Advanced Packaging Technologies Market Report 2026

The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $8.03 billion in 2025 to $9.18 billion in 2026 at a compound annual growth rate (CAGR) of 14.2%. The growth in the historic period can be attributed to increasing complexity of semiconductor designs, rising demand for compact electronic devices, growth in high-performance computing applications, expansion of consumer electronics production, advancements in wafer-level packaging technologies.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $15.82 billion in 2030 at a compound annual growth rate (CAGR) of 14.6%. The growth in the forecast period can be attributed to increasing adoption of heterogeneous integration, rising investments in domestic semiconductor manufacturing, growing demand from automotive electronics, higher focus on energy-efficient chip designs, expansion of advanced node packaging technologies. Major trends in the forecast period include increasing adoption of 3d ic stacking techniques, rising use of fan-out wafer level packaging, growing demand for system-in-package solutions, higher focus on miniaturization and heterogeneous integration, improved thermal management and reliability designs.

Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to electronic equipment, gadgets, or devices intended for regular personal use rather than commercial or professional purposes. These products generate demand for advanced packaging, as packaging plays a key role in determining the sophistication and functionality of the devices. For example, in May 2023, according to the Japan Electronics and Information Technology Industries Association, Japan’s electronic equipment output reached 771,457 units. Consumer electronics production rose to 32,099 units, up from 25,268 units in May 2022. Therefore, the rising demand for consumer electronics is driving the growth of the advanced packaging market.

Major companies operating in the advanced packaging technologies sector are focused on developing technological innovations in advanced packaging to strengthen their position in semiconductor solutions. These technological innovations incorporate new methods, materials, and equipment to enhance packaging efficiency, improve product protection, and increase functionality through smart features, automation, or sustainability enhancements. For instance, in October 2023, ASE Group, a Taiwan-based semiconductor engineering company, introduced the Integrated Design Ecosystem, which improves silicon package design efficiency by reducing cycle times by half. The ecosystem supports enhanced collaboration and optimization throughout the design process, enabling faster iterations and better performance in advanced packaging solutions. This advancement supports the growing need for high-density packaging in applications such as artificial intelligence (AI), high-performance computing, and data centers.

In April 2025, Applied Materials Inc., a US-based semiconductor equipment supplier, acquired a 9% stake in BE Semiconductor Industries (BESI) for an undisclosed amount. The acquisition aims to strengthen collaboration between the two companies on hybrid-bonding technology, a key element of advanced semiconductor packaging that enables direct copper-to-copper chip connections to deliver improved performance, energy efficiency, and compact architectures for next-generation logic and memory devices. BE Semiconductor Industries (BESI) is a Netherlands-based manufacturer specializing in advanced chip-packaging equipment.

Major companies operating in the advanced packaging technologies market are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems.

Asia-Pacific was the largest region in global advanced packaging technologies market in 2025. The regions covered in the advanced packaging technologies market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the advanced packaging technologies market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced packaging technologies market consists of revenues earned by entities by providing packaging services such as fan-out wafer-level packaging and system-in-package used during the process. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced packaging technologies market also includes sales of image sensor, microelectronics, complementary metal oxide semiconductor, light-emitting diode, design package, external cavity, ultraviolet light, and others which are used in providing packaging services. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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