Global Advanced Packaging Technologies Market Analysis 2019

  • ID: 4751636
  • Report
  • Region: Global
  • 117 pages
  • Syngene Research
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FEATURED COMPANIES

  • 3M Company
  • Bemis Company, Inc.
  • Crown Holdings, Inc.
  • Landec Corporation
  • PakSense Inc.
  • SYSCO Corporation
  • MORE
The Global Advanced Packaging Technologies Market is expected to grow at a CAGR of 9.3% during the forecast period. Advanced packaging techniques use an integrated circuit (IC), which is encapsulated in a supporting case that prevents physical damage and corrosion of the metallic parts. Advanced packaging technologies include BGA, Flip-Chip, CSP, LGA, PGA and their derivate. These advanced-packaging technologies promise greater chip connectivity and lower power consumption compared with traditional packaging configurations. Growing trend of miniaturization is favouring the market growth. Lack of standardization will restrain the market growth.

By technology, active packaging is gaining traction for food packaging applications due to its properties that enhance shelf life and the ability to reflect properties of contained food on the packaging.

The key vendors mentioned are 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA, CCL Industries Inc., Sealed Air Corporation, Vitsab International AB, Landec Corporation, Timestrip U.K. Ltd., LCR Hallcrest LLC, Bemis Company, Inc., Temptime Corporation, Cryolog S.A. and SYSCO Corporation.

Technologies Covered:
  • Smart and Intelligent Packaging
  • Active Packaging
End Users Covered:
  • Pharmaceuticals
  • Cosmetics & Personal Care
  • Beverages
  • Food
  • Agriculture
  • Industrial & Chemicals
  • Other End Users
Regions Covered:
  • North America
  • Europe
  • Asia Pacific
  • South America
  • Middle East & Africa
Key Questions Answered in this Report:
  • How this market evolved since the year 2016
  • Market size estimations, forecasts and CAGR for all the segments presented in the scope
  • Key Market Developments and financials of the key players
  • Opportunity Analysis for the new entrants
  • SWOT Analysis of the key players
  • Fastest growing markets analysed during the forecast period.
Note: Product cover images may vary from those shown
2 of 4

FEATURED COMPANIES

  • 3M Company
  • Bemis Company, Inc.
  • Crown Holdings, Inc.
  • Landec Corporation
  • PakSense Inc.
  • SYSCO Corporation
  • MORE
1 Market Synopsis

2 Research Outline
2.1 Research Snapshot
2.2 Research Methodology
2.3 Research Sources
2.3.1 Primary Research Sources
2.3.2 Secondary Research Sources

3 Market Dynamics
3.1 Drivers
3.2 Restraints

4 Market Environment
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Technology
5.1 Introduction
5.2 Smart and Intelligent Packaging
5.3 Active Packaging

6 Global Advanced Packaging Technologies Market, By End User
6.1 Introduction
6.2 Pharmaceuticals
6.3 Cosmetics & Personal Care
6.4 Beverages
6.5 Food
6.6 Agriculture
6.7 Industrial & Chemicals
6.8 Other End Users

7 Global Advanced Packaging Technologies Market, By Geography
7.1 Introduction
7.2 North America
7.3 Europe
7.4 Asia Pacific
7.5 South America
7.6 Middle East & Africa

8 Strategic Benchmarking

9 Vendors Landscape
9.1 3M Company
9.2 Crown Holdings, Inc.
9.3 Amcor Limited
9.4 PakSense Inc.
9.5 Thin Film Electronics ASA
9.6 CCL Industries Inc.
9.7 Sealed Air Corporation
9.8 Vitsab International AB
9.9 Landec Corporation
9.10 Timestrip U.K. Ltd.
9.11 LCR Hallcrest LLC
9.12 Bemis Company, Inc.
9.13 Temptime Corporation
9.14 Cryolog S.A.
9.15 SYSCO Corporation

List of Data Tables
Table 1 Global Advanced Packaging Technologies Market Outlook, By Region (2016-2026) ($MN)
Table 2 Global Advanced Packaging Technologies Market Outlook, By Technology (2016-2026) ($MN)
Table 3 Global Advanced Packaging Technologies Market Outlook, By Smart and Intelligent Packaging (2016-2026) ($MN)
Table 4 Global Advanced Packaging Technologies Market Outlook, By Active Packaging (2016-2026) ($MN)
Table 5 Global Advanced Packaging Technologies Market Outlook, By End User (2016-2026) ($MN)
Table 6 Global Advanced Packaging Technologies Market Outlook, By Pharmaceuticals (2016-2026) ($MN)
Table 7 Global Advanced Packaging Technologies Market Outlook, By Cosmetics & Personal Care (2016-2026) ($MN)
Table 8 Global Advanced Packaging Technologies Market Outlook, By Beverages (2016-2026) ($MN)
Table 9 Global Advanced Packaging Technologies Market Outlook, By Food (2016-2026) ($MN)
Table 10 Global Advanced Packaging Technologies Market Outlook, By Agriculture (2016-2026) ($MN)
Table 11 Global Advanced Packaging Technologies Market Outlook, By Industrial & Chemicals (2016-2026) ($MN)
Table 12 Global Advanced Packaging Technologies Market Outlook, By Other End Users (2016-2026) ($MN)
Note: Product cover images may vary from those shown
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  • 3M Company
  • Crown Holdings, Inc.
  • Amcor Limited
  • PakSense Inc.
  • Thin Film Electronics ASA
  • CCL Industries Inc.
  • Sealed Air Corporation
  • Vitsab International AB
  • Landec Corporation
  • Timestrip U.K. Ltd.
  • LCR Hallcrest LLC
  • Bemis Company, Inc.
  • Temptime Corporation
  • Cryolog S.A.
  • SYSCO Corporation
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
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