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Global Fan-out Wafer Level Packaging Market by Business Model (Foundry, IDM, OSAT), Carrier Type (200mm, 300mm, Panel), Type, End-User - Forecast 2024-2030

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    Report

  • 184 Pages
  • March 2024
  • Region: Global
  • 360iResearch™
  • ID: 4904690
1h Free Analyst Time
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The Fan-out Wafer Level Packaging Market size was estimated at USD 31.56 billion in 2023, USD 35.62 billion in 2024, and is expected to grow at a CAGR of 12.95% to reach USD 74.07 billion by 2030.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Fan-out Wafer Level Packaging Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Fan-out Wafer Level Packaging Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Fan-out Wafer Level Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, ASE Technology Holding Co, Ltd., Brewer Science, Inc., Camtek Ltd., Evatec AG, Infineon Technologies AG, Jiangsu Changdian Technology Co., Ltd., Nepes Corporation, NXP Semiconductors N.V., Renesas Electronics Corporation, Siemens AG, Siliconware Precision Industries Co., Ltd., SPTS Technologies Ltd., Taiwan Semiconductor Manufacturing Company, and Yield Engineering Systems.

Market Segmentation & Coverage

This research report categorizes the Fan-out Wafer Level Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Business Model
    • Foundry
    • IDM
    • OSAT
  • Carrier Type
    • 200mm
    • 300mm
    • Panel
  • Type
    • Core Fan-Out
    • High Density Fan-Out
  • End-User
    • Aerospace & Defense
    • Automotive
    • Consumer Electronics
    • Healthcare
    • Industrial
    • IT & Telecommunication
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects

  1. Market Penetration: It presents comprehensive information on the market provided by key players.
  2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.
  3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.
  4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.
  5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as

  1. What is the market size and forecast of the Fan-out Wafer Level Packaging Market?
  2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Fan-out Wafer Level Packaging Market?
  3. What are the technology trends and regulatory frameworks in the Fan-out Wafer Level Packaging Market?
  4. What is the market share of the leading vendors in the Fan-out Wafer Level Packaging Market?
  5. Which modes and strategic moves are suitable for entering the Fan-out Wafer Level Packaging Market?

