The Asia Pacific Semiconductor Metrology and Inspection Equipment Market is expected to reach USD 9.6 billion by 2030, growing at a CAGR of 8% during 2026-2033.
The Asia Pacific Semiconductor Metrology and Inspection Equipment Market developed alongside the region’s rapid expansion in semiconductor fabrication, assembly, and advanced chip production. Early adoption focused on basic mechanical and optical tools used for wafer measurement, dimensional checks, and defect identification. As process nodes became smaller and device structures more complex, the market shifted toward electron beam, laser scanning, X-ray, and high-resolution optical inspection systems. The growth of FinFETs, 3D NAND, advanced packaging, and heterogeneous integration increased the need for multidimensional and inline metrology platforms.
The Asia Pacific Semiconductor Metrology and Inspection Equipment Market is being shaped by expanding fab capacity, advanced packaging adoption, AI semiconductor demand, quality control pressure, and localization of semiconductor supply chains. Manufacturers are using inspection equipment to detect nanoscale defects, improve wafer yield, monitor thin films, verify photomasks, and ensure package reliability. Demand is supported by strong foundry activity, OSAT capacity growth, government-backed semiconductor programs, and high-volume electronics production. Vendors are focusing on AI-driven defect detection, hybrid metrology, inline inspection, non-destructive failure analysis, automation-ready platforms, and region-specific service support.
Optical leads due to its high-speed, non-contact inspection capability and strong suitability for inline monitoring across high-volume semiconductor manufacturing lines. These systems are widely used for surface inspection, overlay measurement, film analysis, critical dimension control, and process monitoring across fabrication stages. Demand is reinforced by expanding consumer electronics, automotive chips, AI semiconductors, and advanced node production across Asia Pacific. Beam-based systems remain important for ultra-high-resolution defect review, mask inspection, failure analysis, root cause evaluation, and advanced node applications where atomic-level imaging and detailed defect characterization are required.
2D Metrology/Inspection leads due to its broad use in planar wafer measurement, pattern inspection, overlay control, film monitoring, and quality assurance across mature and advanced production lines. These systems remain essential because they deliver reliable measurements, strong throughput, and cost-effective process control for high-volume fabs. 3D Metrology/Inspection is gaining traction as advanced packaging, 3D NAND, stacked dies, and heterogeneous integration require volumetric defect detection and structural analysis. Hybrid 2D/3D Systems are gradually expanding as manufacturers seek combined platforms that improve inspection efficiency, reduce tool duplication, and support increasingly complex semiconductor architectures.
Foundries lead due to the region’s strong concentration of high-volume wafer fabrication facilities and continuous investment in advanced process nodes. These companies rely on metrology and inspection equipment to improve yield, control defects, maintain customer specifications, and support complex semiconductor manufacturing flows. Integrated Device Manufacturing Firms use inspection platforms for memory, logic, power semiconductor, and mixed-signal device production where process consistency remains critical. Outsourced Semiconductor Assembly and Test Companies and Other End-User areas add demand through advanced package inspection, wire bond analysis, solder joint evaluation, failure analysis, research activity, specialty chip development, and emerging semiconductor innovation.
Thin Film Metrology remains essential for measuring film thickness, refractive index, material uniformity, stress, and layer consistency in advanced semiconductor processes. Mask Inspection System, Package Inspection, and Other Technology areas add demand through photomask defect review, EUV-related mask quality control, X-ray package inspection, acoustic microscopy, quantum sensing, laser-based monitoring, and specialized failure analysis.
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China leads due to semiconductor self-sufficiency efforts, expanding fab capacity, domestic metrology development, hybrid inspection adoption, and growing demand for advanced process control tools. Japan supports market growth through precision engineering, strong metrology expertise, e-beam inspection, AI-enabled analytics, and advanced semiconductor manufacturing support. India is advancing through semiconductor localization, government-backed fab initiatives, AI-based inspection adoption, and demand for automated quality control tools. South Korea, Singapore, and Malaysia add momentum through memory production, advanced packaging, OSAT activity, smart manufacturing, localized service hubs, and non-destructive inspection adoption, while Rest of Asia Pacific benefits from fab expansion and advanced equipment modernization.
