The Global Market for Advanced Semiconductor Packaging 2027-2037

1.1 Semiconductor Packaging Technology Overview
1.1.1 Key challenges
1.1.2 Evolution of semiconductor packaging
1.1.2.1 From 1D to 3D
1.1.3 Conventional packaging approaches
1.1.4 Advanced packaging approaches
1.2 Semiconductor Supply Chain
1.3 Advanced Packaging Supply Chain
1.4 Key Technology Trends in Advanced Packaging
1.5 Market Growth Drivers
1.6 Competitive Landscape
1.7 Market Challenges
1.8 Future outlook
1.8.1 Heterogeneous Integration
1.8.2 Chiplets and Die Disaggregation
1.8.3 Advanced Interconnects
1.8.4 Scaling and Miniaturization
1.8.5 Thermal Management
1.8.6 Materials Innovation
1.8.7 Supply Chain Developments
1.8.8 Role of Simulation and Data Analytics

2.1 Transistor Device Scaling
2.1.1 Overview
2.1.2 Heterogeneous Architecture Transition
2.1.3 Co-Design Focus Areas
2.2 Wafer Level Packaging
2.3 Fan-Out Wafer Level Packaging
2.4 Chiplets
2.4.1 AMD EPYC and Ryzen processor families
2.4.2 Disaggregation Needs
2.5 Interconnection in Semiconductor Packaging
2.5.1 Overview
2.5.2 Wire Bonding
2.5.3 Flip-chip bonding
2.5.4 Interposer
2.5.4.1 Interposer technology comparison
2.5.4.2 Glass interposer
2.5.4.2.1 Technical challenge of glass interposer
2.5.4.2.2 Different Interposer material comparison
2.5.5 Through-silicon via (TSV) bonding
2.5.6 Hybrid bonding with chiplets
2.5.7 Re-architecting die-to-die I/O
2.6 2.5D and 3D Packaging
2.6.1 2.5D packaging
2.6.1.1 Overview
2.6.1.1.1 Silicon Interposer 2.5D
2.6.1.1.1.1 Through Si Via (TSV)
2.6.1.1.1.2 (SiO2) based redistribution layers (RDLs)
2.6.1.1.2 2.5D Organic-based packaging
2.6.1.1.2.1 Chip-first and chip-last fan-out packaging
2.6.1.1.2.2 Organic substrates
2.6.1.1.2.3 Organic RDL
2.6.1.1.3 2.5D glass-based packaging
2.6.1.1.3.1 Benefits
2.6.1.1.3.2 Glass Si interposers in advanced packaging
2.6.1.1.3.3 Glass material properties
2.6.1.1.3.4 2/2 µm line/space metal pitch on glass substrates
2.6.1.1.3.5 3D Glass Panel Embedding (GPE) packaging
2.6.1.1.3.6 Thermal management
2.6.1.1.3.7 Polymer dielectric films
2.6.1.1.3.8 Challenges
2.6.1.1.3.9 Comparison with other substrates
2.6.1.1.3.10 TGV formation and metallisation
2.6.1.1.4 2.5D vs. 3D Packaging
2.6.1.2 Benefits
2.6.1.3 Challenges
2.6.1.4 Trends
2.6.1.5 Market players
2.6.2 3D packaging
2.6.2.1 Conventional 3D packaging
2.6.2.2 Advanced 3D Packaging with through-silicon vias (TSVs)
2.6.2.3 W2W vs D2W vs Collective D2W
2.6.2.4 Direct Molecular Bonding
2.6.2.5 3D Interconnect Trends
2.6.2.6 Hybrid Bonding
2.6.2.6.1 Devices using hybrid bonding
2.6.2.6.2 Fusion Bond
2.6.2.6.3 Low- and room-temperature Cu-Cu bonding
2.6.2.6.4 Devices using hybrid bonding
2.6.2.7 3D stacking supply chain
2.6.2.8 3D Microbump technology
2.6.2.8.1 Technologies
2.6.2.8.2 Challenges
2.6.2.8.3 Bumpless copper-to-copper (Cu-Cu) hybrid bonding
2.6.2.9 Trends
2.6.2.9.1 Memory drives the next wave
2.6.2.9.2 Low- and room-temperature Cu-Cu bonding

3.1 Introduction
3.1.1 WLP to PLP
3.2 Benefits
3.3 Types of Wafer Level Packaging
3.3.1 Wafer Level Chip Scale Packaging
3.3.1.1 Overview
3.3.1.2 Advantages
3.3.1.3 Applications
3.3.2 Wafer Level Fan-Out Packaging
3.3.2.1 Overview
3.3.2.2 Advantages
3.3.2.3 Applications
3.3.3 Wafer Level Fan-In Packaging
3.3.3.1 Overview
