IC Sockets - Global Strategic Business Report

  • ID: 1382358
  • Report
  • Region: Global
  • 191 Pages
  • Global Industry Analysts, Inc
1 of 4

FEATURED COMPANIES

  • 3M Company (US)
  • FCI (France)
  • Molex, Inc. (US)
  • MORE
This report analyzes the Global market for IC Sockets in US$ Million by the following product segments: Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Others. Regional IC Sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment. Annual estimates and forecasts are provided for the period 2006 through 2015. The report profiles 44 companies including many key and niche players such as 3M Company, Aries Electronics, Inc., Chupond Precision Co., Ltd., Enplas Corporation, FCI, Foxconn Technology Group, Johnstech International Corporation, Loranger International Corporation, Mill-Max Mfg. Corporation, Molex, Inc., Plastronics Socket Company, Inc., Sensata Technologies B.V., Tyco Electronics Ltd., Win Way Technology Co., Ltd., and Yamaichi Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Please note: Reports are sold as single-site single-user licenses. The delivery time for hard copies is between 3-5 business days, as each hard copy is custom printed for the organization ordering it. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks.

For information on site licence pricing please click on Enquire before buying
Note: Product cover images may vary from those shown
2 of 4

FEATURED COMPANIES

  • 3M Company (US)
  • FCI (France)
  • Molex, Inc. (US)
  • MORE
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-3
Quantitative Techniques & Analytics I-3
Product Definitions and Scope of Study I-3
IC Sockets I-3
1. Dual In-Line Memory Module (DIMM) Sockets I-3
2. Production Sockets I-4
3. Test/Burn-in Sockets I-4
4. Other Sockets I-4

II. Executive Summary

1. INDUSTRY OVERVIEW II-1
Preface II-1
Global Outlook II-1
Analysis by Region II-1
Analysis by Product Segment II-2
Impact of Recession on IC Sockets Market II-2
Changing Market Dynamics II-2
Evolving IC Sockets Market II-3
Evolving Production IC Sockets Segment II-3
Test and Burn-In Sockets Segment to Witness New Developments II-4
IC Socket Industry Witnesses Growth of EMS Companies II-4
Connector Industry II-4

2. PRODUCT OVERVIEW II-6
Introduction II-6
IC Sockets II-6
Performance Specifications II-6
Components of IC Socket II-7
Contact Designs Used in IC Sockets II-7
Types of IC Sockets II-7
Dual In-Line Memory Module (DIMM) Sockets II-8
Production Sockets II-8
Plastic Leaded Chip Carrier (PLCC) Socket II-8
Pin Grid Array (PGA) Socket II-9
Land Grid Array (LGA) Socket II-9
Test/Burn-in Sockets II-9
Other Sockets II-9
Dual In-Line Package (DIP) Socket II-9
Ball Grid Array (BGA) Socket II-9
Specialty Socket II-10
Interposer II-10
Advantages of IC Sockets II-10
Cost Savings II-11
Component Repair and Replacement II-11
Avoidance of Direct Soldering II-11
Flexibility in Assembly, IC Design, and Supply-Chain Management II-11
Component Exchange and Upgrade II-12
Component Burn-in and Test II-12
Disadvantages of IC Sockets II-13
End-Use Applications of IC Sockets II-13
Services and Products Associated with IC Sockets II-13
IC Sockets and Interconnect Components II-13
IC Package Converters and Adapters II-14
PCB Pins and Receptacles II-14
IC Pin Probes II-14

3. PRODUCT INTRODUCTIONS/INNOVATIONS II-15
Ironwood Electronics Launches a Range of New BGA Sockets II-15
Ironwood Electronics Introduces New QFN Socket II-16
Ironwood Electronics Launches High Performance BGA Socket II-16
Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range II-16
Plastronics Launches ES Socket System II-17
Thermaltake Unveils New CPU Cooler with Multiple Sockets II-17
Fujitsu Launches SMT DDR2 DIMM Socket II-18
Emulation Unveils Novel Socket System II-18
MIPS Technologies Unveils Novel Instruction Set and Cores II-19
Aries Electronics Launches CSP/BallNest Hybrid Socket II-19
MiniATE Systems Introduces ET 2300 Socket System II-19
Sullins Connector Solutions Extends Insulation Displacement
Connector Portfolio II-20
Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series II-20
Intel Launches Nehalem Based Processors and LGA Sockets II-21
Quadrant Rolls Out Semitron® MDS 100 II-21
Atmel Introduces New Expansion, Routing and Socket Cards II-21
Tyco Electronics Introduces New Range of RFI Filter Connectors II-22

4. RECENT INDUSTRY ACTIVITY II-23
Molex Sockets Earn Intel® Validation II-23
Semiconductor Test Group Merges with Multitest elektronische
Systeme and Harbor Electronics II-23
KLA Tencor Acquires ICOS Vision Systems II-23

