivers, key companies
Table 113. Key market drivers for solid-state cooling - driver, impact level, affected segments, timeline
Table 114. Thermoelectric value chain market - materials, modules, host equipment, 2024-2036 ($ millions)
Table 115. Caloric and emerging solid-state cooling market by technology, 2020-2036 ($ millions)
Table 116. Quantum cryogenic market TAM by category, 2024-2032 ($ millions)
Table 117. Cryogenic applications (sub-100K) market sizing - application, temperature range, technology, market size, growth rate
Table 118. Ultra-low temperature applications (100-150K) - application, temperature, technology, market size
Table 119. Quantum cooling requirements by application - temperature, cooling power, stability, market size
Table 120. Market share forecast of TIM1 and TIM1.5, by type, 2026-2036 (%)
Table 121. TIM1 and TIM1.5 revenues forecast by type, 2026-2036 ($ millions)
Table 122. Advanced thermal materials for semiconductor packaging market forecast, 2026-2036 ($ millions)
Table 123. Semiconductor thermal management geographic market distribution, 2026-2036
Table 124. Liquid cooling for data centers forecast, 2025-2036 ($ millions)
Table 125. Data center cooling market by technology type, 2024-2036 ($ millions)
Table 126. EV thermal management market by subsystem, 2024-2036 ($ millions)
Table 127. Solid-state cooling in automotive thermal systems - application, current technology, emerging technology, market size
Table 128. 6G communications thermal materials market by type, 2028-2046 ($ millions)
Table 129. 6G thermal materials market by application segment, 2028-2046 ($ millions)
Table 130. Air conditioner, refrigerator and freezer value markets, 2024-2046 ($ billions)
Table 131. Active cooling alternatives market by technology, 2024-2036 ($ millions)
Table 132. Moderate cooling applications (>150K) - application, temperature range, dominant technology, emerging alternative, market size
Table 133. Technology selection criteria comparison - criterion, weight, thermoelectric advantage, caloric advantage
Table 134. Passive vs. active cooling global market, 2025-2046 ($ billions)

Figure 1. SWOT analysis for the passive cooling market
Figure 2. Passive cooling applications roadmap 2025-2046
Figure 3. Global solid-state cooling market size by end-user market (2020-2036), millions USD
Figure 4. Global solid-state cooling market size by technology (2020-2036), millions USD
Figure 5. Regional market analysis - revenue by geography (North America, Europe, Asia-Pacific, RoW), millions USD, 2022-2036
Figure 6. SWOT analysis for silicone thermal conduction materials for passive cooling
Figure 7. Schematic of thermal interface materials used in a flip chip package - showing TIM1, TIM2 locations, die, heat spreader, heat sink
Figure 8. Surface of a commercial heatsink at progressively higher magnifications showing tool marks and need for TIM
Figure 9. Application of thermal silicone grease - dispensing method and bead pattern
Figure 10. Range of thermal grease products from leading manufacturers
Figure 11. Thermal pad - cross-section showing fiber-reinforced construction
Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
Figure 13. Thermal tapes and thermal adhesive products
Figure 14. Typical IC package construction identifying TIM1 and TIM2 locations
Figure 15. Liquid metal TIM product - gallium alloy dispensed between die and heat spreader
Figure 16. Pre-mixed SLH cross-section showing solid matrix with liquid metal inclusions
Figure 17. HLM paste and liquid metal before and after thermal cycling - showing interface stability
Figure 18. SLH with solid solder preform - assembly process illustration
Figure 19. Automated process for SLH with solid solder preforms and liquid metal
Figure 20. Supply chain for TIMs - raw material suppliers ? compound formulators ? TIM manufacturers ? system integrators ? end users
Figure 21. Classification of PCMs - organics (paraffins, non-paraffins, bio-based), inorganics (salt hydrates, metals), eutectics
