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System-in-Package (SiP) Technology - Market Analysis, Trends, and Forecasts

  • ID: 2255359
  • Report
  • February 2020
  • Region: Global
  • 359 Pages
  • Global Industry Analysts, Inc
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System-in-Package (SiP) Technology market worldwide is projected to grow by US$13.5 Billion, driven by a compounded growth of 7.7%. 2-D IC Packaging, one of the segments analyzed and sized in this study, displays the potential to grow at over 7.4%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$18.1 Billion by the year 2025, 2-D IC Packaging will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 6.5% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$466.9 Million to the region's size and clout in the next 5 to 6 years. Over US$405.8 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, 2-D IC Packaging will reach a market size of US$908.2 Million by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 11.4% over the next couple of years and add approximately US$3.7 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific, Latin America and the Middle East. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include, among others,
  • Amkor Technology Inc.
  • ASE Group
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • ShunSin Technology (Zhongshan) Limited
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.
Note: Product cover images may vary from those shown
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I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology

Recent Market Activity

Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market

Developing Countries Offer Growth Prospects

Flip Chip Type of Interconnection Technology Leads SiP Technology Market

Consumer Electronics Sector Fuels Revenue Growth in SiP Market

Portable Electronic Devices Stir Demand for Flat Packaging

2.5D IC Packaging Technology Dominates SiP Market

Challenges Confronting the SiP Market

Global Competitor Market Shares

System-in-Package (SiP) Technology Competitor Market Share Scenario Worldwide (in %): 2020 & 2029

2. FOCUS ON SELECT PLAYERS

Amkor Technology, Inc.

ASE Group

ChipMOS Technologies Inc.

Fujitsu Limited

GS Nanotech

Insight SiP

Intel Corporation

Jiangsu Changjiang Electronics Technology Co. Ltd.

Kulicke & Soffa Pte Ltd.

Nanium S.A.

O.C.E. Technology Ltd.

Powertech Technologies, Inc.

Renesas Electronics Corporation

Samsung Electronics Co., Ltd.

ShunSin Technology (Zhongshan) Limited

Si2 Microsystems Private Limited

Siliconware Precision Industries Co. Ltd. (SPIL)

STATS ChipPAC Ltd.

Unimicron Corporation

3. MARKET TRENDS & DRIVERS

Importance of SiP Technology in Electronics

Rising Demand for High Performance and Compact Consumer Electronics Drive Growth

List of Select SiP Solutions for Connected Devices

Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP

Growing Sales of Smartphones Bode Well for SiP Market

Growing Demand for Tablet PCs - A Key Growth Driver

Applications in Set Top Boxes Boosts Demand for SiP Technology

Computing Devices - A Key Growth Driver

IoT Opens New Growth Avenues for SiP

TSVs for Die-to-Die/Die-to-Package Substrate Communication

Advanced Nodes Demand Innovative Package Technologies

PCB Considerations Vital for Using SiP in IoT Systems

WLCSP for Compact Form Factors

Trend Towards Smart Homes Offers Growth Opportunities

Miniaturization of Electronics - A Major Growth Driver for SiP

Need for Compact and High Speed Performance Products Spurs Market Growth

Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market

SMBs Spur the Adoption of SiP

Expanding Applications in Non- Battery Operated Systems Spur Market Growth

SoC Design Complexities Bring Focus onto SiP

Combined SoC and SiP Technology Gains Increased Demand

Need to Reduce Cost Per Function of ICs Boosts Market Demand

Advanced SiP Packaging Transforming System-Level Integration Landscape

Wafer-Based Advanced SiP

Laminate-based Advanced SiP

SiP Technology to Impact Fan-In Packaging Platform

Foundries Focus on Offering Turnkey Services with System-in-Package

Vendors Offer Advanced Capabilities for SiP Design

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

Market Facts & Figures

US System-in-Package (SiP) Technology Market Share (in %) by Company: 2020 & 2025

Market Analysts

CANADA

JAPAN

CHINA

EUROPE

Market Facts & Figures

European System-in-Package (SiP) Technology Market: Competitor Market Share Scenario (in %) for 2020 & 2025

Market Analysts

FRANCE

GERMANY

ITALY

UNITED KINGDOM

SPAIN

RUSSIA

REST OF EUROPE

ASIA-PACIFIC

AUSTRALIA

INDIA

SOUTH KOREA

REST OF ASIA-PACIFIC

LATIN AMERICA

ARGENTINA

BRAZIL

MEXICO

REST OF LATIN AMERICA

MIDDLE EAST

IRAN

ISRAEL

SAUDI ARABIA

UNITED ARAB EMIRATES

REST OF MIDDLE EAST

AFRICA

IV. COMPETITION

Total Companies Profiled: 51

Note: Product cover images may vary from those shown
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