IC Sockets - Global Strategic Business Report

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-3
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3
IC Sockets I-3
1. Dual In-Line Memory Module (DIMM) Sockets I-3
2. Production Sockets I-4
3. Test/Burn-in Sockets I-4
4. Other Sockets I-4

II. Executive Summary

1. INDUSTRY OVERVIEW II-1
Preface II-1
Global Outlook II-1
Analysis by Region II-1
Analysis by Product Segment II-2
Impact of Recession on IC Sockets Market II-2
Changing Market Dynamics II-2
Evolving IC Sockets Market II-3
Evolving Production IC Sockets Segment II-3
Test and Burn-In Sockets Segment to Witness New Developments II-4
IC Socket Industry Witnesses Growth of EMS Companies II-4
Connector Industry II-4

2. PRODUCT OVERVIEW II-6
Introduction II-6
IC Sockets II-6
Performance Specifications II-6
Components of IC Socket II-7
Contact Designs Used in IC Sockets II-7
Types of IC Sockets II-7
Dual In-Line Memory Module (DIMM) Sockets II-8
Production Sockets II-8
Plastic Leaded Chip Carrier (PLCC) Socket II-8
Pin Grid Array (PGA) Socket II-9
Land Grid Array (LGA) Socket II-9
Test/Burn-in Sockets II-9
Other Sockets II-9
Dual In-Line Package (DIP) Socket II-9
Ball Grid Array (BGA) Socket II-9
Specialty Socket II-10
Interposer II-10
Advantages of IC Sockets II-10
Cost Savings II-11
Component Repair and Replacement II-11
Avoidance of Direct Soldering II-11
Flexibility in Assembly, IC Design, and Supply-Chain Management II-11
Component Exchange and Upgrade II-12
Component Burn-in and Test II-12
Disadvantages of IC Sockets II-13
End-Use Applications of IC Sockets II-13
Services and Products Associated with IC Sockets II-13
IC Sockets and Interconnect Components II-13
IC Package Converters and Adapters II-14
PCB Pins and Receptacles II-14
IC Pin Probes II-14

3. PRODUCT INTRODUCTIONS/INNOVATIONS II-15
Ironwood Electronics Launches a Range of New BGA Sockets II-15
Ironwood Electronics Introduces New QFN Socket II-16
Ironwood Electronics Launches High Performance BGA Socket II-16
Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range II-16
Plastronics Launches ES Socket System II-17
Thermaltake Unveils New CPU Cooler with Multiple Sockets II-17
Fujitsu Launches SMT DDR2 DIMM Socket II-18
Emulation Unveils Novel Socket System II-18
MIPS Technologies Unveils Novel Instruction Set and Cores II-19
Aries Electronics Launches CSP/BallNest Hybrid Socket II-19
MiniATE Systems Introduces ET 2300 Socket System II-19
Sullins Connector Solutions Extends Insulation Displacement
Connector Portfolio II-20
Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series II-20
Intel Launches Nehalem Based Processors and LGA Sockets II-21
Quadrant Rolls Out Semitron® MDS 100 II-21
Atmel Introduces New Expansion, Routing and Socket Cards II-21
Tyco Electronics Introduces New Range of RFI Filter Connectors II-22

4. RECENT INDUSTRY ACTIVITY II-23
Molex Sockets Earn Intel® Validation II-23
Semiconductor Test Group Merges with Multitest elektronische
Systeme and Harbor Electronics II-23
KLA Tencor Acquires ICOS Vision Systems II-23

5. FOCUS ON SELECT GLOBAL PLAYERS II-25
3M Company (US) II-25
Aries Electronics, Inc. (US) II-25
Chupond Precision Co., Ltd. (Taiwan) II-26
Enplas Corporation (Japan) II-26
FCI (France) II-26
Foxconn Technology Group (Taiwan) II-26
Johnstech International Corporation (US) II-27
Loranger International Corporation (US) II-27
Mill-Max Mfg. Corporation (US) II-27
Molex, Inc. (US) II-27
Plastronics Socket Company, Inc. (US) II-28
Sensata Technologies B.V. (The Netherlands) II-28
Tyco Electronics Ltd. (Switzerland) II-29
Win Way Technology Co., Ltd. (Taiwan) II-29
Yamaichi Electronics Co., Ltd. (Japan) II-29