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
4.1. Introduction
4.2. Fan-out Wafer Level Packaging Market, by Region
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing integration of electronic equipment in hybrid vehicles
5.1.1.2. Growing demand for high-power, miniaturized packaged integrated circuits
5.1.1.3. Rise in the popularity of compact electronic devices
5.1.2. Restraints
5.1.2.1. High cost associated with manufacturing
5.1.3. Opportunities
5.1.3.1. Technological advancements in the packaging industry
5.1.3.2. Growing number of product launches in fan-out wafer level packaging
5.1.4. Challenges
5.1.4.1. Shorter lifespan due to fluctuating coefficient of thermal expansion of materials
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter’s Five Forces Analysis
5.5.1. Threat of New Entrants
5.5.2. Threat of Substitutes
5.5.3. Bargaining Power of Customers
5.5.4. Bargaining Power of Suppliers
5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework
6. Fan-out Wafer Level Packaging Market, by Business Model
6.1. Introduction
6.2. Foundry
6.3. IDM
6.4. OSAT
7. Fan-out Wafer Level Packaging Market, by Carrier Type
7.1. Introduction
7.2. 200mm
7.3. 300mm
7.4. Panel
8. Fan-out Wafer Level Packaging Market, by Type
8.1. Introduction
8.2. Core Fan-Out
8.3. High Density Fan-Out
9. Fan-out Wafer Level Packaging Market, by End-User
9.1. Introduction
9.2. Aerospace & Defense
9.3. Automotive
9.4. Consumer Electronics
9.5. Healthcare
9.6. Industrial
9.7. IT & Telecommunication
10. Americas Fan-out Wafer Level Packaging Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States
11. Asia-Pacific Fan-out Wafer Level Packaging Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam
12. Europe, Middle East & Africa Fan-out Wafer Level Packaging Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom
13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.2. Market Share Analysis, By Key Player
13.3. Competitive Scenario Analysis, By Key Player
14. Competitive Portfolio
14.1. Key Company Profiles
14.1.1. Amkor Technology
14.1.2. ASE Technology Holding Co, Ltd.
14.1.3. Brewer Science, Inc.
14.1.4. Camtek Ltd.
14.1.5. Evatec AG
14.1.6. Infineon Technologies AG
14.1.7. Jiangsu Changdian Technology Co., Ltd.
14.1.8. Nepes Corporation
14.1.9. NXP Semiconductors N.V.
14.1.10. Renesas Electronics Corporation
14.1.11. Siemens AG
14.1.12. Siliconware Precision Industries Co., Ltd.
14.1.13. SPTS Technologies Ltd.
14.1.14. Taiwan Semiconductor Manufacturing Company
14.1.15. Yield Engineering Systems
14.2. Key Product Portfolio
15. Appendix
15.1. Discussion Guide
15.2. License & Pricing
List of Figures
FIGURE 1. FAN-OUT WAFER LEVEL PACKAGING MARKET RESEARCH PROCESS
FIGURE 2. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, 2023 VS 2030
FIGURE 3. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY REGION, 2023 VS 2030 (%)
FIGURE 5. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. FAN-OUT WAFER LEVEL PACKAGING MARKET DYNAMICS
FIGURE 7. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2023 VS 2030 (%)
FIGURE 8. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 9. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2023 VS 2030 (%)
FIGURE 10. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 11. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
FIGURE 12. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 13. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2023 VS 2030 (%)
FIGURE 14. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 15. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 16. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 17. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 18. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 19. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 20. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 21. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 22. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 23. FAN-OUT WAFER LEVEL PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
FIGURE 24. FAN-OUT WAFER LEVEL PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
List of Tables
TABLE 1. FAN-OUT WAFER LEVEL PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
TABLE 3. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 6. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY FOUNDRY, BY REGION, 2018-2030 (USD MILLION)
TABLE 7. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY IDM, BY REGION, 2018-2030 (USD MILLION)
TABLE 8. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY OSAT, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 10. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY 200MM, BY REGION, 2018-2030 (USD MILLION)
TABLE 11. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY 300MM, BY REGION, 2018-2030 (USD MILLION)
TABLE 12. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY PANEL, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 14. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CORE FAN-OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 15. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY HIGH DENSITY FAN-OUT, BY REGION, 2018-2030 (USD MILLION)
TABLE 16. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 17. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
TABLE 18. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
TABLE 19. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
TABLE 22. FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
TABLE 23. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 24. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 25. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 26. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 27. AMERICAS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 28. ARGENTINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 29. ARGENTINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 30. ARGENTINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 31. ARGENTINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 32. BRAZIL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 33. BRAZIL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 34. BRAZIL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 35. BRAZIL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 36. CANADA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 37. CANADA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 38. CANADA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 39. CANADA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 40. MEXICO FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 41. MEXICO FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 42. MEXICO FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 43. MEXICO FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 44. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 45. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 46. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 47. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 48. UNITED STATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 49. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 50. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 51. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 52. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 53. ASIA-PACIFIC FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 54. AUSTRALIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 55. AUSTRALIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 56. AUSTRALIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 57. AUSTRALIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 58. CHINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 59. CHINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 60. CHINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 61. CHINA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 62. INDIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 63. INDIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 64. INDIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 65. INDIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 66. INDONESIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 67. INDONESIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 68. INDONESIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 69. INDONESIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 70. JAPAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 71. JAPAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 72. JAPAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 73. JAPAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 74. MALAYSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 75. MALAYSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 76. MALAYSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 77. MALAYSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 78. PHILIPPINES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 79. PHILIPPINES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 80. PHILIPPINES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 81. PHILIPPINES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 82. SINGAPORE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 83. SINGAPORE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 84. SINGAPORE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 85. SINGAPORE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 86. SOUTH KOREA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 87. SOUTH KOREA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 88. SOUTH KOREA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 89. SOUTH KOREA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 90. TAIWAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 91. TAIWAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 92. TAIWAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 93. TAIWAN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 94. THAILAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 95. THAILAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 96. THAILAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 97. THAILAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 98. VIETNAM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 99. VIETNAM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 100. VIETNAM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 101. VIETNAM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 102. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 103. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 104. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 105. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 106. EUROPE, MIDDLE EAST & AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 107. DENMARK FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 108. DENMARK FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 109. DENMARK FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 110. DENMARK FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 111. EGYPT FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 112. EGYPT FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 113. EGYPT FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 114. EGYPT FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 115. FINLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 116. FINLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 117. FINLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 118. FINLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 119. FRANCE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 120. FRANCE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 121. FRANCE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 122. FRANCE FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 123. GERMANY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 124. GERMANY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 125. GERMANY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 126. GERMANY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 127. ISRAEL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 128. ISRAEL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 129. ISRAEL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 130. ISRAEL FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 131. ITALY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 132. ITALY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 133. ITALY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 134. ITALY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 135. NETHERLANDS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 136. NETHERLANDS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 137. NETHERLANDS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 138. NETHERLANDS FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 139. NIGERIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 140. NIGERIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 141. NIGERIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 142. NIGERIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 143. NORWAY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 144. NORWAY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 145. NORWAY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 146. NORWAY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 147. POLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 148. POLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 149. POLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 150. POLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 151. QATAR FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 152. QATAR FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 153. QATAR FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 154. QATAR FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 155. RUSSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 156. RUSSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 157. RUSSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 158. RUSSIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 159. SAUDI ARABIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 160. SAUDI ARABIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 161. SAUDI ARABIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 162. SAUDI ARABIA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 163. SOUTH AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 164. SOUTH AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 165. SOUTH AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 166. SOUTH AFRICA FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 167. SPAIN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 168. SPAIN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 169. SPAIN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 170. SPAIN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 171. SWEDEN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 172. SWEDEN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 173. SWEDEN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 174. SWEDEN FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 175. SWITZERLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 176. SWITZERLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 177. SWITZERLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 178. SWITZERLAND FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 179. TURKEY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 180. TURKEY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 181. TURKEY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 182. TURKEY FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 183. UNITED ARAB EMIRATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 184. UNITED ARAB EMIRATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 185. UNITED ARAB EMIRATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 186. UNITED ARAB EMIRATES FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 187. UNITED KINGDOM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY BUSINESS MODEL, 2018-2030 (USD MILLION)
TABLE 188. UNITED KINGDOM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY CARRIER TYPE, 2018-2030 (USD MILLION)
TABLE 189. UNITED KINGDOM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
TABLE 190. UNITED KINGDOM FAN-OUT WAFER LEVEL PACKAGING MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
TABLE 191. FAN-OUT WAFER LEVEL PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
TABLE 192. FAN-OUT WAFER LEVEL PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
TABLE 193. FAN-OUT WAFER LEVEL PACKAGING MARKET LICENSE & PRICING