Figure 22. Phase-change materials in their original states - photographs
Figure 23. SWOT analysis for phase change materials for passive cooling
Figure 24. Graphene layer structure schematic - single layer, few-layer, multilayer
Figure 25. Graphene and its descendants - graphite (stacked), nanotube (rolled), fullerene (wrapped)
Figure 26. Detonation nanodiamond - TEM image and particle morphology
Figure 27. SWOT analysis for carbon materials for passive cooling
Figure 28. SWOT analysis for Metal Organic Frameworks (MOFs) for passive cooling
Figure 29. Heat pipe operating principle - evaporator section, adiabatic section, condenser section
Figure 30. Fujitsu loop heat pipe - product photograph and schematic
Figure 31. Samsung Galaxy vapor chamber - internal structure and operation
Figure 32. Structure of hydrogel - schematic showing polymer network and water inclusion
Figure 33. SWOT analysis for monolith, powder, and granule aerogels
Figure 34. Radi-Cool metamaterial film - glass microspheres in polymer matrix
Figure 35. Schematic of dry-cooling technology using metamaterial films (PARC)
Figure 36. Thermal metamaterial and cooling roadmap 2025-2045
Figure 37. Global revenues for metamaterials, by type, 2020-2036 (line/bar chart)
Figure 38. Global revenues for metamaterials, by market, 2020-2036
Figure 39. Solid-state cooling value chain
Figure 40. Thermoelectric cooling operation - p-type/n-type semiconductor junctions, heat flow direction
Figure 41. Electrocaloric cooling SWOT analysis
Figure 42. Electrocaloric cooling cycle - schematic showing polarization, heat release, depolarization, cooling
Figure 43. Electrocaloric cooling development stage and commercialization timeline
Figure 44. Magnetocaloric effect - temperature change with field application/removal in gadolinium
Figure 45. Magnetocaloric cooling SWOT analysis
Figure 46. Phononic cooling SWOT analysis
Figure 47. Advanced thermionic cooling commercialization timeline
Figure 48. Application suitability mapping and temperature ranges - technologies vs. application sweet spots
Figure 49. Solid-state cooling technology roadmap 2025-2046 - maturation curves for all technologies
Figure 50. Pascal solid refrigerant prototype
Figure 51. Adiabatic Demagnetization Refrigeration (ADR) process - four-stage cycle diagram
Figure 52. Continuous ADR (cADR) system architecture - showing heat switches and multi-stage design
Figure 53. Evolution roadmap of semiconductor packaging - timeline from 2D through advanced 3D integration
Figure 54. 2.5D packaging structure
Figure 55. CoWoS development progress and roadmap
Figure 56. Schematic of thermal interface materials used in a flip chip package - showing TIM1, TIM1.5, TIM2 locations
Figure 57. Thermal conductive graphene film
Figure 58. Application of thermal interface materials in automobiles - diagram showing TIM locations (battery, inverter, onboard charger, ADAS modules)
Figure 59. EV battery components including TIMs - cross-section showing cell, gap pad, cold plate, adhesive
Figure 60. TIMs in base band unit (BBU) - locations of thermal interface materials in a typical BBU
Figure 61. Global revenues for passive cooling materials, 2018-2034, by market
Figure 62. Global revenues for passive cooling materials, 2018-2034, by materials
Figure 63. Global revenues for passive cooling materials, 2018-2034, by region
Figure 64. Total advanced cooling market by category, 2024-2046 - stacked area chart
Figure 65. Global revenues for passive cooling materials, 2018-2034, by material type
Figure 66. Global revenues for passive cooling materials, 2018-2034, by end-use market
Figure 67. Global revenues for passive cooling materials, 2018-2034, by region
Figure 68. Global revenues for metamaterials, by type, 2020-2036
Figure 69. Global revenues for metamaterials, by market sector, 2020-2036
Figure 70. Global solid-state cooling market size by technology (2020-2036), millions USD
Figure 71. Technology segment breakdown and market share - stacked area chart
Figure 72. Regional market analysis - revenue by geography, millions USD