5. FOCUS ON SELECT GLOBAL PLAYERS II-25
3M Company (US) II-25
Aries Electronics, Inc. (US) II-25
Chupond Precision Co., Ltd. (Taiwan) II-26
Enplas Corporation (Japan) II-26
FCI (France) II-26
Foxconn Technology Group (Taiwan) II-26
Johnstech International Corporation (US) II-27
Loranger International Corporation (US) II-27
Mill-Max Mfg. Corporation (US) II-27
Molex, Inc. (US) II-27
Plastronics Socket Company, Inc. (US) II-28
Sensata Technologies B.V. (The Netherlands) II-28
Tyco Electronics Ltd. (Switzerland) II-29
Win Way Technology Co., Ltd. (Taiwan) II-29
Yamaichi Electronics Co., Ltd. (Japan) II-29

6. GLOBAL MARKET PERSPECTIVE II-30
Table 1: World Recent Past, Current and Future Analysis for IC
Sockets by Geographic Region - North America, Japan, Europe,
Asia-Pacific and Rest of World Markets Independently Analyzed
with Annual Sales in US$ Million for Years 2006 through 2015
(includes corresponding Graph/Chart) II-30

Table 2: World 10-Year Perspective for IC Sockets by
Geographic Region - Percentage Breakdown of Dollar Sales for
North America, Japan, Europe, Asia-Pacific and Rest of World
Markets for Years 2006, 2009 and 2015 (includes corresponding
Graph/Chart) II-31

Table 3: World Recent Past, Current & Future Analysis for IC
Sockets by Product Segment - Dual In-Line Memory Module
Sockets, Production Sockets, Test/Burn-in Sockets, and Other
IC Socket Markets Independently Analyzed with Annual Sales in
US$ Million for Years 2006 through 2015 (includes
corresponding Graph/Chart) II-32

Table 4: World 10-Year Perspective for IC Sockets by Product
Segment - Percentage Breakdown of Dollar Sales for Dual
In-Line Memory Module Sockets, Production Sockets,
Test/Burn-in Sockets, and Other IC Socket Markets for Years
2006, 2009 & 2015 (includes corresponding Graph/Chart) II-33

III. MARKET

1. NORTH AMERICA III-1
A.Market Analysis III-1
Current and Future Analysis III-1
Impact of Recession on IC Sockets Market III-1
Product Launches/Developments III-1
Strategic Corporate Developments III-7
Select US Players III-8
B.Market Analytics III-11
Table 5: North American Recent Past, Current and Future
Analysis for IC Sockets with Annual Sales Figures in US$
Million for Years 2006 through 2015 (includes corresponding
Graph/Chart) III-11

2. JAPAN III-12
A.Market Analysis III-12
Current and Future Analysis III-12
Select Players III-12
B.Market Analytics III-13
Table 6: Japanese Recent Past, Current and Future Analysis
for IC Sockets with Annual Sales Figures in US$ Million for
Years 2006 through 2015 (includes corresponding Graph/Chart) III-13

3. EUROPE III-14
A.Market Analysis III-14
Current and Future Analysis III-14
Product Launch III-14
Strategic Corporate Development III-14
Select Players III-15
B.Market Analytics III-17
Table 7: European Recent Past, Current and Future Analysis
for IC Sockets with Annual Sales Figures in US$ Million for
Years 2006 through 2015 (includes corresponding Graph/Chart) III-17

4. ASIA-PACIFIC III-18
A.Market Analysis III-18
Current and Future Analysis III-18
Product Launches/Developments III-18
Select Players III-20
B.Market Analytics III-21
Table 8: Asia-Pacific Recent Past, Current and Future
Analysis for IC Sockets by Geographic Region - China and
Rest of Asia-Pacific Markets Independently Analyzed with
Annual Sales Figures in US$ Million for Years 2006 through
2015 (includes corresponding Graph/Chart) III-21

Table 9: Asia-Pacific 10-Year Perspective for IC Sockets by
Geographic Region - Percentage Breakdown of Dollar Sales for
China and Rest of Asia-Pacific Markets for Years 2006, 2009
and 2015 III-21

5. REST OF WORLD III-22
Market Analysis III-22
Table 10: Rest of World Recent Past, Current and Future
Analysis for IC Sockets with Annual Sales Figures in US$
Million for Years 2006 through 2015 (includes corresponding
Graph/Chart) III-22

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 44 (including Divisions/Subsidiaries - 46)
  • --------
Region/Country Players
  • --------
The United States 16
Japan 5
Europe 7
France 1
Germany 2
The United Kingdom 1
Rest of Europe 3
Asia-Pacific (Excluding Japan) 18
  • --------
Note: Product cover images may vary from those shown
3 of 4

Loading
LOADING...

4 of 4
  • 3M Company (US)
  • Aries Electronics, Inc. (US)
  • Chupond Precision Co., Ltd. (Taiwan)
  • Enplas Corporation (Japan)
  • FCI (France)
  • Foxconn Technology Group (Taiwan)
  • Johnstech International Corporation (US)
  • Loranger International Corporation (US)
  • Mill-Max Mfg. Corporation (US)
  • Molex, Inc. (US)
  • Plastronics Socket Company, Inc. (US)
  • Sensata Technologies B.V. (The Netherlands)
  • Tyco Electronics Ltd. (Switzerland)
  • Win Way Technology Co., Ltd. (Taiwan)
  • Yamaichi Electronics Co., Ltd. (Japan)
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
Adroll
adroll