North America Chiplet Market Size, Share & Industry Trends Analysis Report By Processor, By End-use, By Packaging Technology, By Country and Growth Forecast, 2023 - 2030

The North America Chiplet Market would witness market growth of 74.5% CAGR during the forecast period (2023-2030).

The demand for chiplets is driven by the need for a more cost-effective solution for semiconductor designs, reuse of IP (Internet Protocol), and new test flows. Companies in the market are considering cost reduction when dying functions such as I/O (input/output) control are split out. Since this die, procedures are more challenging to scale, and cost reduction is being achieved by chip integration. With chips divided into two, developers can stack the split chips to provide further cost reduction. Such findings translate into revenue opportunities for stakeholders in the market since chip partitioning improves time-to-market. The exponential growth of the consumer electronics sector is gaining the attention of manufacturers in the market.

Technological progress in semiconductor manufacturing and design has been a primary driver of the chiplet market. Advancements in process technology and packaging techniques have made it possible to create smaller, more efficient chiplets. The growing emphasis on energy efficiency, especially in power-hungry industries like data centers, has driven the adoption of chiplets to optimize performance while reducing power consumption. Efforts to establish industry standards for chiplet interfaces and interconnect technologies can accelerate the growth and adoption of chiplet technology by ensuring interoperability and performance optimization. These factors, among others, continue to shape the chiplet market, driving innovation and expanding its presence in various industries and applications. As technology advances, the market is expected to evolve further.

According to Select USA, the United States has one of the largest automotive sectors globally. In 2020, 14.5 million light vehicles were sold in the United States. The United States has the second-largest vehicle sales and manufacturing industry globally. In 2020, international manufacturers produced five million vehicles in the United States, according to Autos Drive America. The adoption of chiplets in the US automotive sector is driven by the need to offer consumers advanced features, improved safety, energy efficiency, and enhanced driving experiences. As vehicle manufacturers continue integrating more sophisticated technologies into their products, the chiplet demand is poised to expand further to meet these evolving automotive requirements.

According to the International Trade Administration (ITA), in 2021, Mexico imported USD 5.9 billion in medical devices. The growth of the medical devices industry in Mexico offers significant opportunities for integrating chiplet technology, which can enhance the capabilities, efficiency, and accuracy of medical devices and systems. This can lead to improved healthcare delivery, patient outcomes, and the country's overall quality of medical care and contribute to the growing demand for the chiplet. The above-mentioned factors will contribute to expanding the market growth in this region.

The US market dominated the North America Chiplet Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $70,146 million by 2030. The Canada market is exhibiting a CAGR of 78.5% during (2023 - 2030). Additionally, The Mexico market would experience a CAGR of 76.9% during (2023 - 2030).

Based on Processor, the market is segmented into Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), AI-ASIC Coprocessor, and Application Processing Unit (APU). Based on End-use, the market is segmented into Enterprise Electronics, Consumer Electronics, Industrial Automation, Automotive, Healthcare, Military & Aerospace, and Others. Based on Packaging Technology, the market is segmented into2.5D/3D, System-in-Package (SiP), Wafer-Level Chip Scale Package (WLCSP), Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), and Fan-Out (FO). Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Advanced Micro Devices, Inc., Apple Inc., IBM Corporation, Marvell Technology Group Ltd., MediaTek, Inc., NVIDIA Corporation, Achronix Semiconductor Corporation, ASE Technology Holding Co., Ltd. (ASE Group), and NXP Semiconductors N.V.

Scope of the Study

Market Segments Covered in the Report:

By Processor

• Central Processing Unit (CPU)
• Graphics Processing Unit (GPU)
• Field-Programmable Gate Array (FPGA)
• AI-ASIC Coprocessor
• Application Processing Unit (APU)

By End-use

• Enterprise Electronics
• Consumer Electronics
• Industrial Automation
• Automotive
• Healthcare
• Military & Aerospace
• Others

By Packaging Technology

• 2.5D/3D
• System-in-Package (SiP)
• Wafer-Level Chip Scale Package (WLCSP)
• Flip Chip Chip Scale Package (FCCSP)
• Flip Chip Ball Grid Array (FCBGA)
• Fan-Out (FO)

By Country

• US
• Canada
• Mexico
• Rest of North America

Key Market Players

List of Companies Profiled in the Report:

• Intel Corporation
• Advanced Micro Devices, Inc.
• Apple Inc.
• IBM Corporation
• Marvell Technology Group Ltd.
• MediaTek, Inc.
• NVIDIA Corporation
• Achronix Semiconductor Corporation
• ASE Technology Holding Co., Ltd. (ASE Group)
• NXP Semiconductors N.V.

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