3.3.3.2 Advantages
3.3.3.3 Applications
3.3.4 Other Types of WLP
3.3.4.1 Cu-Pillar Flip Chip
3.3.4.2 Advantages
3.3.4.2.1 Applications
3.3.4.3 Embedded Wafer Level BGA (eWLB)
3.3.4.4 Advantages
3.3.4.4.1 Applications
3.3.4.5 Chip-last FO-WLP
3.3.4.5.1 Advantages
3.3.4.5.2 Applications
3.3.4.6 Wafer-on-Wafer (WoW)
3.3.4.6.1 Applications
3.4 WLP Manufacturing Processes
3.4.1 Wafer Preparation
3.4.2 RDL Buildup
3.4.3 Bumping
3.4.4 Encapsulation
3.4.5 Integration
3.4.6 Test and Singulation
3.5 Wafer Level Packaging Trends
3.6 Applications of Wafer Level Packaging
3.6.1 Mobile and Consumer Electronics
3.6.2 Automotive Electronics
3.6.3 IoT and Industrial
3.6.4 High Performance Computing
3.6.5 Aerospace and Defense
3.7 Wafer Level Packaging Outlook

4.1 Introduction
4.2 Approaches for heterogenous integration
4.2.1 Technology Building Blocks
4.3 SiP Manufacturing Approaches
4.3.1 2.5D Integrated Interposers
4.3.2 Multi-Chip Modules
4.3.3 3D Stacked packages
4.3.4 Fan-Out Wafer Level Packaging
4.3.5 Flip Chip Package-on-Package
4.4 SiP Component Integration
4.5 Heterogeneous Integration Drivers
4.6 Trends Driving SiP Adoption
4.7 SiP Applications
4.8 SiP Industry Landscape
4.9 Future Outlook on Heterogeneous Integration
4.10 CPO (Co-Packaged Optics)
4.10.1 Co-packaging approaches
4.10.2 Heterogeneous integration of EIC and PIC
4.10.3 Interconnect Technology (in CPO)
4.10.4 Type of couplers
4.10.5 Advantages and limitations
4.10.6 CPO technologies, by company
4.11 IC Substrates

5.1 Overview
5.1.1 Transitioning from 2D Systems
5.1.2 Motivation for developing monolithic 3D manufacturing
5.1.3 Improved M3D Interconnect Density
5.1.4 Heterogenous 3D vs Monolithic 3D
5.1.5 2D Materials
5.2 Benefits
5.3 Challenges
5.4 Future outlook

6.1 Market value chain
6.1.1 SiP OEM/Designers
6.1.2 Chiplet OEM/Designer and Chiplet Foundry
6.1.3 Chiplet Integrator
6.1.3.1 Integrated Device Manufacturers (IDMs)
6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers
6.1.4 Material Suppliers
6.1.5 Equipment Suppliers
6.1.6 Substrate and PCB suppliers
6.1.7 EDA Tools Suppliers
6.1.8 Interposer Foundry
6.2 Packaging trends by market
6.2.1 Mobile Devices
6.2.2 High-Performance Computing (HPC)
6.2.3 Automotive
6.2.4 Internet of Things (IoT)
6.2.5 Consumer Electronics
6.2.6 Aerospace and Defense
6.2.7 Medical Devices
6.3 Design requirements
6.4 Artificial Intelligence (AI)
6.4.1 Challenges in AI
6.4.2 Advanced Packaging Solutions
6.4.2.1 2.5D and 3D Integration
6.4.2.2 Chiplet-based Packaging
6.4.2.3 Wafer-Level Packaging (WLP)
6.4.3 Addressing AI Challenges through Advanced Packaging
6.4.3.1 Processing Power
6.4.3.2 Memory Bandwidth
6.4.3.3 Energy Efficiency
6.4.3.4 Scalability
6.4.4 Applications
6.4.4.1 Data Center and Cloud Computing
6.4.4.2 Edge Devices and IoT
6.4.4.3 Healthcare and Medical Devices
6.4.4.4 Autonomous Vehicles
6.5 Mobile Devices
6.5.1 Challenges
6.5.2 Advanced Packaging Solutions
6.5.2.1 System-in-Package (SiP)
6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
6.5.2.3 3D IC Packaging
6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)
6.5.3 Addressing Challenges through Advanced Packaging
6.5.3.1 Power Consumption and Thermal Management
6.5.3.2 Size Constraints
6.5.3.3 Cost
6.5.4 Applications
6.5.4.1 Smartphones
