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Advanced Electronic Packaging - Global Strategic Business Report

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    Report

  • 78 Pages
  • April 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 338485

Global Advanced Electronic Packaging Market to Reach $13.2 Billion by 2030

The global market for Advanced Electronic Packaging estimated at US$7.2 Billion in the year 2023, is projected to reach a revised size of US$13.2 Billion by 2030, growing at a CAGR of 7.8% over the analysis period 2023-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is expected to record 7.4% CAGR and reach US$7.5 Billion by the end of the analysis period. Growth in the Through Silicon Via (TSV) Packaging segment is estimated at 8.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.9 Billion, While China is Forecast to Grow at 10.3% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$1.9 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$3 Billion by the year 2030 trailing a CAGR of 10.3% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.1% and 6.3% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 6% CAGR.

Report Features

  • Full access to influencer engagement stats
  • Access to digital archives & research platform. The proprietary platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. The state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
  • Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
  • Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
  • Complimentary report updates for one year
  • Competitor coverage with global market shares of major players
  • Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
  • Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 38 Featured) -

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
  • Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 2: World 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2023 & 2030
  • Table 3: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 4: World 8-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
  • Table 5: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 6: World 8-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
  • Table 7: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
III. MARKET ANALYSIS
UNITED STATES
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • Table 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 9: USA 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
CANADA
  • Table 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 11: Canada 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
JAPAN
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
  • Table 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 13: Japan 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
CHINA
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
  • Table 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 15: China 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
EUROPE
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • Table 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 17: Europe 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2023 & 2030
  • Table 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 19: Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
FRANCE
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
  • Table 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 21: France 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
GERMANY
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
  • Table 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 23: Germany 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
ITALY
  • Table 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 25: Italy 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
UNITED KINGDOM
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
  • Table 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 27: UK 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
SPAIN
  • Table 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 29: Spain 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
RUSSIA
  • Table 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 31: Russia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
REST OF EUROPE
  • Table 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 33: Rest of Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
ASIA-PACIFIC
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
  • Table 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 35: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2023 & 2030
  • Table 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 37: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
AUSTRALIA
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)
  • Table 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 39: Australia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
INDIA
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)
  • Table 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 41: India 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
SOUTH KOREA
  • Table 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 43: South Korea 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
REST OF ASIA-PACIFIC
  • Table 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 45: Rest of Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
LATIN AMERICA
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)
  • Table 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 47: Latin America 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2023 & 2030
  • Table 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 49: Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
ARGENTINA
  • Table 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 51: Argentina 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
BRAZIL
  • Table 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 53: Brazil 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
MEXICO
  • Table 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 55: Mexico 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
REST OF LATIN AMERICA
  • Table 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 57: Rest of Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
MIDDLE EAST
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)
  • Table 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 59: Middle East 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2023 & 2030
  • Table 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 61: Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
IRAN
  • Table 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 63: Iran 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
ISRAEL
  • Table 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 65: Israel 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
SAUDI ARABIA
  • Table 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 67: Saudi Arabia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
UNITED ARAB EMIRATES
  • Table 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 69: UAE 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
REST OF MIDDLE EAST
  • Table 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 71: Rest of Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
AFRICA
  • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)
  • Table 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 73: Africa 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

Table Information