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DRAM for PC and Laptop - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)

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    Report

  • 150 Pages
  • July 2026
  • Region: Global
  • Mordor Intelligence
  • ID: 6260640
The dRAM for PC and Laptop market size is projected to be USD 27.46 billion in 2025, USD 30.81 billion in 2026, and reach USD 51.28 billion by 2031, growing at a CAGR of 10.73% from 2026 to 2031. This report is Segmented by Architecture (DDR3, DDR4, DDR5, LPDDR4/4X, and LPDDR5/5X), Technology Node (19 Nm and Above, 18 Nm To 11 Nm, and Below 10 Nm EUV), Capacity (Up To 8 GB, 16 GB, 32 GB, and Above 32 GB), Form Factor (UDIMM, SODIMM, CAMM2 and LPCAMM2, and Soldered Onboard Memory), and Geography (North America, Asia-Pacific, and More). The Market Forecasts are Provided in Terms of Value (USD).

Global DRAM For PC and Laptop Market Trends and Insights

Rising DDR5 Default Spec In New PC And Laptop Platforms

The DRAM for PC and Laptop market is benefiting from a platform transition that is now embedded in new product roadmaps rather than left to buyer preference. New mainstream systems are increasingly entering the market with DDR5 as the standard memory path, leaving OEMs less room to preserve older DDR4-era designs in current launches. That change is lifting the value of the DRAM for PC and Laptop market because newer DDR5 configurations carry higher pricing and are tied to more advanced notebook and desktop builds. The transition also narrows the cost advantage of staying on legacy systems, as reduced new-platform investment in DDR4 is tightening supply for the older architecture at the same time. This creates a market condition where both legacy and next-generation memory types support value growth, even though the strategic center of the DRAM for PC and Laptop market has already shifted toward DDR5. The result is a more durable migration pattern that supports higher average selling prices across the forecast period.

AI PC Memory Bump In Mainstream Notebooks

The DRAM for PC and Laptop market is also being lifted by the hardware floor attached to AI-ready notebooks, especially in mainstream commercial and premium consumer systems. Microsoft’s Copilot+ PC framework requires at least 16 GB of RAM, raising the baseline memory requirement for devices designed for on-device AI workloads. This is important because the DRAM for PC and Laptop market is not only gaining from more systems shipping with 16 GB, but also from a rising need for higher bandwidth memory in thinner designs, where local inference is a selling point. Once users buy a notebook with soldered LPDDR memory, the capacity is fixed for the life of the device, which can shorten replacement timing if AI workloads outgrow the original memory choice. That dynamic is reinforcing demand for better-equipped systems at the point of purchase instead of leaving upgrades to the aftermarket. It also gives OEMs a strong reason to promote higher-memory configurations as a practical requirement rather than as an optional premium feature.

Persistent DRAM Price Volatility In Client Channels

Price volatility remains the clearest restraint on the DRAM for PC and Laptop market because OEMs cannot absorb higher memory costs evenly across all price bands. Rising client DRAM prices have already pushed some notebook vendors to return to 8 GB base configurations in the mid-range, even though that runs counter to the broader shift toward AI-ready systems. The tension is especially visible in the DRAM for PC and Laptop market because higher retail prices can slow replacement in entry and mid-tier segments, while lower base memory can weaken the practical value proposition of new devices. This creates an unusual split where premium notebooks continue to move up the memory curve, but mainstream systems can temporarily move backward on base capacity. The same volatility also encourages enterprise buyers to rethink procurement timing and inventory strategy. As long as price movement remains sharp, it will limit the speed at which demand translates into stable shipment growth.

Other drivers and restraints analyzed in the detailed report include:

  • Corporate Refresh Cycle Triggered By Windows End-Of-Support And Fleet Modernization
  • Notebook Thinness And Power Efficiency Favoring LPDDR And CAMM2 Adoption
  • Supply Allocation Bias Toward Servers And AI Accelerators

Segment Analysis

DDR5 held 50.82% of the DRAM for PC and Laptop market by value in 2025, which made it the leading architecture as new desktop and notebook platforms moved further into the DDR5 cycle. LPDDR5 and LPDDR5X are the fastest-growing architecture segment, with the DRAM for PC and Laptop market size for this category projected to expand at an 11.10% CAGR through 2031. This pattern shows that the market is now being pulled by 2 linked forces: fixed platform migration in mainstream systems and stronger bandwidth demand in thinner mobile devices. DDR4 and older architectures are losing share as new product development focuses on newer standards, though DDR4 still plays a role in the aftermarket, enterprise support, and budget-oriented configurations. The DRAM for PC and Laptop industry is therefore moving through a mixed transition where legacy demand stays relevant in the near term, but the center of value creation has already shifted.

