System-in-Package (SiP) Technology: Global Strategic Business Report

Report
277 Pages
November 2023
Region: Global
Global Industry Analysts, Inc
ID: 2255359

Quick Summary:

In this ever-evolving world, the need for technological advancements is utmost. Push the boundaries of your vision with an insightful glance into the future of the System-in-Package (SiP) Technology market. This comprehensive market research report is your key to unlock new possibilities and efficiently stride towards strategic growth. With the global SiP market predicted to reach a promising $58 Billion by 2030, the report throws an illuminating spotlight on growth trends, market possibilities, and potential challenges you might face.

Moreover, the report provides an analysis of segment-specific growth, considering factors like the post-pandemic recovery. If you seek significant investment decisions or innovative implementation plans, this professional report is indispensable. Make well-informed decisions with insights resting at the intersection of accuracy and relevancy. Let this market research report be your compass guiding you through the changing landscapes of the SiP technology market.

Global System-in-Package (SiP) Technology Market to Reach $58 Billion by 2030

The global market for System-in-Package (SiP) Technology estimated at US$26 Billion in the year 2022, is projected to reach a revised size of US$58 Billion by 2030, growing at a CAGR of 10.6% over the analysis period 2022-2030. 2.5-D IC, one of the segments analyzed in the report, is projected to record 10.4% CAGR and reach US$27.2 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 2-D IC segment is readjusted to a revised 8% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7.1 Billion, While China is Forecast to Grow at 15.7% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$7.1 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$14 Billion by the year 2030 trailing a CAGR of 15.7% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.7% and 9.4% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.9% CAGR.

Select Competitors (Total 49 Featured) -

Amkor Technology Inc.
ChipMOS Technologies Inc.
Fujitsu Limited
GS Nanotech
Insight SiP
Intel Corporation
Jiangsu Changjiang Electronics Technology Co. Ltd.
Powertech Technologies Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
Si2 Microsystems Private Limited
STATS ChipPAC Ltd.

What's New?

Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
Global competitiveness and key competitor percentage market shares
Market presence across multiple geographies - Strong/Active/Niche/Trivial
Online interactive peer-to-peer collaborative bespoke updates
Access to digital archives and Research Platform
Complimentary updates for one year

Frequently Asked Questions about the Global Market for System-in-Package (SiP) Technology

What is the estimated value of the Global Market for System-in-Package (SiP) Technology?

The Global Market for System-in-Package (SiP) Technology was estimated to be valued at $23.3 Billion in 2020.

What is the growth rate of the Global Market for System-in-Package (SiP) Technology?

The growth rate of the Global Market for System-in-Package (SiP) Technology is 9.1%, with an estimated value of $43 Billion by 2027.

What is the forecasted size of the Global Market for System-in-Package (SiP) Technology?

The Global Market for System-in-Package (SiP) Technology is estimated to be worth $43 Billion by 2027.

Who are the key companies in the Global Market for System-in-Package (SiP) Technology?

Key companies in the Global Market for System-in-Package (SiP) Technology include Amkor Technology Inc., ChipMOS Technologies Inc., Fujitsu Limited, GS Nanotech, Insight SiP, Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technologies Inc., Renesas Electronics Corporation and Samsung Electronics Co., Ltd..

Report Attribute	Details
No. of Pages	277
Published	November 2023
Forecast Period	2020 - 2027
Estimated Market Value ( USD ) in 2020	$ 23.3 Billion
Forecasted Market Value ( USD ) by 2027	$ 43 Billion
Compound Annual Growth Rate	9.1%
Regions Covered	Global

I. METHODOLOGYII. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Influencer Market Insights
World Market Trajectories
Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
Recent Market Activity
Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
Developing Countries Offer Growth Prospects
Flip Chip Type of Interconnection Technology Leads SiP Technology Market
Consumer Electronics Sector Fuels Revenue Growth in SiP Market
Portable Electronic Devices Stir Demand for Flat Packaging
2.5D IC Packaging Technology Dominates SiP Market
Challenges Confronting the SiP Market
System-in-Package (SiP) Technology - Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

Amkor Technology, Inc. (USA)
ASE Group (Taiwan)
ChipMOS Technologies Inc. (Taiwan)
Fujitsu Limited (Japan)
GS Nanotech (Russia)
Insight SiP (France)
Intel Corporation (USA)
Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
Kulicke & Soffa Pte Ltd. (Singapore)
Nanium S.A. (Portugal)
O.C.E. Technology Ltd. (Ireland)
Powertech Technologies, Inc. (Taiwan)
Renesas Electronics Corporation (Japan)
Samsung Electronics Co., Ltd. (South Korea)
ShunSin Technology (Zhongshan) Limited (China)
Si2 Microsystems Private Limited (India)
Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
STATS ChipPAC Ltd. (Singapore)
Unimicron Corporation (Taiwan)

