Semiconductor Deposition Equipment Market Global Report 2026

The semiconductor deposition equipment market size has grown strongly in recent years. It will grow from $16.49 billion in 2025 to $17.78 billion in 2026 at a compound annual growth rate (CAGR) of 7.8%. The growth in the historic period can be attributed to increasing semiconductor requirements from the consumer electronics sector, growing adoption of advanced integrated circuit technologies, expanding semiconductor fabrication capacity, rising investments in semiconductor manufacturing infrastructure, and increasing demand for high-performance electronic products.

The semiconductor deposition equipment market size is expected to see strong growth in the next few years. It will grow to $23.67 billion in 2030 at a compound annual growth rate (CAGR) of 7.4%. The growth in the forecast period can be attributed to increasing demand for advanced semiconductor nodes, rising investments in semiconductor fabrication facilities, growing adoption of wide-bandgap semiconductor devices, increasing demand for semiconductor equipment capable of supporting artificial intelligence applications, and growing emphasis on strengthening domestic semiconductor manufacturing capabilities. Major trends in the forecast period include increasing adoption of advanced thin-film deposition technologies, growing demand for high-precision semiconductor manufacturing equipment, rising development of next-generation wafer fabrication processes, increasing focus on enhanced deposition uniformity and process control, and growing demand for equipment capable of supporting advanced semiconductor nodes.

The growing adoption of consumer electronics and smart devices is expected to propel the growth of the semiconductor deposition equipment market going forward. Consumer electronics and smart devices refer to electronic products designed for personal, household, and entertainment purposes that provide communication, computing, monitoring, and multimedia functions. The adoption of consumer electronics and smart devices is increasing due to rising consumer demand for connected and intelligent technologies that improve convenience, productivity, and entertainment. Semiconductor deposition equipment supports consumer electronics and smart devices by enabling the production of high-performance semiconductor chips with precise thin-film layers needed for advanced electronic components. For instance, in January 2025, according to the Consumer Technology Association, a US-based trade organization, the US consumer technology industry was projected to grow by 3.2% in 2024, reaching $537 billion in retail revenue in 2025. Therefore, the growing adoption of consumer electronics and smart devices is driving the growth of the semiconductor deposition equipment market.

Leading companies operating in the semiconductor deposition equipment market are focusing on the development of next-generation deposition technologies, such as epitaxial wafer deposition systems, to enhance semiconductor manufacturing efficiency, improve thin-film quality, support advanced node fabrication, and enable high-performance power and electronic devices. An epitaxial wafer deposition system is semiconductor manufacturing equipment that deposits a highly controlled crystalline layer onto a semiconductor wafer while maintaining the wafer's crystal structure. For example, in September 2024, ASM International N.V., a Netherlands-based semiconductor equipment corporation, launched the PE2O8 silicon carbide epitaxy system to enhance silicon carbide (SiC) wafer production by delivering high-throughput epitaxial deposition, improving film uniformity and process precision, and supporting the manufacturing of next-generation power semiconductor devices for electric vehicles, renewable energy, and industrial applications. The system was developed to support the industry's transition to larger wafer sizes and growing demand for electric vehicle and power electronics applications.

In September 2023, Plasma-Therm LLC, a US-based manufacturer of advanced plasma processing equipment, acquired Thin Film Equipment SrL (TFE) for an undisclosed amount. Through this acquisition, Plasma-Therm sought to strengthen its presence in Europe, broaden its portfolio of physical vapor deposition (PVD) technologies for power device applications, and enhance its semiconductor manufacturing and research and development capabilities through complementary deposition technologies. Thin Film Equipment SrL (TFE) is an Italy-based company that provides PVD sputtering systems, evaporation process equipment, batch deposition systems, cluster tools, and thin-film deposition technologies for semiconductor research and production.

Major companies operating in the semiconductor deposition equipment market are Applied Materials Inc., Tokyo Electron Limited, Lam Research Corporation, ASM International N.V., Naura Technology Group Co. Ltd., Kokusai Electric Corporation, ULVAC Inc., AIXTRON SE, Advanced Micro-Fabrication Equipment Inc. China, Veeco Instruments Inc., Jusung Engineering Co. Ltd., Wonik IPS Co. Ltd., Oxford Instruments plc, Evatec AG, Canon Anelva Corporation, Plasma-Therm LLC, Shibaura Mechatronics Corporation, TES Co. Ltd., CVD Equipment Corporation, SENTECH Instruments GmbH, Kurt J. Lesker Company, Piotech Inc.

Asia-Pacific was the dominant region in the semiconductor deposition equipment market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the semiconductor deposition equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the semiconductor deposition equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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