6.5.4.2 Tablets
6.5.4.3 Wearables
6.5.4.4 AR/VR Devices
6.5.5 Future trends
6.6 High Performance Computing (HPC)
6.6.1 Challenges
6.6.2 Advanced Packaging Solutions for HPC
6.6.2.1 2.5D and 3D Integration
6.6.2.2 Hybrid bonding
6.6.2.3 Multi-Chip Modules (MCMs)
6.6.2.4 Chiplet-based Architectures
6.6.2.5 Advanced Interconnect Technologies
6.6.3 Addressing HPC Challenges through Advanced Packaging
6.6.3.1 Performance Scaling
6.6.3.2 Power Consumption
6.6.3.3 Interconnect Bandwidth
6.6.3.4 Reliability
6.6.4 Applications
6.6.4.1 Supercomputers
6.6.4.2 Data Center and Cloud Computing
6.6.4.3 Artificial Intelligence and Machine Learning
6.6.4.4 Scientific Computing and Simulation
6.6.4.5 Co-Packaged Optics
6.6.4.5.1 Network Switch
6.6.4.5.2 Optical communication in data centers
6.6.4.5.3 Thermal Management
6.6.4.5.4 Challenges in CPO
6.6.4.5.5 Package Structure
6.6.4.5.6 Fan-Out Embedded Bridge (FOEB) structure
6.6.4.5.7 Advancing Switching and AI Networks
6.6.4.5.8 Making on-chip photonics manufacturable
6.6.5 Thermal Interface Materials
6.6.6 Future Trends
6.7 Automotive Electronics
6.7.1 Challenges
6.7.2 Advanced Packaging Solutions for Automotive Electronics
6.7.2.1 System-in-Package (SiP)
6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)
6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)
6.7.3 Addressing Automotive Electronics Challenges through Advanced Packaging
6.7.3.1 ADAS/Autonomous driving systems
6.7.3.2 Harsh Environment Reliability
6.7.3.3 Safety and Reliability
6.7.3.4 Miniaturization and Integration
6.7.3.5 High-Speed Communication
6.7.3.6 Thermal Management
6.7.4 Applications
6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving
6.7.4.1.1 Radar packaging
6.7.4.2 Electric Vehicle (EV) Power Electronics
6.7.4.3 Infotainment and Telematics
6.7.4.4 Sensors and Actuators
6.7.5 Future Trends
6.8 Internet of Things (IoT) Devices
6.8.1 Challenges
6.8.2 Advanced Packaging Solutions for IoT Devices
6.8.2.1 Wafer-Level Packaging (WLP)
6.8.2.2 System-in-Package (SiP)
6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)
6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)
6.8.3 Addressing IoT Device Challenges through Advanced Packaging
6.8.3.1 Size Constraints
6.8.3.2 Power Consumption
6.8.3.3 Cost Pressures
6.8.3.4 Integration and Functionality
6.8.3.5 Reliability and Robustness
6.8.4 Applications
6.8.4.1 Wearable Devices
6.8.4.2 Smart Home Devices
6.8.4.3 Industrial IoT Devices
6.8.4.4 Medical IoT Devices
6.8.5 Future Trends
6.9 5G & 6G Communications Infrastructure
6.9.1 Challenges
6.9.2 Trends in 5G and 6G packaging
6.9.3 Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
6.9.3.1 Antenna-in-Package (AiP)
6.9.3.2 System-in-Package (SiP)
6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)
6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)
6.9.4 Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
6.9.4.1 High-Frequency Operation
6.9.4.2 Massive MIMO and Beamforming
6.9.4.3 Energy Efficiency
6.9.4.4 Cost and Scalability
6.9.4.5 Thermal Management
6.9.5 Applications
6.9.5.1 Base Stations and Small Cells
6.9.5.2 Backhaul and Fronthaul Networks
6.9.5.3 Edge Computing and Network Slicing
6.9.5.4 Satellite and Non-Terrestrial Networks
6.9.6 Future Trends
6.10 Aerospace and Defense Electronics
