The P9 camera module, with dimensions of 18 x 9.2 x 5.1mm, is equipped with two sub-modules each including a Sony CIS, a closed loop voice coil motor (VCM) and a 6-element lens. Doubling the number of cameras gives more light, vivid colors and crisper details. Moreover, it compensates for the fact that the module is provided without optical image stabilization (OIS). The CISs are assembled on a copper metal core 4-layer PCB using a wire bonding process. An external image processor chip is present on the phone’s printed circuit board (PCB).
The Sony Exmor-RS technology stacks two separate chips with through-silicon vias (TSVs) using optimized processes. One chip is a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and the other is a logic ISP circuit. For these sensors, an all-new TSV process is used and surprisingly both sensors are very similar but show significant process differences. Compared to the previous Huawei P8 and iPhone 6s with similar resolution, the P9’s 1.25µm pixels are larger.
The report includes technology and cost analyses of the P9 dual camera module. Also, comparisons with Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight structures, technical choices and manufacturing cost.
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation
Comparison with Capacitive Fingerprint Sensor