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Amkor Technology
  • ASE Technology Holding Co, Ltd.
  • Brewer Science, Inc.
  • Camtek Ltd.
  • Evatec AG
  • Infineon Technologies AG
  • Jiangsu Changdian Technology Co., Ltd.
  • Nepes Corporation
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • Siemens AG
  • Siliconware Precision Industries Co., Ltd.
  • SPTS Technologies Ltd.
  • Taiwan Semiconductor Manufacturing Company
  • Yield Engineering Systems

Methodology

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Table Information

Report AttributeDetails
No. of Pages184
PublishedMarch 2024
Forecast Period2024 - 2030
Estimated Market Value ( USD ) in 2024 $ 35.62 Billion
Forecasted Market Value ( USD ) by 2030 $ 74.07 Billion
Compound Annual Growth Rate12.9%
Regions CoveredGlobal

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About the Fan Out WLP Market

The Fan Out WLP market is a segment of the semiconductor industry that focuses on the production of fan-out wafer-level packages (FOWLP). These packages are used to integrate multiple components into a single package, allowing for a smaller form factor and higher performance. FOWLP technology is used in a variety of applications, including mobile phones, tablets, and other consumer electronics. The Fan Out WLP market is expected to experience strong growth in the coming years, driven by the increasing demand for smaller, more powerful devices. This growth is expected to be driven by the increasing demand for consumer electronics, as well as the need for higher performance in a variety of applications. Some of the major players in the Fan Out WLP market include ASE Group, STATS ChipPAC, Amkor Technology, and Powertech Technology. These companies are leading the way in the development and production of FOWLP technology, and are expected to continue to be major players in the market in the coming years. Show Less Read more

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