The Asia Pacific Semiconductor Metrology and Inspection Equipment Market developed alongside the region’s rapid expansion in semiconductor fabrication, assembly, and advanced chip production. Early adoption focused on basic mechanical and optical tools used for wafer measurement, dimensional checks, and defect identification. As process nodes became smaller and device structures more complex, the market shifted toward electron beam, laser scanning, X-ray, and high-resolution optical inspection systems. The growth of FinFETs, 3D NAND, advanced packaging, and heterogeneous integration increased the need for multidimensional and inline metrology platforms.
The Asia Pacific Semiconductor Metrology and Inspection Equipment Market is being shaped by expanding fab capacity, advanced packaging adoption, AI semiconductor demand, quality control pressure, and localization of semiconductor supply chains. Manufacturers are using inspection equipment to detect nanoscale defects, improve wafer yield, monitor thin films, verify photomasks, and ensure package reliability. Demand is supported by strong foundry activity, OSAT capacity growth, government-backed semiconductor programs, and high-volume electronics production. Vendors are focusing on AI-driven defect detection, hybrid metrology, inline inspection, non-destructive failure analysis, automation-ready platforms, and region-specific service support.
Type Outlook
Based on Type, the market is segmented into Optical and Beam. The Optical market dominated the Asia Pacific Semiconductor Metrology and Inspection Equipment Market by Type in 2025, and is expected to continue to be a dominant market till 2033; thereby, achieving a market value of USD 6.7 billion by 2030, growing at a CAGR of 7.6 % during the forecast period. The Beam market is expected to witness a CAGR of 8.9% during 2026-2033.Optical leads due to its high-speed, non-contact inspection capability and strong suitability for inline monitoring across high-volume semiconductor manufacturing lines. These systems are widely used for surface inspection, overlay measurement, film analysis, critical dimension control, and process monitoring across fabrication stages. Demand is reinforced by expanding consumer electronics, automotive chips, AI semiconductors, and advanced node production across Asia Pacific. Beam-based systems remain important for ultra-high-resolution defect review, mask inspection, failure analysis, root cause evaluation, and advanced node applications where atomic-level imaging and detailed defect characterization are required.
Dimension Outlook
Based on Dimension, the market is segmented into 2D Metrology/Inspection, 3D Metrology/Inspection, and Hybrid 2D/3D Systems. The 2D Metrology/Inspection market dominated the Asia Pacific Semiconductor Metrology and Inspection Equipment Market by Dimension in 2025, and is expected to continue to be a dominant market till 2033; thereby, achieving a market value of USD 4.4 billion by 2030, growing at a CAGR of 7.6 % during the forecast period. The 3D Metrology/Inspection market is expected to witness a CAGR of 8.4% during 2026-2033. The Hybrid 2D/3D Systems market is expected to witness a CAGR of 8.4% during 2026-2033.2D Metrology/Inspection leads due to its broad use in planar wafer measurement, pattern inspection, overlay control, film monitoring, and quality assurance across mature and advanced production lines. These systems remain essential because they deliver reliable measurements, strong throughput, and cost-effective process control for high-volume fabs. 3D Metrology/Inspection is gaining traction as advanced packaging, 3D NAND, stacked dies, and heterogeneous integration require volumetric defect detection and structural analysis. Hybrid 2D/3D Systems are gradually expanding as manufacturers seek combined platforms that improve inspection efficiency, reduce tool duplication, and support increasingly complex semiconductor architectures.
