Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.
Table of Contents
1. Passive Thermal Management of a Hard Disk Drive for Edge AppliancesUmesh Madanan, Shabeeh Kattakkadan, Nahoosh Mandlik and Niranjan Pol
2. TBD
Kambiz Vafai
3. TBD
Baghat Sammakia
4. TBD
Satish Kandlikar
5. TBD
Timothy S. Fisher
6. TBD
Ali Shakouri
7. TBD
Ahmet Mete Muslu
8. TBD
Ravi Mahajan and Rajiv Mongia
9. TBD
Wangda Zuo
10. Datacenters and cost analysis
Hyunjun Oh