3. MARKET TRENDS & DRIVERS

Importance of SiP Technology in Electronics
Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
List of Select SiP Solutions for Connected Devices
Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
Growing Sales of Smartphones Bode Well for SiP Market
Growing Demand for Tablet PCs - A Key Growth Driver
Applications in Set Top Boxes Boosts Demand for SiP Technology
Computing Devices - A Key Growth Driver
IoT Opens New Growth Avenues for SiP
TSVs for Die-to-Die/Die-to-Package Substrate Communication
Advanced Nodes Demand Innovative Package Technologies
PCB Considerations Vital for Using SiP in IoT Systems
WLCSP for Compact Form Factors
Trend Towards Smart Homes Offers Growth Opportunities
Miniaturization of Electronics - A Major Growth Driver for SiP
Need for Compact and High Speed Performance Products Spurs Market Growth
Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
SMBs Spur the Adoption of SiP
Expanding Applications in Non- Battery Operated Systems Spur Market Growth
SoC Design Complexities Bring Focus onto SiP
Combined SoC and SiP Technology Gains Increased Demand
Need to Reduce Cost Per Function of ICs Boosts Market Demand
Advanced SiP Packaging Transforming System-Level Integration Landscape
Wafer-Based Advanced SiP
Laminate-based Advanced SiP
SiP Technology to Impact Fan-In Packaging Platform
Foundries Focus on Offering Turnkey Services with System-in-Package
Vendors Offer Advanced Capabilities for SiP Design

4. GLOBAL MARKET PERSPECTIVE

Table 1: World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 2: World Historic Review for System-in-Package (SiP) Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 3: World 16-Year Perspective for System-in-Package (SiP) Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2023 & 2030
Table 4: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 5: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 6: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 7: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 8: World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 9: World 16-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 10: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 11: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 12: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 13: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 14: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 15: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 16: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 17: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 18: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 20: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 21: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 22: World Recent Past, Current & Future Analysis for 2.5-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 23: World Historic Review for 2.5-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 24: World 16-Year Perspective for 2.5-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 25: World Recent Past, Current & Future Analysis for 2-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 26: World Historic Review for 2-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 27: World 16-Year Perspective for 2-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 28: World Recent Past, Current & Future Analysis for 3-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 29: World Historic Review for 3-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 30: World 16-Year Perspective for 3-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 31: World Recent Past, Current & Future Analysis for Flip Chip by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 32: World Historic Review for Flip Chip by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 33: World 16-Year Perspective for Flip Chip by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 34: World Recent Past, Current & Future Analysis for Wire Bond & Die Attach by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 35: World Historic Review for Wire Bond & Die Attach by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 36: World 16-Year Perspective for Wire Bond & Die Attach by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 37: World Recent Past, Current & Future Analysis for FOWLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 38: World Historic Review for FOWLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
Table 39: World 16-Year Perspective for FOWLP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2023 & 2030
Table 40: World System-in-Package (SiP) Technology Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

UNITED STATES

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)

CANADA

JAPAN

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)

CHINA

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)

EUROPE

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)

FRANCE

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)

GERMANY

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)

ITALY

UNITED KINGDOM

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)

SPAINRUSSIAREST OF EUROPE

ASIA-PACIFIC

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)

AUSTRALIA

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)

INDIA

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)

SOUTH KOREAREST OF ASIA-PACIFIC

LATIN AMERICA

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)

ARGENTINABRAZILMEXICOREST OF LATIN AMERICA

MIDDLE EAST

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)

IRANISRAELSAUDI ARABIAUNITED ARAB EMIRATESREST OF MIDDLE EAST

AFRICA

System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)

IV. COMPETITION

Companies Mentioned

A selection of companies mentioned in this report includes:

Amkor Technology Inc.
ChipMOS Technologies Inc.
Fujitsu Limited
GS Nanotech
Insight SiP
Intel Corporation
Jiangsu Changjiang Electronics Technology Co. Ltd.
Powertech Technologies Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
Si2 Microsystems Private Limited
STATS ChipPAC Ltd.

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Quick Summary:

Global System-in-Package (SiP) Technology Market to Reach $58 Billion by 2030

The U.S. Market is Estimated at $7.1 Billion, While China is Forecast to Grow at 15.7% CAGR

Select Competitors (Total 49 Featured) -

What's New?

What is the estimated value of the Global Market for System-in-Package (SiP) Technology?

What is the growth rate of the Global Market for System-in-Package (SiP) Technology?

What is the forecasted size of the Global Market for System-in-Package (SiP) Technology?

Who are the key companies in the Global Market for System-in-Package (SiP) Technology?

Table of Contents

Companies Mentioned

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