3D IC Design and Manufacturers Software Market Global Report 2026

The 3D IC design and manufacturers software market size has grown rapidly in recent years. It will grow from $12.99 billion in 2025 to $14.58 billion in 2026 at a compound annual growth rate (CAGR) of 12.2%. The growth in the historic period can be attributed to the increasing complexity of semiconductor designs, rising adoption of sophisticated semiconductor packaging technologies, growing need for high-performance computing systems, increasing utilization of chiplet-based architectures, and expanding demand for advanced electronic design automation solutions.

The 3D IC design and manufacturers software market size is expected to see rapid growth in the next few years. It will grow to $22.73 billion in 2030 at a compound annual growth rate (CAGR) of 11.7%. The growth in the forecast period can be attributed to increasing demand for 3D integrated circuit optimization, growing adoption of heterogeneous semiconductor integration, rising need for advanced thermal management analysis, expanding deployment of three-dimensional chip architectures, and increasing demand for automated semiconductor design verification. Major trends in the forecast period include greater adoption of advanced 3D IC design automation, rising demand for thermal analysis and optimization, growing need for signal and power integrity verification, increasing utilization of physical verification and design optimization tools, and rising demand for semiconductor manufacturing process simulation.

The increasing expansion of advanced semiconductor packaging technologies is expected to propel the growth of the 3D IC design and manufacturers software market going forward. Advanced semiconductor packaging technologies refer to semiconductor integration methods that combine multiple dies, chiplets, and heterogeneous components using advanced interconnection techniques such as 2.5D integration, 3D stacking, and wafer-level packaging to enhance performance, power efficiency, and integration density. The expansion of advanced semiconductor packaging technologies is increasing due to the growing demand for artificial intelligence (AI) and high-performance computing (HPC) applications that require advanced packaging solutions, including 2.5D and 3D integration. The increasing adoption of advanced semiconductor packaging technologies supports 3D IC design and manufacturing software by increasing the complexity of multi-die integration and creating a greater need for advanced tools for chiplet co-design, interconnect optimization, thermal analysis, and manufacturing verification. For instance, in July 2024, according to the National Institute of Standards and Technology (NIST), a US-based government agency, the Biden-Harris Administration announced a $1.6 billion investment to establish and accelerate domestic semiconductor advanced packaging capabilities through the CHIPS for America program. Therefore, the increasing expansion of advanced semiconductor packaging technologies is driving the growth of the 3D IC design and manufacturers software market.

Key companies operating in the 3D IC design and manufacturing software market are focusing on developing advanced solutions, such as artificial intelligence (AI)-powered three-dimensional integrated circuit (3D IC) design tools, to enhance engineering productivity, accelerate design processes, and improve semiconductor design quality. Artificial intelligence (AI)-powered three-dimensional integrated circuit (3D IC) design tools are software solutions that leverage AI to automate the design, simulation, verification, and optimization of vertically stacked integrated circuits, enabling faster development and more efficient manufacturing processes. For example, in March 2026, Siemens AG, a Germany-based technology company, launched the Fuse EDA AI Agent, a purpose-built autonomous artificial intelligence (AI) system designed for semiconductor, 3D IC, and printed circuit board (PCB) design workflows. Developed to enhance engineering productivity and design quality, the solution autonomously coordinates multi-agent workflows across Siemens' electronic design automation (EDA) portfolio, covering design conception, verification, and manufacturing sign-off. Built on the Fuse EDA AI system, it incorporates retrieval-augmented generation (RAG), multimodal EDA data capabilities, secure agent orchestration through Model Context Protocol (MCP) and Agent Skills, open integration with third-party platforms, and support for NVIDIA Agent Toolkit, Nemotron models, and NVIDIA AI infrastructure to strengthen reasoning, tool calling, and workflow automation.

In February 2026, Siemens AG, a Germany-based technology company, acquired Canopus AI for an undisclosed amount. Through this acquisition, Siemens aims to strengthen its electronic design automation (EDA) software portfolio by integrating Canopus AI’s AI-driven computational metrology and inspection technologies into its Calibre platform, enhancing semiconductor design-to-manufacturing workflows, increasing wafer pattern precision, accelerating yield ramp-up, and shortening the time needed to reach volume production for advanced semiconductor nodes. Canopus AI is a France-based software company that develops AI-enabled computational metrology and inspection solutions for wafer and mask manufacturing applications in the semiconductor industry.

Major companies operating in the 3D IC design and manufacturers software market are Arteris Inc., Baya Systems Inc., Cadence Design Systems Inc., COMSOL AB, Crosslight Software Inc., Dassault Systèmes SE, Empyrean Technology Co. Ltd., Keysight Technologies Inc., MathWorks Inc., Microwind, Monozukuri S.p.A., PDF Solutions Inc., Primarius Technologies Co. Ltd., Rescale Inc., Siemens AG, Silvaco Group Inc., Synopsys Inc., XEPIC Corporation Limited, Xpeedic Technology Co. Ltd., Zuken Inc.

Asia-Pacific was the dominating region in the 3D IC design and manufacturers software market in 2025. North America is expected to be the rapidly growing region in the forecast period. The regions covered in the 3D IC design and manufacturers software market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the 3D IC design and manufacturers software market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The 3D IC design and manufacturers software market includes revenues earned by entities by providing services such as development and licensing of electronic design automation software, chip packaging design, physical verification, and design optimization. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

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