6.10.1 Challenges
6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics
6.10.2.1 3D Packaging and Through-Silicon Vias (TSVs)
6.10.2.2 Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)
6.10.2.3 Flip-Chip and Ball Grid Array (BGA) Packaging
6.10.2.4 Hermetic Packaging and Sealing
6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
6.10.3.1 Size, Weight, and Power (SWaP) Optimization
6.10.3.2 Harsh Environment Reliability
6.10.3.3 High Performance and Speed
6.10.3.4 Long-Term Reliability and Maintainability
6.10.3.5 Security and Anti-Tamper Features
6.10.4 Applications
6.10.4.1 Avionics and Flight Control Systems
6.10.4.2 Radar and Electronic Warfare Systems
6.10.4.3 Satellite Communications and Payload Electronics
6.10.4.4 Missile Guidance and Control Electronics
6.10.5 Future Trends
6.11 Medical Electronics
6.11.1 Challenges
6.11.2 Advanced Packaging Solutions for Medical Electronics
6.11.2.1 3D Packaging and Through-Silicon Vias (TSVs)
6.11.2.2 Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)
6.11.2.3 Flexible and Stretchable Packaging
6.11.2.4 Microfluidic Packaging
6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging
6.11.3.1 Miniaturization
6.11.3.2 Biocompatibility
6.11.3.3 Reliability
6.11.3.4 Power Efficiency
6.11.3.5 High Performance
6.11.4 Applications
6.11.4.1 Implantable Devices
6.11.4.2 Wearable Health Monitors
6.11.4.3 Diagnostic Imaging Equipment
6.11.4.4 Surgical Robotics and Instruments
6.11.5 Future Trends
6.12 Consumer Electronics
6.12.1 Challenges
6.12.2 Advanced Packaging Solutions for Consumer Electronics
6.12.2.1 System-in-Package (SiP)
6.12.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
6.12.2.3 3D Packaging and Through-Silicon Vias (TSVs)
6.12.2.4 Embedded Die Packaging
6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging
6.12.3.1 Miniaturization
6.12.3.2 Power Efficiency
6.12.3.3 High Performance
6.12.3.4 Cost Reduction
6.12.3.5 Time-to-Market
6.12.4 Applications
6.12.4.1 Smartphones and Tablets
6.12.4.2 Wearables and IoT Devices
6.12.4.3 Gaming Consoles and VR/AR Devices
6.12.4.4 Smart Home Devices
6.12.5 Future Trends
6.13 Additive manufacturing for advanced packaging
6.14 Silicon photonics

7.1 By type
7.2 By Units & Wafers
7.3 By end-use market
7.4 By region
7.5 3D SoC
7.6 3D Stacked memory
7.7 UHD FO / RDL Interposer
7.8 2.5D Interposers
7.9 Embedded Si bridge

8.1 Data center
8.2 AI and Graphics
8.3 CPU
8.4 Autonomous vehicles
8.5 Roadmap
8.5.1 Interconnect technology trend
8.5.2 By interconnect density and technology node
8.5.3 By reticle size
8.5.4 By front-end vs back-end
8.5.5 By 2.5D and 3D Technology Trends
8.5.6 By I/O density, I/O pitch and package size
8.6 Commercialized Products
8.6.1 3D Memory
8.6.2 GPU
8.6.2.1 Nvidia
8.6.2.2 AMD
8.6.2.3 Intel
8.6.3 AI ASICs
8.6.3.1 Intel
8.6.3.2 Google
8.6.3.3 Amazon
8.6.3.4 Microsoft
8.6.3.5 Huawei
8.6.3.6 Meta
8.6.4 CPU
8.6.4.1 AMD
8.6.4.2 Amazon
8.6.4.3 Intel
8.6.4.4 Nvidia
8.6.5 Networking and CPO switches
8.6.5.1 Nvidia Quantum-X and Spectrum-X Photonics
8.6.5.2 Broadcom Tomahawk CPO (Bailly / Davisson)

9.1 Integrated Device Manufacturers
9.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies
9.3 Foundries
9.4 Electronics OEMs
9.5 Packaging Equipment and Materials Companies