End-User Outlook
Based on End-User, the market is segmented into Foundries, Integrated Device Manufacturing Firms, Outsourced Semiconductor Assembly and Test Companies, and Other End-User. The Foundries market dominated the Asia Pacific Semiconductor Metrology and Inspection Equipment Market by End-User in 2025, and is expected to continue to be a dominant market till 2033; thereby, achieving a market value of USD 4.2 billion by 2030, growing at a CAGR of 7.4 % during the forecast period. The Integrated Device Manufacturing Firms market is expected to witness a CAGR of 8.2% during 2026-2033. Additionally, the Outsourced Semiconductor Assembly and Test Companies market is expected to witness highest CAGR of 8.8% during 2026-2033.Foundries lead due to the region’s strong concentration of high-volume wafer fabrication facilities and continuous investment in advanced process nodes. These companies rely on metrology and inspection equipment to improve yield, control defects, maintain customer specifications, and support complex semiconductor manufacturing flows. Integrated Device Manufacturing Firms use inspection platforms for memory, logic, power semiconductor, and mixed-signal device production where process consistency remains critical. Outsourced Semiconductor Assembly and Test Companies and Other End-User areas add demand through advanced package inspection, wire bond analysis, solder joint evaluation, failure analysis, research activity, specialty chip development, and emerging semiconductor innovation.
Technology Outlook
Based on Technology, the market is segmented into Wafer Inspection System, Thin Film Metrology, Mask Inspection System, Package Inspection, and Other Technology. Wafer Inspection System leads due to its central role in early defect detection, process monitoring, wafer quality control, and yield improvement across fabrication lines. These systems help identify particles, pattern defects, process variations, and irregularities before defects move into later manufacturing stages.Thin Film Metrology remains essential for measuring film thickness, refractive index, material uniformity, stress, and layer consistency in advanced semiconductor processes. Mask Inspection System, Package Inspection, and Other Technology areas add demand through photomask defect review, EUV-related mask quality control, X-ray package inspection, acoustic microscopy, quantum sensing, laser-based monitoring, and specialized failure analysis.
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Country Outlook
Based on Country, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific. The China market dominated the Asia Pacific Semiconductor Metrology and Inspection Equipment Market by country in 2025, and is expected to continue to be a dominant market till 2033; thereby, achieving a market value of USD 2.3 billion by 2030, growing at a CAGR of 5.8 % during the forecast period. The Japan market is expected to witness a CAGR of 7% during 2026-2033. Additionally, the India market is expected to witness a CAGR of 9.9% during 2026-2033.China leads due to semiconductor self-sufficiency efforts, expanding fab capacity, domestic metrology development, hybrid inspection adoption, and growing demand for advanced process control tools. Japan supports market growth through precision engineering, strong metrology expertise, e-beam inspection, AI-enabled analytics, and advanced semiconductor manufacturing support. India is advancing through semiconductor localization, government-backed fab initiatives, AI-based inspection adoption, and demand for automated quality control tools. South Korea, Singapore, and Malaysia add momentum through memory production, advanced packaging, OSAT activity, smart manufacturing, localized service hubs, and non-destructive inspection adoption, while Rest of Asia Pacific benefits from fab expansion and advanced equipment modernization.
List of Key Companies Profiled
- KLA Corporation
- Applied Materials, Inc.
- Hitachi High-Tech Corporation
- ASML Holding N.V.
- Onto Innovation Inc.
- Lasertec Corporation
- Nova Ltd.
- Camtek Ltd.
- Bruker Corporation
- SCREEN Holdings Co., Ltd.