The second layer of this shift is visible in the wider LPDDR5X ecosystem, where new suppliers are gaining ground in advanced mobile memory. CXMT reported that DDR5 accounted for 31.9% of its DRAM revenue in 2025, up from 13.3% in 2024, underscoring how quickly the new architecture is spreading, even among later entrants. That matters for the DRAM for PC and Laptop market because broader DDR5 participation can expand supply options in consumer-oriented categories, even if the top 3 manufacturers keep their premium focus on other memory products. LPDDR4 and LPDDR4X still retain a place in value notebooks and in regions with slower refresh timing, but their long-term role is narrowing as OEMs align future launches with AI-ready specifications. The DRAM for PC and Laptop industry is therefore not just moving to a new standard, it is reorganizing around memory architectures that better match mobile AI and next-generation notebook design needs.

Below 10 nm EUV technology accounted for 60.47% of the market value in 2025, giving it the largest position within the DRAM for the PC and Laptop market. It is also the fastest-moving node segment, with the DRAM for PC and Laptop market size for below 10 nm EUV advancing at an 10.95% CAGR through 2031. This dominance reflects the fact that leading-edge DDR5 and LPDDR5X production is increasingly tied to advanced process technology across the largest manufacturers. The node mix also matters because smaller geometries help support higher densities, better power efficiency, and the product roadmaps needed for higher-capacity client memory. As a result, value concentration in the DRAM for PC and Laptop market is moving toward manufacturers and regions that can sustain advanced-node execution at scale.

SK Hynix stated in September 2025 that it had assembled the industry’s first commercial High-NA EUV system for production at its M16 fab in Icheon, which positions advanced lithography as a direct competitive lever in memory manufacturing. Samsung also deepened its next-generation memory strategy through platform-level collaboration with AMD in 2026, underscoring the broader commercial importance of advanced DRAM development for future product stacks. Transitional 18 nm to 11 nm nodes remain relevant for mid-tier systems where the cost-to-performance balance is still acceptable, but their share should keep narrowing as new launches favor more advanced memory. Chinese producers continue to expand, but export restrictions on advanced EUV tools preserve a structural edge for incumbents at the leading node. This keeps the technology premium firmly aligned with the manufacturers that control the most advanced DRAM process capabilities.

Complete Report Scope:

  • By Architecture
    • DDR3
    • DDR4
    • DDR5
    • LPDDR4/4X
    • LPDDR5/5X
  • By Technology Node
    • 19 Nm and Above
    • 18 Nm to 11 Nm
    • Below 10 Nm EUV
  • By Capacity
    • 8 GB and Below
    • 16 GB
    • 32 GB
    • Above 32 GB
  • By Form Factor
    • UDIMM
    • SODIMM
    • CAMM2 and LPCAMM2
    • Soldered Onboard Memory
  • By Geography
    • North America
    • Europe
    • Asia Pacific
      • China
      • Japan
      • South Korea
      • Taiwan
      • Rest of Asia Pacific
    • Rest of the World

Geography Analysis

Asia-Pacific accounted for 56.74% of the market value in 2025 and remains the largest regional block in the DRAM for the PC and Laptop market. It is also the fastest-growing geography, with the DRAM for PC and Laptop market size in Asia-Pacific projected to rise at a 12.15% CAGR through 2031. The region holds this position because it combines the deepest production base with the strongest downstream ecosystem for module assembly, distribution, and electronics manufacturing. South Korea remains central because Samsung Electronics and SK Hynix continue to anchor global DRAM output and shape supply conditions for the wider client market. Taiwan adds a strong downstream layer through module and memory ecosystem companies that connect wafer supply to global OEM and channel demand. China is becoming more influential through CXMT, which disclosed an intended CNY 29.5 billion listing, equivalent to USD 4.1 billion, and a global DRAM revenue share near 8% in Q1 2026.

Japan also matters because advanced DRAM investment in the country is supporting the regional concentration of high-value memory production. Even without citing regional shipment shares, the Asia-Pacific position in the DRAM for PC and Laptop market is strengthened by the fact that most critical production decisions still sit inside this manufacturing cluster. That concentration makes the region both the main engine of supply and the main source of pricing influence for the rest of the market. It also means that client memory availability in other regions depends heavily on production and allocation decisions made in Asia-Pacific.

North America remains a major consumption center in the DRAM for PC and Laptop market because of its large enterprise installed base and its relatively early movement into commercial refresh cycles. Demand in the region is supported by organizations replacing older fleets with systems that are more likely to carry 16 GB memory as a practical starting point. Europe follows a similar replacement pattern, although cost pressure and weaker consumer momentum can make the cycle less even across countries and user groups. The Rest of the World remains more exposed to entry-level notebook demand, which means higher DRAM prices have a larger effect on configuration choices and replacement timing there. As a result, the DRAM for PC and Laptop market should continue to show the strongest value concentration in Asia-Pacific, while North America and Europe remain important demand anchors and emerging markets lag in the move to richer memory configurations.



