Semiconductor Wafer Polishing And Grinding Equipment Market Global Report 2026

The semiconductor wafer polishing and grinding equipment market size has grown strongly in recent years. It will grow from $2.57 billion in 2025 to $2.73 billion in 2026 at a compound annual growth rate (CAGR) of 6.2%. The growth in the historic period can be attributed to increasing semiconductor wafer manufacturing, rising demand for accurate wafer thickness management, growing adoption of advanced semiconductor fabrication techniques, expanding production of memory and logic components, increasing requirement for enhanced wafer surface quality.

The semiconductor wafer polishing and grinding equipment market size is expected to see strong growth in the next few years. It will grow to $3.43 billion in 2030 at a compound annual growth rate (CAGR) of 5.8%. The growth in the forecast period can be attributed to increasing demand for thinner semiconductor wafers, growing requirements for advanced wafer surface finishing, rising production of power semiconductor devices, expanding need for high-precision wafer processing equipment, and increasing adoption of automated wafer polishing and grinding systems. Major trends in the forecast period include advancements in wafer surface finishing accuracy, growing use of ultra-thin wafer processing, development of highly precise grinding technologies, improvements in wafer flatness and thickness management, and increasing application of advanced polishing methods to minimize defects.

The growing adoption of electric vehicles is expected to propel the growth of the semiconductor wafer polishing and grinding equipment market going forward. An electric vehicle (EV) is a vehicle powered wholly or partially by electricity using one or more electric motors instead of relying solely on an internal combustion engine. Electric vehicle adoption is increasing mainly due to growing environmental concerns, as governments and consumers are adopting cleaner electric transportation to reduce greenhouse gas emissions and air pollution. The growing adoption of electric vehicles drives demand for advanced semiconductor chips, increasing the need for high-precision wafer polishing and grinding equipment to manufacture ultra-thin, defect-free wafers. For instance, in April 2024, according to the International Energy Agency (IEA), a France-based intergovernmental organization, global electric car sales approached 14 million units, accounting for 18% of total car sales, up from 14% in 2022. In 2023, sales increased by 3.5 million units compared to the previous year, representing strong year-on-year growth of 35%. Therefore, the growing adoption of electric vehicles is driving the growth of the semiconductor wafer polishing and grinding equipment market.

Leading companies operating in the semiconductor wafer polishing and grinding equipment market are focusing on developing technological advancements such as silicon carbide (SiC) polishing solutions to improve surface quality, material removal precision, and manufacturing efficiency for next-generation semiconductor devices. Silicon carbide (SiC) polishing solutions refer to specialized polishing pads and abrasive suspensions designed to achieve ultra-smooth wafer surfaces and high-precision finishing during semiconductor wafer fabrication. For example, in October 2024, Pureon AG, a Switzerland-based manufacturer of precision abrasives and polishing solutions, launched the IRINO-PROSiC polishing pad and PURE-DS-RT suspension to enhance silicon carbide (SiC) semiconductor wafer polishing efficiency, surface quality, and precision thinning performance in advanced wafer manufacturing processes. Developed for advanced semiconductor manufacturing, the new solutions provide optimized polishing performance, enhanced surface finishing quality, and improved process consistency, supporting the production of high-performance SiC wafers used in power electronics, electric vehicles, and other advanced semiconductor applications.

In March 2026, ASM International N.V., a Netherlands-based semiconductor equipment manufacturer, acquired Axus Technology LLC for $88 million. Through this acquisition, ASM International aims to broaden its semiconductor equipment portfolio by adding chemical mechanical polishing (CMP) capabilities for compound semiconductor applications, more-than-Moore manufacturing, and emerging 3D integration technologies. Axus Technology LLC is a US-based semiconductor equipment manufacturer that develops and supplies wafer polishing and grinding equipment.

Major companies operating in the semiconductor wafer polishing and grinding equipment market are Applied Materials Inc., EBARA Corporation, Nagase Integrex Co. Ltd., Logitech Limited, DISCO Corporation, Okamoto Machine Tool Works Ltd., WAIDA MFG. Co. Ltd., Tokyo Seimitsu Co. Ltd., Engis Corporation, Koyo Machinery Co. Ltd., Revasum Inc., Daitron Incorporated, Hantop Intelligence Tech Co. Ltd., SpeedFam Co. Ltd., Qingdao Gaoce Technology Co. Ltd., G&N Genauigkeits Maschinenbau Nürnberg GmbH, Strausbaugh Inc.

North America was the dominant region in the semiconductor wafer polishing and grinding equipment market in 2025. Asia-Pacific is expected to be the rapidly growing region in the forecast period. The regions covered in the semiconductor wafer polishing and grinding equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the semiconductor wafer polishing and grinding equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

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