11.1 AaltoSemi
11.2 Absolic, Inc.
11.3 ACCRETECH (Europe) GmbH
11.4 Adeia, Inc.
11.5 Advanced Micro Devices, Inc. (AMD)
11.6 Ajinomoto
11.7 Analog Devices, Inc. (ADI)
11.8 Amkor Technology
11.9 Anmuquan Intelligent Technology (AMQ Intelligent)
11.10 Apple
11.11 Applied Materials
11.12 Ardentec Corporation
11.13 Arieca
11.14 ARM
11.15 ASE
11.16 ASMPT Ltd
11.17 Ayar Labs
11.18 Besi
11.19 Biren Technology
11.20 Blue Ocean Smart System
11.21 Brewer Science
11.22 Broadcom
11.23 BroadPak
11.24 Cadence Design Systems
11.25 Cambricon Technologies Co.
11.26 Capcon Semiconductor
11.27 CAS Microelectronics Integration
11.28 CD Micro-Technology
11.29 CEA-Leti
11.30 Cerebras
11.31 China Wafer Level CSP Co
11.32 Chipbond Technology Corporation
11.33 Chipletz
11.34 ChipMOS Technologies, Inc.
11.35 Coherent
11.36 Corning
11.37 Dai Nippon Printing (DNP)
11.38 Dewo Advanced Automation (DAA
11.39 Disco
11.40 Dupont
11.41 Ebara
11.42 Eliyan
11.43 EMC Semi-Conductor Technology
11.44 EPS Technology
11.45 Entegris
11.46 EV Group
11.47 GlobalFoundries
11.48 Global Unichip
11.49 Gloway
11.50 Goldenscope Tech
11.51 Gona Semiconductor Technology
11.52 Graphcore
11.53 Greatek Electronics Inc
11.54 Hangke Chuangxing (Aero Inno-Star)
11.55 Hanmi Semiconductor
11.56 HD Microsystems
11.57 HiSilicon
11.58 HLMC (Shanghai Huali Microelectronics Corporation)
11.59 Huatian Huichuang Technology (Xi'an) Co., Ltd.
11.60 Huawei
11.61 Ibiden
11.62 IBM
11.63 ICLeague Technology Co Ltd
11.64 IMEC
11.65 Indium Corporation
11.66 Infineon Technologies AG
11.67 Integra
11.68 Inari Amertron Berhad
11.69 Intel Corporation
11.70 JCET Group
11.71 Jiangsu IC Assembly & Test (ICAT)
11.72 Jingdu Semiconductor
11.73 Keyang Semiconductor (KYS)
11.74 King Yuan Electronics Co., Ltd.
11.75 Kioxia
11.76 KyLitho
11.77 Kyocera
11.78 Lam Research
11.79 Lapis Technology
11.80 LB Semicon Co Ltd
11.81 Leading Interconnect Semiconductor Technology
11.82 LG Innotek
11.83 Lidrotec GmbH
11.84 Lux Semiconductors
11.85 Malaysian Pacific Industries Berhad
11.86 Micron Technology, Inc.
11.87 Mediatek
11.88 Micross Components
11.89 Mitsubishi
11.90 National Center For Advanced Packaging China (NCAP China)
11.91 NEC
11.92 Nvidia Corporation
11.93 Nepes Corporation
11.94 Nippon Electric Glass (NEG)
11.95 Onsemi
11.96 Orient Semiconductor Electronics Ltd.
11.97 Panasonic
11.98 Plan Optik AG
11.99 Powertech Technology Inc.
11.100 Pragmatic Semiconductor
11.101 Qorvo
11.102 Renesas
11.103 Rigger Micro Technologies (RMT)
11.104 Rohm
11.105 Rong Semiconductor
11.106 Samsung Electronics
11.107 Samtec, Inc.
11.108 Schott AG
11.109 Sharp
11.110 Shinko Electric Industries
11.111 Showa Denko (Resonac)
11.112 Sigurd Microelectronics Corporation
11.113 Silicon Box
