The integrated circuit (ic) sockets market size is expected to see strong growth in the next few years. It will grow to $2.85 billion in 2030 at a compound annual growth rate (CAGR) of 8%. The growth in the forecast period can be attributed to growth of semiconductor testing requirements, increasing complexity of advanced ic packages, rising demand for high speed computing hardware, expansion of automotive and industrial electronics, adoption of AI and data center hardware. Major trends in the forecast period include growing demand for high density and fine pitch ic sockets, rising adoption of high speed and high frequency test sockets, increasing use of zif and low insertion force socket designs, expansion of ic sockets for advanced packaging and soc devices, growing focus on durability and thermal performance of sockets.
The increasing demand for consumer electronics is projected to drive significant growth in the integrated circuit (IC) sockets market. Consumer electronics include devices such as smartphones, tablets, laptops, and smart home products, which enhance user experience and accessibility. Integrated circuit (IC) sockets are essential for these devices as they provide secure and efficient connections for ICs, facilitating easy upgrades, repairs, and maintenance. This is crucial for maintaining optimal device performance and longevity. According to the Shanghai Municipal People's Government, consumer electronics retail sales in China are expected to grow by 4% to reach 2.2 trillion yuan (US$305 billion) in 2023, with growth projected to accelerate to 5% in 2024. The rising demand for consumer electronics is thus a key driver for the integrated circuit (IC) sockets market.
Major companies in the integrated circuit (IC) sockets market are focusing on developing advanced solutions, such as high-frequency BGA devices, to enhance signal integrity, reduce insertion loss, and support faster data transmission for advanced computing and telecommunications applications. High-frequency Ball Grid Array (BGA) devices are ICs packaged in the BGA format, optimized to operate efficiently at gigahertz (GHz) signal frequencies. For instance, in October 2025, Ironwood Electronics, a US-based electronic components supplier, launched a 4 GHz elastomer socket for BGA1440 packages with only -1 dB insertion loss. This socket complements existing GHz-class BGA sockets and enables reliable signal integrity testing for complex ICs in computing, telecommunications, and automotive sectors.
In January 2023, Smiths Interconnect Inc., a US-based manufacturer of advanced electronic components, acquired Plastronics Socket Partners LP, a US-based provider of high-reliability connectivity products. The terms of the acquisition were not disclosed, but it aims to strengthen Smiths Interconnect's position in the semiconductor test market by integrating advanced burn-in test socket technology. Plastronics Socket Partners LP specializes in integrated circuit (IC) sockets, contributing to Smiths Interconnect’s expansion in this field.
Major companies operating in the integrated circuit (ic) sockets market are Panasonic Corporation, 3M Company, Texas Instruments Incorporated, Kyocera Corporation, TE Connectivity Ltd., Amphenol Corporation, Omron Corporation, Sensata Technologies B.V., Molex Inc., Würth Elektronik eiSos GmbH & Co. KG, WAGO Kontakttechnik GmbH & Co. KG, Hirose Electric Co. Ltd., Samtec Inc., Smith’s Interconnect Inc., Winchester Electronics Corporation, ept GmbH, Enplas Corporation, Yamaichi Electronics Co. Ltd., Mill-Max Mfg. Corporation, Johnstech International Corporation, Johanson Technology Inc., Harwin PLC, NorComp Inc., Chupond Precision Co. Ltd., CnC Tech LLC, Aries Electronics.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs on precision connectors, metal contacts, plastic housings, and semiconductor manufacturing equipment have increased production costs in the integrated circuit sockets market. Test sockets, high density sockets, and advanced packaging sockets are most affected, particularly in asia pacific and north america where cross border component sourcing is common. These tariffs have led to pricing pressure and longer lead times for socket manufacturers. However, they are also encouraging localized manufacturing, supplier diversification, and innovation in cost optimized and high performance socket designs.
The integrated circuit (IC) sockets market research report is one of a series of new reports that provides integrated circuit (IC) sockets market statistics, including integrated circuit (IC) sockets industry global market size, regional shares, competitors with integrated circuit (IC) sockets market share, detailed integrated circuit (IC) sockets market segments, market trends and opportunities, and any further data you may need to thrive in the integrated circuit (IC) sockets industry. This integrated circuit (IC) sockets market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.
Integrated circuit (IC) sockets are hardware components used to connect integrated circuits to a printed circuit board (PCB), allowing for easy replacement or upgrading of the IC without the need for soldering. These sockets ensure a secure electrical connection and facilitate the swapping of ICs in electronic devices.
