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Thermal Interface Materials Market: By Type; By Application & By Region - Forecast 2016-2021

  • ID: 3973676
  • Report
  • 142 pages
  • IndustryARC
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Thermal interface materials, also shortened as TIMs, consist of any material which is inserted between two parts in order to enhance the thermal coupling between these two components. Majority of those applications are related to the heat dissipation and the TIMs are inserted between the heat producing device (heat source) and the heat dissipation device (heat sink). Globally increasing demand for the smaller and portable electronic devices is expected to remain as one of the major growth factor for the thermal interface materials during the period of study.

Geographically, Asia-Pacific dominates the thermal interface materials market driven by higher applications into wide range of applications into huge industrial base in the region. Asia-Pacific was followed by North America and Europe as second and third largest markets for the thermal interface materials market. Asia Pacific is projected to have the fastest growth, owing to rapidly increasing applications into large and expanding industrial base in the region, especially in developing nations such as China and India in this region.

This report identifies the global thermal interface materials market size in for the year 2014-2016, and forecast of the same for year 2021. It also highlights the market drivers, restraints, growth indicators, challenges, and other key aspects with respect to the thermal interface materials market.

This report segments the thermal interface materials market on the basis of type, application and regional market as follows:

Thermal Interface Materials Market research report is classified on the basis of types. Some of the major types covered in this report are as follows: Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, and Phase Change Materials
Thermal Interface Materials Market research report is classified on the basis of applications. Some of the major applications covered in this report are as follows: Computers, Telecom, Medical Devices, Automotive, Electronics and Others
This report has been further segmented into major regions, which includes detailed analysis of each region such as: North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW) covering all the major country level markets in each of the region

This report identifies all the major companies operating in the thermal interface materials market. Some of the major companies’ profiles in detail are as follows:

3M Company
Henkel AG & Co. KGAA
Parker Hannifin Corporation
DOW Corning Corporation
Laird Technologies, Inc.
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1. Thermal Interface Materials Market – Overview

2. Executive Summary

3. Thermal Interface Materials Market Landscape
3.1. Market Share Analysis
3.2. Comparative Analysis
3.3. Product Benchmarking
3.4. End User Profiling
3.5. Top 5 Financials Analysis

4. Thermal Interface Materials Market– Forces
4.1. Drivers
4.1.1. Increasing Demand for Miniaturization of Electronic Devices
4.1.2. Growing LED Market to Drive the Demand for Thermal Interface Materials
4.2. Restraints
4.3. Opportunities
4.4. Challenges
4.5. Porter’s Five Forces Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Degree of Competition

5. Thermal Interface Materials Market– Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.3. Opportunities Analysis
5.4. Product/Market Life Cycle Analysis
5.5. Suppliers and Distributors

6. Thermal Interface Materials Market, By Type
6.1. Greases & adhesives
6.2. Tapes & Films
6.3. Gap Fillers
6.4. Metal-Based TIMs
6.5. Phase Change Materials
6.6. Others

7. Thermal Interface Materials Market, By Application
7.1. Computers
7.2. Telecom
7.3. Medical Devices
7.4. Automotive
7.5. Electronics
7.6. Others

8. Thermal Interface Materials Market, By Geography
8.1. Europe
8.1.1. Germany
8.1.2. France
8.1.3. Italy
8.1.4. Spain
8.1.5. Russia
8.1.6. U.K.
8.1.7. Rest of Europe
8.2. Asia Pacific
8.2.1. China
8.2.2. India
8.2.3. Japan
8.2.4. South Korea
8.2.5. Rest of Asia-Pacific
8.3. North America
8.3.1. U.S.
8.3.2. Canada
8.3.3. Mexico
8.4. Rest of the World (RoW)
8.4.1. Brazil
8.4.2. Rest of RoW

9. Thermal Interface Materials Market – Entropy
9.1. Expansion
9.2. Technological Developments
9.3. Merger & Acquisitions, and Joint Ventures
9.4. Supply- Contract

10. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)
10.1. 3M Company
10.2. Henkel AG & Co. KGAA
10.3. Parker Hannifin Corporation
10.4. DOW Corning Corporation
10.5. Laird Technologies, Inc.
10.6. Momentive Performance Materials Inc.
10.7. The Bergquist Company, Inc.
10.8. Indium Corporation
10.9. Wakefield-Vette, Inc.
10.10. Zalman Tech Co., Ltd.
*More than 40 Companies are profiled in this Research Report, Complete List available on Request*
"*Financials would be provided on a best efforts basis for private companies"

11. Appendix
11.1. Abbreviations
11.2. Sources
11.3. Research Methodology
11.4. Bibliography
11.5. Compilation of Expert Insights
11.6. Disclaimer
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