11.114 Siliconware Precision Industries (SPIL)
11.115 SJ Semiconductor
11.116 SK Hynix
11.117 Skywater
11.118 Sony Corporation
11.119 Starmask
11.120 STMicroelectronics
11.121 Suss Microtec
11.122 Synopsys
11.123 SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
11.124 Taiwan Semiconductor Manufacturing Company (TSMC)
11.125 Techsense International
11.126 Tezzaron Semiconductor
11.127 Tokyo Electron (TEL)
11.128 Tongfu Microelectronics Co., Ltd.
11.129 Toppan
11.130 Toray
11.131 Texas Instruments
11.132 Tokyo Electron
11.133 Tokyo Seimitsu Co., Ltd.
11.134 Tong Hsing Electronic Industries, Ltd.
11.135 Toshiba
11.136 Tower Semiconductor
11.137 Unimicron
11.138 Unisem
11.139 UTAC Group
11.140 Walton Advanced Engineering Inc.
11.141 Winstek Semiconductor Technology Co., Ltd.
11.142 Xinhe Semiconductor
11.143 Yibu Semiconductor
11.144 Yuehai Integrated

Table 1. Evolution of semiconductor packaging.
Table 2. Summary of key advanced semiconductor packaging approaches.
Table 3. Key Technology Trends in Advanced Semiconductor Packaging.
Table 4. Market Growth Drivers for advanced semiconductor packaging.
Table 5. Challenges Facing Advanced Packaging Adoption.
Table 6. Challenges in transistor scaling.
Table 7. Leading-edge logic node roadmap, 2026-2030.
Table 8. Use cases and benefits of using chiplets in semiconductor design.
Table 9. Specifications of interconnection methods.
Table 10. Interconnection technique in semiconductor packaging
Table 11. Passive vs active interposer.
Table 12. Interposer technology comparison
Table 13. Technical challenges of glass interposer
Table 14. Different Interposer material comparison
Table 15. Comparative benchmark overview table of key semiconductor interconnection technologies
Table 16. Die-to-die I/O approaches compared
Table 17. Fan-out packaging process overview.
Table 18. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.
Table 19. Benefits of glass in 2.5D glass-based packaging.
Table 20. Through-glass-via (TGV) formation methods compared.
Table 21. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.
Table 22. Challenges of glass semiconductor packaging.
Table 23. Comparison between silicon, organic laminates and glass as packaging substrates.
Table 24. Through-glass-via (TGV) formation methods compared (insert after Table 16)
Table 25. 2.5D vs. 3D packaging.
Table 26. 2.5D packaging challenges.
Table 27. Market players in 2.5D packaging.
Table 28. Glass substrate/packaging supplier landscape (2026).
Table 29. Advantages and disadvantages of 3D packaging.
Table 30. W2W vs D2W vs Collective D2W - Process and Comparison.
Table 31. 3D Stacking Trends - Direct Molecular Bonding Technologies.
Table 32. 3D interconnect trends
Table 33. Hybrid bonding Advantages and Challenges.