The main types of IC sockets include dual-in-line memory module (DIMM) sockets, production sockets, test or burn-in sockets, through-hole sockets, surface-mount sockets, zero-insertion force (ZIF) sockets, dual-row sockets, and others. DIMM sockets, for example, are connectors on a motherboard that interface with DIMM memory modules, enabling data transfer between the system's memory and the CPU. IC sockets are used in various applications such as memory, CMOS image sensors, high voltage, RF, system on chip (SOC), CPU, GPU, and other non-memory areas. These sockets serve multiple industry sectors, including home appliances, automotive and transportation, aerospace and defense, telecommunications, and industrial applications.Asia-Pacific was the largest region in the integrated circuit (IC) sockets market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the integrated circuit (ic) sockets market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the integrated circuit (ic) sockets market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The integrated circuit (IC) sockets market consists of sales of dual in-line package sockets, single in-line package sockets, plastic led chip carrier sockets, ball grid array sockets, and small outline integrated circuit sockets. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Integrated Circuit (IC) Sockets Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses integrated circuit (ic) sockets market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for integrated circuit (ic) sockets? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The integrated circuit (ic) sockets market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Type: Dual In-Line Memory Module Sockets (DIMM); Production Sockets; Test Or Burn-In Sockets; Through-Hole Sockets; Surface-Mount Sockets; Zero Insertion Force (ZIF) Sockets; Dual-Row Sockets; Other Types2) By Application: Memory; Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensors; High Voltage; Radio Frequency (RF); System On Chip (SOC); Central Processing Unit (CPU); Graphics Processing Unit (GPU); Other Non-Memory
3) By Industry Vertical: Home Appliances; Cars And Transportation; Aerospace And Defense; Telecom; Industrial
Subsegments:
1) By Dual In-Line Memory Module Sockets (DIMM): Standard Dimm Sockets; Registered Dimm (RDIMM) Sockets; Unbuffered Dimm (UDIMM) Sockets; Load-Reduced Dimm (LRDIMM) Sockets2) By Production Sockets: Sockets For Surface-Mounted Ics; Sockets For Through-Hole Ics; Custom Production Sockets
3) By Test Or Burn-In Sockets: Test Sockets For Prototype Ics; Burn-In Sockets For Reliability Testing; Low-Force Test Sockets; High-Performance Test Sockets
4) By Through-hole Sockets: Single-Row Through-Hole Sockets; Dual-Row Through-Hole Sockets; High-Density Through-Hole Sockets
5) By Surface-Mount Sockets: Standard Surface-Mount Sockets; Low-Profile Surface-Mount Sockets; High-Density Surface-Mount Sockets
6) By Zero Insertion Force (ZIf) Sockets: Standard Zif Sockets; Low-Profile Zif Sockets; High-Speed Zif Sockets
7) By Dual-Row Sockets: Dual-Row Ic Sockets For High-Density Applications; Dual-Row Sockets For Through-Hole Components; Dual-Row Sockets For Surface-Mounted Components
8) By Other Types: Flip-Chip Sockets; Bga (Ball Grid Array) Sockets; Pga (Pin Grid Array) Sockets; Chip-On-Board (Cob) Sockets
Companies Mentioned: Panasonic Corporation; 3M Company; Texas Instruments Incorporated; Kyocera Corporation; TE Connectivity Ltd.; Amphenol Corporation; Omron Corporation; Sensata Technologies B.V.; Molex Inc.; Würth Elektronik eiSos GmbH & Co. KG; WAGO Kontakttechnik GmbH & Co. KG; Hirose Electric Co. Ltd.; Samtec Inc.; Smith’s Interconnect Inc.; Winchester Electronics Corporation; ept GmbH; Enplas Corporation; Yamaichi Electronics Co. Ltd.; Mill-Max Mfg. Corporation; Johnstech International Corporation; Johanson Technology Inc.; Harwin PLC; NorComp Inc.; Chupond Precision Co. Ltd.; CnC Tech LLC; Aries Electronics
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Integrated Circuit (IC) Sockets market report include:- Panasonic Corporation
- 3M Company
- Texas Instruments Incorporated
- Kyocera Corporation
- TE Connectivity Ltd.
- Amphenol Corporation
- Omron Corporation
- Sensata Technologies B.V.
- Molex Inc.
- Würth Elektronik eiSos GmbH & Co. KG
- WAGO Kontakttechnik GmbH & Co. KG
- Hirose Electric Co. Ltd.
- Samtec Inc.
- Smith’s Interconnect Inc.
- Winchester Electronics Corporation
- ept GmbH
- Enplas Corporation
- Yamaichi Electronics Co. Ltd.
- Mill-Max Mfg. Corporation
- Johnstech International Corporation
- Johanson Technology Inc.
- Harwin PLC
- NorComp Inc.
- Chupond Precision Co. Ltd.
- CnC Tech LLC
- Aries Electronics
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 2.1 Billion |
| Forecasted Market Value ( USD | $ 2.85 Billion |
| Compound Annual Growth Rate | 8.0% |
| Regions Covered | Global |
| No. of Companies Mentioned | 27 |


