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System-in-Package (SiP) Technology - Global Strategic Business Report

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    Report

  • 277 Pages
  • May 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 2255359

Global System-in-Package (SiP) Technology Market to Reach $58 Billion by 2030

The global market for System-in-Package (SiP) Technology estimated at US$33.9 Billion in the year 2023, is projected to reach a revised size of US$58 Billion by 2030, growing at a CAGR of 8% over the analysis period 2023-2030. 2.5-D IC Packaging, one of the segments analyzed in the report, is expected to record a 7.8% CAGR and reach US$27.2 Billion by the end of the analysis period. Growth in the 2-D IC Packaging segment is estimated at 6% CAGR for the next 7-year period.

The U.S. Market is Estimated at $8.9 Billion, While China is Forecast to Grow at 11.6% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$8.9 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$14 Billion by the year 2030 trailing a CAGR of 11.6% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.3% and 7.2% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$8.4 Billion by the year 2030.

Report Features

  • Full access to influencer engagement stats
  • Free access to digital archives & research platform. The proprietary platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. The state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
  • Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
  • Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
  • Complimentary report updates for one year
  • Competitor coverage with global market shares of major players
  • Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
  • Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 49 Featured):

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
  • Recent Market Activity
  • Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
  • Developing Countries Offer Growth Prospects
  • Flip Chip Type of Interconnection Technology Leads SiP Technology Market
  • Consumer Electronics Sector Fuels Revenue Growth in SiP Market
  • PorTable Electronic Devices Stir Demand for Flat Packaging
  • 2.5D IC Packaging Technology Dominates SiP Market
  • Challenges Confronting the SiP Market
  • System-in-Package (SiP) Technology - Global Key Competitors Percentage Market Share in 2024 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • Global Economic Update
2. FOCUS ON SELECT PLAYERS
  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • ChipMOS Technologies Inc. (Taiwan)
  • Fujitsu Limited (Japan)
  • GS Nanotech (Russia)
  • Insight SiP (France)
  • Intel Corporation (USA)
  • Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
  • Kulicke & Soffa Pte Ltd. (Singapore)
  • Nanium S.A. (Portugal)
  • O.C.E. Technology Ltd. (Ireland)
  • Powertech Technologies, Inc. (Taiwan)
  • Renesas Electronics Corporation (Japan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • ShunSin Technology (Zhongshan) Limited (China)
  • Si2 Microsystems Private Limited (India)
  • Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
  • STATS ChipPAC Ltd. (Singapore)
  • Unimicron Corporation (Taiwan)
3. MARKET TRENDS & DRIVERS
  • Importance of SiP Technology in Electronics
  • Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
  • List of Select SiP Solutions for Connected Devices
  • Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
  • Growing Sales of Smartphones Bode Well for SiP Market
  • Growing Demand for Tablet PCs - A Key Growth Driver
  • Applications in Set Top Boxes Boosts Demand for SiP Technology
  • Computing Devices - A Key Growth Driver
  • IoT Opens New Growth Avenues for SiP
  • TSVs for Die-to-Die/Die-to-Package Substrate Communication
  • Advanced Nodes Demand Innovative Package Technologies
  • PCB Considerations Vital for Using SiP in IoT Systems
  • WLCSP for Compact Form Factors
  • Trend Towards Smart Homes Offers Growth Opportunities
  • Miniaturization of Electronics - A Major Growth Driver for SiP
  • Need for Compact and High Speed Performance Products Spurs Market Growth
  • Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
  • SMBs Spur the Adoption of SiP
  • Expanding Applications in Non- Battery Operated Systems Spur Market Growth
  • SoC Design Complexities Bring Focus onto SiP
  • Combined SoC and SiP Technology Gains Increased Demand
  • Need to Reduce Cost Per Function of ICs Boosts Market Demand
  • Advanced SiP Packaging Transforming System-Level Integration Landscape
  • Wafer-Based Advanced SiP
  • Laminate-based Advanced SiP
  • SiP Technology to Impact Fan-In Packaging Platform
  • Foundries Focus on Offering Turnkey Services with System-in-Package
  • Vendors Offer Advanced Capabilities for SiP Design
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for System-in-Package (SiP) Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 2: World Historic Review for System-in-Package (SiP) Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 3: World 16-Year Perspective for System-in-Package (SiP) Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2024 & 2030
  • Table 4: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 5: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 6: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 7: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 8: World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 9: World 16-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 10: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 11: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 12: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 13: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 14: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 15: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 16: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 17: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 18: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 20: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 21: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 22: World Recent Past, Current & Future Analysis for 2.5-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 23: World Historic Review for 2.5-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 24: World 16-Year Perspective for 2.5-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 25: World Recent Past, Current & Future Analysis for 2-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 26: World Historic Review for 2-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 27: World 16-Year Perspective for 2-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 28: World Recent Past, Current & Future Analysis for 3-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 29: World Historic Review for 3-D IC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 30: World 16-Year Perspective for 3-D IC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 31: World Recent Past, Current & Future Analysis for Flip Chip by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 32: World Historic Review for Flip Chip by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 33: World 16-Year Perspective for Flip Chip by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 34: World Recent Past, Current & Future Analysis for Wire Bond & Die Attach by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 35: World Historic Review for Wire Bond & Die Attach by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 36: World 16-Year Perspective for Wire Bond & Die Attach by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 37: World Recent Past, Current & Future Analysis for FOWLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 38: World Historic Review for FOWLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
  • Table 39: World 16-Year Perspective for FOWLP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2024 & 2030
  • Table 40: World System-in-Package (SiP) Technology Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
III. MARKET ANALYSIS
UNITED STATES
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
CANADA
JAPAN
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
CHINA
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
EUROPE
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
FRANCE
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
GERMANY
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
ITALY
UNITED KINGDOM
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
SPAINRUSSIAREST OF EUROPE
ASIA-PACIFIC
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
AUSTRALIA
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2024 (E)
INDIA
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2024 (E)
SOUTH KOREAREST OF ASIA-PACIFIC
LATIN AMERICA
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2024 (E)
ARGENTINABRAZILMEXICOREST OF LATIN AMERICA
MIDDLE EAST
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2024 (E)
IRANISRAELSAUDI ARABIAUNITED ARAB EMIRATESREST OF MIDDLE EAST
AFRICA
  • System-in-Package (SiP) Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2024 (E)
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.

Table Information