Table 34. Hybrid Bond Timeline for Chip Makers and Equipment Makers.
Table 35. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.
Table 36. Challenges in scaling bumps.
Table 37. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
Table 38. Micro bumps vs Cu-Cu bumpless hybrid bonding.
Table 39. Panel-level packaging format scaling.
Table 40. Benefits of Wafer-Level Packaging.
Table 41. Types of wafer level packaging.
Table 42. Key trends shaping wafer level packaging.
Table 43. Packaging approaches utilized for assembling System-in-Package modules.
Table 44. Considerations for integrating key component categories into system-in-package (SiP) modules/
Table 45. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.
Table 46. Key trends influencing adoption of System-in-Package modules.
Table 47. System-in-package (SiP) module applications.
Table 48. Co-packaging approaches
Table 49. Type of couplers
Table 50. CPO advantages and limitations
Table 51. Technologies offered by companies
Table 52. Comparison between heterogeneous 3D integration and monolithic 3D integration.
Table 53. Key 2D materials in monolithic 3D integrated circuits.
Table 54. Benefits of monolithic 3D ICs.
Table 55. Challenges of monolithic 3D ICs.
Table 56. Advanced semiconductor packaging trends by market.
Table 57. Design requirements in advanced packaging, by market.
Table 58. TIM candidate benchmark
Table 59. Wide-bandgap power semiconductors compared.
Table 60. Global market for Advanced semiconductor packaging, 2027-2037, by packaging type, (billions USD).
Table 61. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD).
Table 62. Global market for Advanced semiconductor packaging, 2027-2035, by end use market (billions USD).
Table 63. Global market for advanced semiconductor packaging, 2027-2037, by region (billions USD)
Table 64. 3D SoC market, 2027-2037 (billions USD)
Table 65. 3D stacked memory (HBM) packaging market, 2027-2037 (billions USD)
Table 66. UHD FO / RDL interposer market, 2027-2037 (billions USD)
Table 67. 2.5D interposer market, 2027-2037 (billions USD)
Table 68. Large-format 2.5D / CoWoS roadmap.
Table 69. Embedded Si bridge market, 2027-2037 (billions USD)
Table 70. Interconnect technology trend
Table 71. Roadmap By interconnect density and technology node
Table 72. Roadmap By reticle size
Table 73. Roadmap front-end vs back-end
Table 74. Roadmap By 2.5D and 3D Technology Trends
Table 75. Roadmap By I/O density, I/O pitch and package size
Table 76. Main Global Wafer Foundry Companies 2023.
Table 77. Market challenges for advanced semiconductor packaging.
Table 78. AMD AI chip range.
Table 79. Intel's products that adopt 3D FOVEROS.

Figure 1. Timeline of different packaging technologies.
Figure 2. Evolution roadmap for semiconductor packaging.
Figure 3. Semiconductor Supply Chain.
Figure 4. Advanced packaging supply chain.
Figure 5. Scaling technology roadmap.
Figure 6. Wafer-level chip scale packaging (WLCSP)
Figure 7. Embedded wafer-level ball grid array (eWLB).
Figure 8. Fan-out wafer-level packaging (FOWLP).
Figure 9. Chiplet design.
Figure 10. Chiplet SoC.
Figure 11. 2D chip packaging.
Figure 12. Typical structure of 2.5D IC package utilizing interposer.
Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow.
Figure 14. Manufacturing process for glass interposers.
Figure 15. 3D Glass Panel Embedding (GPE) package.
Figure 16. 3D stacking supply chain.
Figure 17. Typical FOWLP structure.
Figure 18. System-in-Package (SiP) for HI.
Figure 19. 2.5D chiplet integration.
Figure 20. Advanced packaging supply chain.
Figure 21. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving.
Figure 22. Absolic glass substrate.
Figure 23. AMD Radeon Instinct.
Figure 24. AMD Ryzen 7040.
Figure 25. Alveo V70.
Figure 26. Versal Adaptive SOC.
Figure 27. AMD’s MI300 chip.
Figure 28. 12-layer HBM3.