Market Report Segmentation
By Type- Optical
- Beam
- 2D Metrology/Inspection
- 3D Metrology/Inspection
- Hybrid 2D/3D Systems
- Foundries
- Integrated Device Manufacturing Firms
- Outsourced Semiconductor Assembly and Test Companies
- Other End-User
- Wafer Inspection System
- Thin Film Metrology
- Mask Inspection System
- Package Inspection
- Other Technology
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Asia Pacific Market1.1 Market Overview
1.2 Key Factors Impacting Market
1.2.1 Market Drivers
1.2.2 Market Restraints
1.2.3 Market Opportunities
1.2.4 Market Challenges
1.2.5 Market Trends
1.2.6 State of Competition
1.2.7 Market Consolidation
1.2.8 Key Customer Criteria
1.3 Product Life Cycle
1.4 Segmentation By Type
1.4.1 Optical
1.4.2 Beam
1.5 Segmentation By Dimension
1.5.1 D Metrology/Inspection
1.5.2 D Metrology/Inspection
1.5.3 Hybrid 2D/3D Systems
1.6 Segmentation By End-User
1.6.1 Foundries
1.6.2 Integrated Device Manufacturing Firms
1.6.3 Outsourced Semiconductor Assembly and Test Companies
1.6.4 Other End-User
1.7 Segmentation By Technology
1.7.1 Wafer Inspection System
1.7.2 Thin Film Metrology
1.7.3 Mask Inspection System
1.7.4 Package Inspection
1.7.5 Other Technology
1.8 Segmentation By Country
1.8.1 China
1.8.1.1 Segmentation By Type
1.8.1.1.1 Optical
1.8.1.1.2 Beam
1.8.1.2 Segmentation By Dimension
1.8.1.2.1 D Metrology/Inspection
1.8.1.2.2 D Metrology/Inspection
1.8.1.2.3 Hybrid 2D/3D Systems
1.8.1.3 Segmentation By End-User
1.8.1.3.1 Foundries
1.8.1.3.2 Integrated Device Manufacturing Firms
1.8.1.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.1.3.4 Other End-User
1.8.1.4 Segmentation By Technology
1.8.1.4.1 Wafer Inspection System
1.8.1.4.2 Thin Film Metrology
1.8.1.4.3 Mask Inspection System
1.8.1.4.4 Package Inspection
1.8.1.4.5 Other Technology
1.8.2 Japan
1.8.2.1 Segmentation By Type
1.8.2.1.1 Optical
1.8.2.1.2 Beam
1.8.2.2 Segmentation By Dimension
1.8.2.2.1 D Metrology/Inspection
1.8.2.2.2 D Metrology/Inspection
1.8.2.2.3 Hybrid 2D/3D Systems
1.8.2.3 Segmentation By End-User
1.8.2.3.1 Foundries
1.8.2.3.2 Integrated Device Manufacturing Firms
1.8.2.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.2.3.4 Other End-User
1.8.2.4 Segmentation By Technology
1.8.2.4.1 Wafer Inspection System
1.8.2.4.2 Thin Film Metrology
1.8.2.4.3 Mask Inspection System
1.8.2.4.4 Package Inspection
1.8.2.4.5 Other Technology
1.8.3 India
1.8.3.1 Segmentation By Type
1.8.3.1.1 Optical
1.8.3.1.2 Beam
1.8.3.2 Segmentation By Dimension
1.8.3.2.1 D Metrology/Inspection
1.8.3.2.2 D Metrology/Inspection
1.8.3.2.3 Hybrid 2D/3D Systems
1.8.3.3 Segmentation By End-User
1.8.3.3.1 Foundries
1.8.3.3.2 Integrated Device Manufacturing Firms
1.8.3.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.3.3.4 Other End-User
1.8.3.4 Segmentation By Technology
1.8.3.4.1 Wafer Inspection System
1.8.3.4.2 Thin Film Metrology
1.8.3.4.3 Mask Inspection System
1.8.3.4.4 Package Inspection
1.8.3.4.5 Other Technology
1.8.4 South Korea
1.8.4.1 Segmentation By Type
1.8.4.1.1 Optical
1.8.4.1.2 Beam
1.8.4.2 Segmentation By Dimension
1.8.4.2.1 D Metrology/Inspection
1.8.4.2.2 D Metrology/Inspection
1.8.4.2.3 Hybrid 2D/3D Systems
1.8.4.3 Segmentation By End-User
1.8.4.3.1 Foundries
1.8.4.3.2 Integrated Device Manufacturing Firms
1.8.4.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.4.3.4 Other End-User
1.8.4.4 Segmentation By Technology
1.8.4.4.1 Wafer Inspection System
