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Global Radiation Hardened & Radiation Tolerant Electronics Market 2020-2025

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    Report

  • 192 Pages
  • October 2020
  • Region: Global
  • IndustryARC
  • ID: 3063583
Description Jump to:
Radiation Hardened Electronic Devices and Components involve the production of electronic components by hardening through radiation. Insulating substrates such as SOI (Silicon on Insulators), SOS (Sapphire) are used primarily. The hardened components have a special purpose of withstanding otherwise damaging radiations (radiation immunity) particularly a serious problem in the design of components for artificial satellites, spacecraft, military aircraft, nuclear power stations, and nuclear weapons and other computing devices. The market is affected by the high operating costs and low volume nature of the space market. But defense and aerospace are the main driving force that has been holding the industry from collapsing over the past 10 years.

The market has been segmented by geography as North America, Europe, Asia, and the Rest of the World (ROW). Market size and forecast is provided for each of these regions. A detailed qualitative analysis of the factors responsible for driving and restraining the growth of the Radiation Hardened components is discussed in the report. Market shares of the key players for 2020-25 are provided.

Sample Companies Profiled in this Report are:

  • Honeywell Electronics,
  • BAE Systems,
  • ST Microelectronics and others.
  • 10+

Table of Contents

1. Radiation Hardened Electronic Devices and Components Market - Overview
1.1. Definitions and Scope
2. Radiation Hardened Electronic Devices and Components Market - Executive summary
2.1. Market Revenue, Market Size and Key Trends by Company
2.2. Key Trends by type of Application
2.3. Key Trends segmented by Geography
3. Radiation Hardened Electronic Devices and Components Market
3.1. Comparative analysis
3.1.1. Product Benchmarking - Top 10 companies
3.1.2. Top 5 Financials Analysis
3.1.3. Market Value split by Top 10 companies
3.1.4. Patent Analysis - Top 10 companies
3.1.5. Pricing Analysis
4. Radiation Hardened Electronic Devices and Components Market Forces
4.1. Drivers
4.2. Constraints
4.3. Challenges
4.4. Porters five force model
4.4.1. Bargaining power of suppliers
4.4.2. Bargaining powers of customers
4.4.3. Threat of new entrants
4.4.4. Rivalry among existing players
4.4.5. Threat of substitutes
5. Radiation Hardened Electronic Devices and Components Market -Strategic analysis
5.1. Value chain analysis
5.2. Opportunities analysis
5.3. Product life cycle
5.4. Suppliers and distributors Market Share
6. Radiation Hardened Electronic Devices and Components Market - By Products (Market Size -$Million / $Billion)
6.1. Market Size and Market Share Analysis
6.2. Application Revenue and Trend Research
6.3. Product Segment Analysis
6.3.1. Introduction
6.3.2. Analog And Mixed Signal/ Digital Electronic Devices
6.3.2.1. Rad-Hard A/D And D/A Converters
6.3.2.2. Rad-Hard Multiplexers
6.3.3. Discrete Semiconductors
6.3.4. Optoelectronics
6.3.5. Power Management
6.3.6. Sensors
6.3.7. Memory
6.3.8. Microprocessors And Microcontrollers
6.3.9. Fpgas
6.3.10. Asics
6.3.11. Others
6.3.11.1. Radiation Hardened Flip Flop
6.3.11.2. Radiation Hardened Cmos Structure Using An Implanted P Guard Structure
7. Radiation Hardened Electronic Devices and Components Market - By Materials (Market Size -$Million / $Billion)
7.1. Silicon.
7.2. Silicon Carbide
7.3. Gallium Nitride
7.4. Hydrogenated Amorphous Silicon
8. Radiation Hardened Electronic Devices and Components Market - By Product-Type (Market Size -$Million / $Billion)
8.1. Custom-Made
8.2. Commercial-Off-The-Shelf (Cots)
9. Radiation Hardened Electronic Devices and Components - By End Use Industry(Market Size -$Million / $Billion)
9.1. Segment type Size and Market Share Analysis
9.2. Application Revenue and Trends by type of Application
9.3. Application Segment Analysis by Type
9.3.1. Introduction
9.3.2. Aerospace
9.3.3. Military
9.3.4. Space
9.3.5. Nuclear
9.3.6. Medical
9.3.7. Consumer Electronics
9.3.8. Others
10. Radiation Hardened Electronic Devices and Components - By Geography (Market Size -$Million / $Billion)
10.1. Radiation Hardened Electronic Devices and Components Market - North America Segment Research
10.2. North America Market Research (Million / $Billion)
10.2.1. Segment type Size and Market Size Analysis
10.2.2. Revenue and Trends
10.2.3. Application Revenue and Trends by type of Application
10.2.4. Company Revenue and Product Analysis
10.2.5. North America Product type and Application Market Size
10.2.5.1. U.S.
10.2.5.2. Canada
10.2.5.3. Mexico
10.2.5.4. Rest of North America
10.3. Radiation Hardened Electronic Devices and Components - South America Segment Research
10.4. South America Market Research (Market Size -$Million / $Billion)
10.4.1. Segment type Size and Market Size Analysis
10.4.2. Revenue and Trends
10.4.3. Application Revenue and Trends by type of Application
10.4.4. Company Revenue and Product Analysis
10.4.5. South America Product type and Application Market Size
10.4.5.1. Brazil
10.4.5.2. Venezuela
10.4.5.3. Argentina
10.4.5.4. Ecuador
10.4.5.5. Peru
10.4.5.6. Colombia
10.4.5.7. Costa Rica
10.4.5.8. Rest of South America
10.5. Radiation Hardened Electronic Devices and Components - Europe Segment Research
10.6. Europe Market Research (Market Size -$Million / $Billion)
10.6.1. Segment type Size and Market Size Analysis
10.6.2. Revenue and Trends
10.6.3. Application Revenue and Trends by type of Application
10.6.4. Company Revenue and Product Analysis
10.6.5. Europe Segment Product type and Application Market Size
10.6.5.1. U.K
10.6.5.2. Germany
10.6.5.3. Italy
10.6.5.4. France
10.6.5.5. Netherlands
10.6.5.6. Belgium
10.6.5.7. Spain
10.6.5.8. Denmark
10.6.5.9. Rest of Europe
10.7. Radiation Hardened Electronic Devices and Components - APAC Segment Research
10.8. APAC Market Research (Market Size -$Million / $Billion)
10.8.1. Segment type Size and Market Size Analysis
10.8.2. Revenue and Trends
10.8.3. Application Revenue and Trends by type of Application
10.8.4. Company Revenue and Product Analysis
10.8.5. APAC Segment - Product type and Application Market Size
10.8.5.1. China
10.8.5.2. Australia
10.8.5.3. Japan
10.8.5.4. South Korea
10.8.5.5. India
10.8.5.6. Taiwan
10.8.5.7. Malaysia
11. Radiation Hardened Electronic Devices and Components Market - Entropy
11.1. New product launches
11.2. M&A's, collaborations, JVs and partnerships
12. Radiation Hardened Electronic Devices and Components Market Company Analysis
12.1. Market Share, Company Revenue, Products, M&A, Developments
12.2. Honeywell Electronics
12.3. BAE Systems
12.4. ST Microelectronics and others
12.5. Company 4
12.6. Company 5
12.7. Company 6
12.8. Company 7
12.9. Company 8
12.10. Company 9
12.11. Company 10 and more
*Financials would be provided on a best efforts basis for private companies
13. Radiation Hardened Electronic Devices and Components Market -Appendix
13.1. Abbreviations
13.2. Sources

Methodology

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