Representing the developed world, the United States will maintain a 6.5% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$466.9 Million to the region's size and clout in the next 5 to 6 years. Over US$405.8 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, 2-D IC Packaging will reach a market size of US$908.2 Million by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 11.4% over the next couple of years and add approximately US$3.7 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders. Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific, Latin America and the Middle East. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.
Competitors identified in this market include, among others,
- Amkor Technology Inc.
- ASE Group
- ChipMOS Technologies Inc.
- Fujitsu Limited
- GS Nanotech
- Insight SiP
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Powertech Technologies Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co. Ltd.
- ShunSin Technology (Zhongshan) Limited
- Si2 Microsystems Private Limited
- STATS ChipPAC Ltd.
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
Recent Market Activity
Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
Developing Countries Offer Growth Prospects
Flip Chip Type of Interconnection Technology Leads SiP Technology Market
Consumer Electronics Sector Fuels Revenue Growth in SiP Market
Portable Electronic Devices Stir Demand for Flat Packaging
2.5D IC Packaging Technology Dominates SiP Market
Challenges Confronting the SiP Market
Global Competitor Market Shares
System-in-Package (SiP) Technology Competitor Market Share Scenario Worldwide (in %): 2020 & 2029
2. FOCUS ON SELECT PLAYERS
Amkor Technology, Inc.
ChipMOS Technologies Inc.
Jiangsu Changjiang Electronics Technology Co. Ltd.
Kulicke & Soffa Pte Ltd.
O.C.E. Technology Ltd.
Powertech Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
ShunSin Technology (Zhongshan) Limited
Si2 Microsystems Private Limited
Siliconware Precision Industries Co. Ltd. (SPIL)
STATS ChipPAC Ltd.
3. MARKET TRENDS & DRIVERS
Importance of SiP Technology in Electronics
Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
List of Select SiP Solutions for Connected Devices
Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
Growing Sales of Smartphones Bode Well for SiP Market
Growing Demand for Tablet PCs - A Key Growth Driver
Applications in Set Top Boxes Boosts Demand for SiP Technology
Computing Devices - A Key Growth Driver
IoT Opens New Growth Avenues for SiP
TSVs for Die-to-Die/Die-to-Package Substrate Communication
Advanced Nodes Demand Innovative Package Technologies
PCB Considerations Vital for Using SiP in IoT Systems
WLCSP for Compact Form Factors
Trend Towards Smart Homes Offers Growth Opportunities
Miniaturization of Electronics - A Major Growth Driver for SiP
Need for Compact and High Speed Performance Products Spurs Market Growth
Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
SMBs Spur the Adoption of SiP
Expanding Applications in Non- Battery Operated Systems Spur Market Growth
SoC Design Complexities Bring Focus onto SiP
Combined SoC and SiP Technology Gains Increased Demand
Need to Reduce Cost Per Function of ICs Boosts Market Demand
Advanced SiP Packaging Transforming System-Level Integration Landscape
Wafer-Based Advanced SiP
Laminate-based Advanced SiP
SiP Technology to Impact Fan-In Packaging Platform
Foundries Focus on Offering Turnkey Services with System-in-Package
Vendors Offer Advanced Capabilities for SiP Design
4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
GEOGRAPHIC MARKET ANALYSIS
Market Facts & Figures
US System-in-Package (SiP) Technology Market Share (in %) by Company: 2020 & 2025
Market Facts & Figures
European System-in-Package (SiP) Technology Market: Competitor Market Share Scenario (in %) for 2020 & 2025
REST OF EUROPE
REST OF ASIA-PACIFIC
REST OF LATIN AMERICA
UNITED ARAB EMIRATES
REST OF MIDDLE EAST
Total Companies Profiled: 51