1.8.4.4.2 Thin Film Metrology
1.8.4.4.3 Mask Inspection System
1.8.4.4.4 Package Inspection
1.8.4.4.5 Other Technology
1.8.5 Singapore
1.8.5.1 Segmentation By Type
1.8.5.1.1 Optical
1.8.5.1.2 Beam
1.8.5.2 Segmentation By Dimension
1.8.5.2.1 D Metrology/Inspection
1.8.5.2.2 D Metrology/Inspection
1.8.5.2.3 Hybrid 2D/3D Systems
1.8.5.3 Segmentation By End-User
1.8.5.3.1 Foundries
1.8.5.3.2 Integrated Device Manufacturing Firms
1.8.5.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.5.3.4 Other End-User
1.8.5.4 Segmentation By Technology
1.8.5.4.1 Wafer Inspection System
1.8.5.4.2 Thin Film Metrology
1.8.5.4.3 Mask Inspection System
1.8.5.4.4 Package Inspection
1.8.5.4.5 Other Technology
1.8.6 Malaysia
1.8.6.1 Segmentation By Type
1.8.6.1.1 Optical
1.8.6.1.2 Beam
1.8.6.2 Segmentation By Dimension
1.8.6.2.1 D Metrology/Inspection
1.8.6.2.2 D Metrology/Inspection
1.8.6.2.3 Hybrid 2D/3D Systems
1.8.6.3 Segmentation By End-User
1.8.6.3.1 Foundries
1.8.6.3.2 Integrated Device Manufacturing Firms
1.8.6.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.6.3.4 Other End-User
1.8.6.4 Segmentation By Technology
1.8.6.4.1 Wafer Inspection System
1.8.6.4.2 Thin Film Metrology
1.8.6.4.3 Mask Inspection System
1.8.6.4.4 Package Inspection
1.8.6.4.5 Other Technology
1.8.7 Rest of Asia Pacific
1.8.7.1 Segmentation By Type
1.8.7.1.1 Optical
1.8.7.1.2 Beam
1.8.7.2 Segmentation By Dimension
1.8.7.2.1 D Metrology/Inspection
1.8.7.2.2 D Metrology/Inspection
1.8.7.2.3 Hybrid 2D/3D Systems
1.8.7.3 Segmentation By End-User
1.8.7.3.1 Foundries
1.8.7.3.2 Integrated Device Manufacturing Firms
1.8.7.3.3 Outsourced Semiconductor Assembly and Test Companies
1.8.7.3.4 Other End-User
1.8.7.4 Segmentation By Technology
1.8.7.4.1 Wafer Inspection System
1.8.7.4.2 Thin Film Metrology
1.8.7.4.3 Mask Inspection System
1.8.7.4.4 Package Inspection
1.8.7.4.5 Other Technology
Chapter 2. Company Snapshots
2.1 KLA Corporation
2.1.1 Business Overview
2.1.2 Key Information
2.1.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.1.4 Strategic Insights
2.1.5 Strategy Deployed
2.1.6 Product &Service Portfolio
2.1.7 Capability Overview
2.1.8 Technology &Innovation Focus
2.1.9 SWOT Analysis
2.1.10 Customers / End Users
2.1.11 Competitive Positioning
2.1.12 Key Differentiators
2.1.13 Portfolio Matrix
2.1.14 Analyst View
2.1.15 Future Outlook
2.2 Applied Materials, Inc.
2.2.1 Business Overview
2.2.2 Key Information
2.2.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.2.4 Strategic Insights
2.2.5 Strategy Deployed
2.2.6 Product &Service Portfolio
2.2.7 Capability Overview
2.2.8 Technology &Innovation Focus
2.2.9 SWOT Analysis
2.2.10 Customers / End Users
2.2.11 Competitive Positioning
2.2.12 Key Differentiators
2.2.13 Portfolio Matrix
2.2.14 Analyst View
2.2.15 Future Outlook
2.3 Hitachi High-Tech Corporation
2.3.1 Business Overview
2.3.2 Key Information
2.3.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.3.4 Strategic Insights
2.3.5 Strategy Deployed
2.3.6 Product &Service Portfolio
2.3.7 Representative Products / Services
2.3.8 Capability Overview
2.3.9 Technology &Innovation Focus
2.3.10 SWOT Analysis
2.3.11 Customers / End Users
2.3.12 Competitive Positioning
2.3.13 Key Differentiators
2.3.14 Portfolio Matrix
2.3.15 Analyst View
2.3.16 Future Outlook
2.4 ASML Holding N.V.
2.4.1 Business Overview
2.4.2 Key Information
2.4.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.4.4 Strategic Insights
