The Cellular IoT and LPWA Chipset and Module Market - 10th Edition

1.1 Which things will be connected to wide area networks?
1.1.1 Utility meters
1.1.2 Motor vehicles
1.1.3 Buildings
1.1.4 Asset tracking and supply chain visibility
1.1.5 The opportunity to create smarter and safer cities
1.1.6 The convergence of IoT and AI
1.2 What are the technology options?
1.2.1 Network deployment models
1.2.2 Licensed and unlicensed frequency bands
1.2.3 Cost comparison for cellular and LPWA technologies
1.3 Which are the leading technology ecosystems?
2.1 Technology characteristics
2.1.1 3GPP Release 13 (2016) - Introducing LTE-M and NB-IoT
2.1.2 3GPP Release 14 (2017) - IoT enhancements and C-V2X
2.1.3 3GPP Release 15 (2019) - The first phase of 5G specifications
2.1.4 3GPP Release 16 (2020) - URLLC and 5G NR C-V2X
2.1.5 3GPP Release 17 (2022) - RedCap and NTN communications
2.1.6 3GPP Release 18 (2024) - The first 5G-Advanced specifications and eRedCap .
2.1.7 3GPP Release 19 (2025) - Ambient IoT as a new low-power cellular IoT class
2.2 Network footprint
2.2.1 2G/3G mobile networks
2.2.2 4G LTE mobile networks
2.2.3 4G/5G mobile IoT networks (LTE-M and NB-IoT)
2.2.4 5G mobile networks
2.3 Semiconductor vendors
2.3.1 Altair Semiconductor
2.3.2 ASR Microelectronics
2.3.3 Eigencomm
2.3.4 HiSilicon
2.3.5 MediaTek
2.3.6 MLINK
2.3.7 Qualcomm
2.3.8 Samsung Electronics
2.3.9 Sequans Communications
2.3.10 UNISOC
2.3.11 Xinyi Information Technology
2.3.12 Other semiconductor vendors
2.4 Module vendors
2.4.1 Cavli Wireless
2.4.2 China Mobile IoT
2.4.3 Eagle Wireless
2.4.4 Fibocom
2.4.5 Kontron
2.4.6 Lierda
2.4.7 MeiG Smart Technology
2.4.8 Murata
2.4.9 Neoway
2.4.10 Nordic Semiconductor
2.4.11 Quectel
2.4.12 Rolling Wireless
2.4.13 Semtech
2.4.14 Sunsea AIoT (SIMCom & Longsung)
2.4.15 Telit Cinterion
2.4.16 Trasna
2.4.17 ZxInfoTek
2.4.18 Other cellular IoT module vendors

3.1 Technology characteristics
3.2 Network footprint
3.2.1 Europe
3.2.2 Asia-Pacific
3.2.3 The Americas
3.2.4 Middle East & Africa
3.3 Semiconductor and module vendors
3.3.1 Semtech
3.3.2 Other semiconductor vendors
3.3.3 LoRa module vendors

4.1 Technology characteristics
4.2 Network footprint
4.2.1 Europe
4.2.2 The Americas
4.2.3 Asia-Pacific
4.2.4 Middle East & Africa
4.2.5 UnaBiz partners with the LoRaWAN ecosystem
4.2.6 Examples of major Sigfox use cases
4.3 Semiconductor and module vendors
4.3.1 Semiconductor vendors
4.3.2 Sigfox module vendors

5.1 IEEE 802.15.4
5.1.1 Connectivity stacks based on 802.15.4
5.1.2 Network footprint
5.2 Wirepas Mesh
5.3 DECT-2020 NR (NR+)
5.4 Mioty
5.5 Chipset and module vendors

6.1 Market summary
6.2 The cellular IoT device market
6.2.1 The cellular IoT chipset market shares
6.2.2 Cellular IoT module market shares
6.2.3 Automotive cellular IoT chipset market shares
6.2.4 NAD module market shares
6.3 The cellular IoT technology landscape
6.4 Cellular IoT regional market trends
6.4.1 Europe
6.4.2 North America
6.4.3 Latin America
6.4.4 China
6.4.5 Rest of Asia-Pacific
6.4.6 Middle East & Africa
6.5 The LoRa device market
6.6 The Sigfox device market
6.7 Emerging low-power IoT connectivity technologies