List of Companies Covered in this Report:

  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • ChangXin Memory Technologies, Inc.
  • Powerchip Semiconductor Manufacturing Corp.
  • GigaDevice Semiconductor (Beijing) Inc.
  • Etron Technology, Inc.
  • Integrated Silicon Solution, Inc.
  • Elite Semiconductor Memory Technology Inc.
  • Alliance Memory, Inc.
  • AP Memory Technology Corp.
  • Kingston Technology Company, Inc.
  • ADATA Technology Co., Ltd.
  • Transcend Information, Inc.
  • Corsair Gaming, Inc.
  • G.SKILL International Enterprise Co., Ltd.
  • Patriot Memory, LLC
  • Smart Modular Technologies, Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY3 EXECUTIVE SUMMARY
4 MARKET LANDSCAPE
4.1 Market Overview
4.2 Market Drivers
4.2.1 Rising DDR5 Default Spec in New PC and Laptop Platforms
4.2.2 AI PC Memory Bump in Mainstream Notebooks
4.2.3 OEM SKU Rationalization Toward Higher Memory Configurations
4.2.4 Supply Reallocation Away From Client DRAM Toward Higher-Margin Segments
4.2.5 Notebook Thinness and Power-Efficiency Requirements Favoring LPDDR and CAMM2 Adoption
4.2.6 Corporate Refresh Cycle Triggered by End-Of-Support Windows and Fleet Modernization
4.3 Market Restraints
4.3.1 Persistent DRAM Price Volatility in Client Channels
4.3.2 Faster Transition to Soldered Memory in Ultra-Thin Devices
4.3.3 Demand Deferral From Higher System Prices in Entry and Mid-Tier PCs
4.3.4 Supply Allocation Bias Toward Servers and AI Accelerators
4.4 Industry Supply Chain Analysis
4.5 Regulatory Landscape
4.6 Technological Outlook
4.7 Impact of Macroeconomic Factors on the Market
4.8 Porter's Five Forces Analysis
4.8.1 Threat of New Entrants
4.8.2 Bargaining Power of Suppliers
4.8.3 Bargaining Power of Buyers
4.8.4 Threat of Substitutes
4.8.5 Intensity of Competitive Rivalry
5 MARKET SIZE AND GROWTH FORECASTS (VALUE)
5.1 By Architecture
5.1.1 DDR3
5.1.2 DDR4
5.1.3 DDR5
5.1.4 LPDDR4/4X
5.1.5 LPDDR5/5X
5.2 By Technology Node
5.2.1 19 Nm and Above
5.2.2 18 Nm to 11 Nm
5.2.3 Below 10 Nm EUV
5.3 By Capacity
5.3.1 8 GB and Below
5.3.2 16 GB
5.3.3 32 GB
5.3.4 Above 32 GB
5.4 By Form Factor
5.4.1 UDIMM
5.4.2 SODIMM
5.4.3 CAMM2 and LPCAMM2
5.4.4 Soldered Onboard Memory
5.5 By Geography
5.5.1 North America
5.5.2 Europe
5.5.3 Asia Pacific
5.5.3.1 China
5.5.3.2 Japan
5.5.3.3 South Korea
5.5.3.4 Taiwan
5.5.3.5 Rest of Asia Pacific
5.5.4 Rest of the World
6 COMPETITIVE LANDSCAPE
6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
6.4.1 Samsung Electronics Co., Ltd.
6.4.2 SK Hynix Inc.
6.4.3 Micron Technology, Inc.
6.4.4 Nanya Technology Corporation
6.4.5 Winbond Electronics Corporation
6.4.6 ChangXin Memory Technologies, Inc.
6.4.7 Powerchip Semiconductor Manufacturing Corp.
6.4.8 GigaDevice Semiconductor (Beijing) Inc.
6.4.9 Etron Technology, Inc.
6.4.10 Integrated Silicon Solution, Inc.
6.4.11 Elite Semiconductor Memory Technology Inc.
6.4.12 Alliance Memory, Inc.
6.4.13 AP Memory Technology Corp.
6.4.14 Kingston Technology Company, Inc.
6.4.15 ADATA Technology Co., Ltd.
6.4.16 Transcend Information, Inc.
6.4.17 Corsair Gaming, Inc.
6.4.18 G.SKILL International Enterprise Co., Ltd.
6.4.19 Patriot Memory, LLC
6.4.20 Smart Modular Technologies, Inc.
7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK
7.1 White-space and Unmet-Need Assessment

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • ChangXin Memory Technologies, Inc.
  • Powerchip Semiconductor Manufacturing Corp.
  • GigaDevice Semiconductor (Beijing) Inc.
  • Etron Technology, Inc.
  • Integrated Silicon Solution, Inc.
  • Elite Semiconductor Memory Technology Inc.
  • Alliance Memory, Inc.
  • AP Memory Technology Corp.
  • Kingston Technology Company, Inc.
  • ADATA Technology Co., Ltd.
  • Transcend Information, Inc.
  • Corsair Gaming, Inc.
  • G.SKILL International Enterprise Co., Ltd.
  • Patriot Memory, LLC
  • Smart Modular Technologies, Inc.