2.4.5 Strategy Deployed
2.4.6 Product &Service Portfolio
2.4.7 Representative Products / Services
2.4.8 Capability Overview
2.4.9 Technology &Innovation Focus
2.4.10 SWOT Analysis
2.4.11 Customers / End Users
2.4.12 Competitive Positioning
2.4.13 Key Differentiators
2.4.14 Portfolio Matrix
2.4.15 Analyst View
2.4.16 Future Outlook
2.5 Onto Innovation Inc.
2.5.1 Business Overview
2.5.2 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.5.3 Strategic Insights
2.5.4 Strategy Deployed
2.5.5 Product &Service Portfolio
2.5.6 Representative Products / Services
2.5.7 Technology &Innovation Focus
2.5.8 SWOT Analysis
2.5.9 Customers / End Users
2.5.10 Competitive Positioning
2.5.11 Key Differentiators
2.5.12 Portfolio Matrix
2.5.13 Analyst View
2.5.14 Future Outlook
2.6 Lasertec Corporation
2.6.1 Business Overview
2.6.2 Key Information
2.6.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.6.4 Strategic Insights
2.6.5 Strategy Deployed
2.6.6 Product &Service Portfolio
2.6.7 Representative Products / Services
2.6.8 Capability Overview
2.6.9 Technology &Innovation Focus
2.6.10 SWOT Analysis
2.6.11 Customers / End Users
2.6.12 Competitive Positioning
2.6.13 Key Differentiators
2.6.14 Portfolio Matrix
2.6.15 Analyst View
2.6.16 Future Outlook
2.7 Nova Ltd.
2.7.1 Business Overview
2.7.2 Key Information
2.7.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.7.4 Strategic Insights
2.7.5 Strategy Deployed
2.7.6 Product &Service Portfolio
2.7.7 Representative Products / Services
2.7.8 Capability Overview
2.7.9 Technology &Innovation Focus
2.7.10 SWOT Analysis
2.7.11 Customers / End Users
2.7.12 Competitive Positioning
2.7.13 Key Differentiators
2.7.14 Portfolio Matrix
2.7.15 Analyst View
2.7.16 Future Outlook
2.8 Camtek Ltd.
2.8.1 Business Overview
2.8.2 Key Information
2.8.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.8.4 Strategic Insights
2.8.5 Strategy Deployed
2.8.6 Product &Service Portfolio
2.8.7 Representative Products / Services
2.8.8 Capability Overview
2.8.9 SWOT Analysis
2.8.10 Customers / End Users
2.8.11 Competitive Positioning
2.8.12 Key Differentiators
2.8.13 Portfolio Matrix
2.8.14 Analyst View
2.8.15 Future Outlook
2.9 Bruker Corporation
2.9.1 Business Overview
2.9.2 Key Information
2.9.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.9.4 Strategic Insights
2.9.5 Strategy Deployed
2.9.6 Product &Service Portfolio
2.9.7 Representative Products / Services
2.9.8 Capability Overview
2.9.9 Technology &Innovation Focus
2.9.10 SWOT Analysis
2.9.11 Customers / End Users
2.9.12 Competitive Positioning
2.9.13 Key Differentiators
2.9.14 Portfolio Matrix
2.9.15 Analyst View
2.9.16 Future Outlook
2.10 SCREEN Holdings Co., Ltd.
2.10.1 Business Overview
2.10.2 Key Information
2.10.3 Company Focus on Semiconductor Metrology and Inspection Equipment Market
2.10.4 Strategic Insights
2.10.5 Strategy Deployed
2.10.6 Product &Service Portfolio
2.10.7 Representative Products / Services
2.10.8 Capability Overview
2.10.9 Technology &Innovation Focus
2.10.10 SWOT Analysis
2.10.11 Customers / End Users
2.10.12 Competitive Positioning
2.10.13 Key Differentiators
2.10.14 Portfolio Matrix
2.10.15 Analyst View
2.10.16 Future Outlook
Companies Mentioned
KLA CorporationApplied Materials, Inc.
Hitachi High-Tech Corporation
ASML Holding N.V.
Onto Innovation Inc.
Lasertec Corporation
Nova Ltd.
Camtek Ltd.
Bruker Corporation
SCREEN Holdings Co., Ltd.