6. GLOBAL MARKET PERSPECTIVE II-30
Table 1: World Recent Past, Current and Future Analysis for IC
Sockets by Geographic Region - North America, Japan, Europe,
Asia-Pacific and Rest of World Markets Independently Analyzed
with Annual Sales in US$ Million for Years 2006 through 2015
(includes corresponding Graph/Chart) II-30

Table 2: World 10-Year Perspective for IC Sockets by
Geographic Region - Percentage Breakdown of Dollar Sales for
North America, Japan, Europe, Asia-Pacific and Rest of World
Markets for Years 2006, 2009 and 2015 (includes corresponding
Graph/Chart) II-31

Table 3: World Recent Past, Current & Future Analysis for IC
Sockets by Product Segment - Dual In-Line Memory Module
Sockets, Production Sockets, Test/Burn-in Sockets, and Other
IC Socket Markets Independently Analyzed with Annual Sales in
US$ Million for Years 2006 through 2015 (includes
corresponding Graph/Chart) II-32

Table 4: World 10-Year Perspective for IC Sockets by Product
Segment - Percentage Breakdown of Dollar Sales for Dual
In-Line Memory Module Sockets, Production Sockets,
Test/Burn-in Sockets, and Other IC Socket Markets for Years
2006, 2009 & 2015 (includes corresponding Graph/Chart) II-33

III. MARKET

1. NORTH AMERICA III-1
A.Market Analysis III-1
Current and Future Analysis III-1
Impact of Recession on IC Sockets Market III-1
Product Launches/Developments III-1
Strategic Corporate Developments III-7
Select US Players III-8
B.Market Analytics III-11
Table 5: North American Recent Past, Current and Future
Analysis for IC Sockets with Annual Sales Figures in US$
Million for Years 2006 through 2015 (includes corresponding
Graph/Chart) III-11

2. JAPAN III-12
A.Market Analysis III-12
Current and Future Analysis III-12
Select Players III-12
B.Market Analytics III-13
Table 6: Japanese Recent Past, Current and Future Analysis
for IC Sockets with Annual Sales Figures in US$ Million for
Years 2006 through 2015 (includes corresponding Graph/Chart) III-13

3. EUROPE III-14
A.Market Analysis III-14
Current and Future Analysis III-14
Product Launch III-14
Strategic Corporate Development III-14
Select Players III-15
B.Market Analytics III-17
Table 7: European Recent Past, Current and Future Analysis
for IC Sockets with Annual Sales Figures in US$ Million for
Years 2006 through 2015 (includes corresponding Graph/Chart) III-17

4. ASIA-PACIFIC III-18
A.Market Analysis III-18
Current and Future Analysis III-18
Product Launches/Developments III-18
Select Players III-20
B.Market Analytics III-21
Table 8: Asia-Pacific Recent Past, Current and Future
Analysis for IC Sockets by Geographic Region - China and
Rest of Asia-Pacific Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2006 through
2015 (includes corresponding Graph/Chart) III-21

Table 9: Asia-Pacific 10-Year Perspective for IC Sockets by
Geographic Region - Percentage Breakdown of Dollar Sales for
China and Rest of Asia-Pacific Markets for Years 2006, 2009
and 2015 III-21

5. REST OF WORLD III-22
Market Analysis III-22
Table 10: Rest of World Recent Past, Current and Future
Analysis for IC Sockets with Annual Sales Figures in US$
Million for Years 2006 through 2015 (includes corresponding
Graph/Chart) III-22

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 44 (including Divisions/Subsidiaries - 46)

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Region/Country Players

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The United States 16
Japan 5
Europe 7
France 1
Germany 2
The United Kingdom 1
Rest of Europe 3
Asia-Pacific (Excluding Japan) 18

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